EVALUATION KIT AVAILABLE MAX3222E/MAX3232E/MAX3237E/ MAX3241E/MAX3246E 15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V, Up to 1Mbps, True RS-232 Transceivers General Description Next-Generation Device Features The MAX3222E/MAX3232E/MAX3237E/MAX3241E/ For Space-Constrained Applications MAX3246E +3.0V-powered EIA/TIA-232 and V.28/V.24 MAX3228E/MAX3229E: 15kV ESD-Protected, communications interface devices feature low power con- +2.5V to +5.5V, RS-232 Transceivers in UCSP sumption, high data-rate capabilities, and enhanced For Low-Voltage or Data Cable Applications electrostatic-discharge (ESD) protection. The enhanced MAX3380E/MAX3381E: +2.35V to +5.5V, 1A, ESD structure protects all transmitter outputs and 2Tx/2Rx, RS-232 Transceivers with 15kV receiver inputs to 15kV using IEC 1000-4-2 Air-Gap ESD-Protected I/O and Logic Pins Discharge, 8kV using IEC 1000-4-2 Contact Discharge (9kV for MAX3246E), and 15kV using the Human Body Applications Model. The logic and receiver I/O pins of the MAX3237E Battery-Powered Equipment are protected to the above standards, while the transmit- ter output pins are protected to 15kV using the Human Cell Phones Smart Phones Body Model. Cell-Phone Data Cables A proprietary low-dropout transmitter output stage delivers Notebook, Subnotebook, and Palmtop Computers true RS-232 performance from a +3.0V to +5.5V power supply, using an internal dual charge pump. The charge Printers pump requires only four small 0.1F capacitors for opera- xDSL Modems tion from a +3.3V supply. Each device guarantees opera- tion at data rates of 250kbps while maintaining RS-232 Ordering Information output levels. The MAX3237E guarantees operation at 250kbps in the normal operating mode and 1Mbps in the PART TEMP RANGE PIN-PACKAGE MegaBaud operating mode, while maintaining RS-232- 20 TQFN-EP** compliant output levels. MAX3222ECTP+ 0C to +70C (5mm x 5mm) The MAX3222E/MAX3232E have two receivers and two MAX3222ECUP+ 0C to +70C 20 TSSOP transmitters. The MAX3222E features a 1A shutdown MAX3222ECAP+ 0C to +70C 20 SSOP mode that reduces power consumption in battery-pow- ered portable systems. The MAX3222E receivers remain MAX3222ECWN+ 0C to +70C 18 Wide SO active in shutdown mode, allowing monitoring of external MAX3222ECPN+ 0C to +70C 18 Plastic DIP devices while consuming only 1A of supply current. The Functional Diagrams MAX3222EC/D+ 0C to +70C Dice* MAX3222E and MAX3232E are pin, package, and func- tionally compatible with the industry-standard MAX242 20 TQFN-EP** MAX3222EETP+ -40C to +85C and MAX232, respectively. (5mm x 5mm) The MAX3241E/MAX3246E are complete serial ports MAX3222EEUP/V+ -40C to +85C 20 TSSOP (three drivers/five receivers) designed for notebook and MAX3222EEUP+ -40C to +85C 20 TSSOP subnotebook computers. The MAX3237E (five drivers/ MAX3222EEAP+ -40C to +85C 20 SSOP three receivers) is ideal for peripheral applications that MAX3222EEWN+ -40C to +85C 18 Wide SO require fast data transfer. These devices feature a shut- MAX3222EEPN+ -40C to +85C 18 Plastic DIP down mode in which all receivers remain active, while consuming only 1A (MAX3241E/MAX3246E) or 10nA MAX3232ECAE+ 0C to +70C 16 SSOP (MAX3237E). MAX3232ECWE+ 0C to +70C 16 Wide SO The MAX3222E, MAX3232E, and MAX3241E are avail- MAX3232ECPE+ 0C to +70C 16 Plastic DIP able in space-saving SO, SSOP, TQFN and TSSOP pack- +Denotes a lead(Pb)-free/RoHS-compliant package. ages. The MAX3237E is offered in an SSOP package. *Dice are tested at T = +25C, DC parameters only. A The MAX3246E is offered in the ultra-small 6 x 6 UCSP **EP = Exposed pad. package. /V denotes an automotive qualified part. Ordering Information continued at end of