Click here for production status of specific part numbers. MAX3523 Low-Power DOCSIS 3.1 Programmable-Gain Amplifier General Description Benefits and Features The MAX3523 is a programmable gain amplifier Delivers +68dBmV Output Power While Meeting (PGA) designed to exceed the DOCSIS 3.1 upstream DOCSIS 3.1 Requirements transmit requirements. The PGA meets the DOCSIS 3.1 Covers 5MHz204MHz Output Bandwidth spurious limits while transmitting a combined output 3.5W Power Consumption with 5V Supply Voltage power of 68dBmV over the RF bandwidth of 5MHz to Programmable Power Codes Allow Operation at 204MHz. The gain is controlled in 1dB steps over a 60dB range using an SPI 3-wire interface. The use of Maxim s Reduced Power Dissipation high-voltage CMOS process enables the device to deliver Exceeds Spurious Requirements with Fully Loaded high dynamic range while minimizing power dissipation OFDM Allocation at +65dBmV at Modem Output under a +5V supply rail. 20L 5mm x 5mm x 0.75mm TQFN Package with The MAX3523 is available in a 20-pin 5mm x 5mm x Exposed Paddle 0.75mm TQFN package, and operates over temperature range of 0C to +70C. Applications DOCSIS 3.1 Upstream (D3.1 US) Cable Modem (CM) Ordering Information appears at end of data sheet. Customer Premises Equipment (CPE) Simplified Block Diagram MAX3523 IN+ OUT+ IN OUT CSB VDD SDA SERIAL INTERFACE SCLK GND TXEN 19-100360 Rev 0 6/18MAX3523 Low-Power DOCSIS 3.1 Programmable-Gain Amplifier Absolute Maximum Ratings VDD to GND .........................................................-0.3V to +6.0V Operating Junction Temperature (Note 4) ........ -40C to +150C TXEN, SDA, SCLK, CSB .....................................-0.3V to +6.0V Storage Temperature Range ............................ -65C to +165C IN+, IN- .............................................................V - 2.1V to 6V Lead Temperature (soldering, 10s) .................................+300C DD OUT+, OUT- to GND ......................................-0.3V to V + 5V Soldering Temperature (reflow) .......................................+260C DD RF Input Power ..............................................................+10dBm Continuous Power Dissipation (T = 70C) A (derate 54mW/C above T = 70C) .........................3500mW A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 20 TQFN-EP PACKAGE CODE T2055+5 Outline Number 21-0140 Land Pattern Number 90-0010 Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) PCB must be designed for a of 18.5C/W or lower JA JA Junction to Case ( ) 2C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com