data sheet. Pin Configurations appear at end of data sheet. Functional Diagrams continued at end of data sheet. Pin Configurations, Selector Guide, and Typical Operating MegaBaud and UCSP are trademarks of Maxim Integrated UCSP is a trademark of Maxim Integrated Products, Inc. Products, Inc. Circuits appear at end of data sheet. For pricing, delivery, and ordering information, please contact Maxim Direct 19-1298 Rev 12 12/10 at 1-888-629-4642, or visit Maxims website at www.maxim integrated.com. AVAILABLEMAX3222E/MAX3232E/MAX3237E/ MAX3241E/MAX3246E 15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V, Up to 1Mbps, True RS-232 Transceivers ABSOLUTE MAXIMUM RATINGS V to GND..............................................................-0.3V to +6V 20-Pin TQFN (derate 21.3mW/C above +70C) ........1702mW CC V+ to GND (Note 1)..................................................-0.3V to +7V 20-Pin TSSOP (derate 10.9mW/C above +70C) ........879mW V- to GND (Note 1) ...................................................+0.3V to -7V 20-Pin SSOP (derate 8.00mW/C above +70C) ..........640mW V+ + V- (Note 1).................................................................+13V 28-Pin SSOP (derate 9.52mW/C above +70C) ..........762mW Input Voltages 28-Pin Wide SO (derate 12.50mW/C above +70C).............1W T IN, EN, SHDN, MBAUD to GND ........................-0.3V to +6V 28-Pin TSSOP (derate 12.8mW/C above +70C) ......1026mW R IN to GND .....................................................................25V 32-Pin TQFN (derate 33.3mW/C above +70C)...........2666mW Output Voltages 6 x 6 UCSP (derate 12.6mW/C above +70C).............1010mW T OUT to GND...............................................................13.2V Operating Temperature Ranges R OUT, R OUTB (MAX3237E/MAX3241E)...-0.3V to (V + 0.3V) MAX32 EC ...................................................0C to +70C CC Short-Circuit Duration, T OUT to GND.......................Continuous MAX32 EE .................................................-40C to +85C Continuous Power Dissipation (T = +70C) Storage Temperature Range .............................-65C to +150C A 16-Pin SSOP (derate 7.14mW/C above +70C) ..........571mW Lead Temperature (soldering, 10s) .................................+300C 16-Pin TSSOP (derate 9.4mW/C above +70C) .......754.7mW Soldering Temperature (reflow) .......................................+260C 16-Pin TQFN (derate 20.8mW/C above +70C) .....1666.7mW Bump Reflow Temperature (Note 2) 16-Pin Wide SO (derate 9.52mW/C above +70C) .....762mW Infrared, 15s..................................................................+200C 18-Pin Wide SO (derate 9.52mW/C above +70C) .....762mW Vapor Phase, 20s..........................................................+215C 18-Pin PDIP (derate 11.11mW/C above +70C)..........889mW Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom- mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (V = +3V to +5.5V, C1C4 = 0.1F, T = T to T , unless otherwise noted. Typical values are at T = +25C.) (Notes 3, 4) CC A MIN MAX A PARAMETER CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS (V = +3.3V or +5V, T = +25C) CC A MAX3222E, MAX3232E, 0.3 1 MAX3241E, MAX3246E Supply Current SHDN = V , no load mA CC MAX3237E 0.5 2.0 SHDN = GND 1 10 A Shutdown Supply Current SHDN = R IN = GND, T IN = GND or V (MAX3237E) 10 300 nA CC LOGIC INPUTS Input Logic Low T IN, EN,SHDN, MBAUD 0.8 V V = +3.3V 2.0 CC Input Logic High T IN, EN,SHDN, MBAUD V V = +5.0V 2.4 CC Transmitter Input Hysteresis 0.5 V MAX3222E, MAX3232E, T IN, EN,SHDN 0.01 1 MAX3241E, MAX3246E Input Leakage Current A T IN, SHDN, MBAUD MAX3237E (Note 5) 9 18 2 Maxim Integrated