EVALUATION KIT AVAILABLE MAX3949 11.3Gbps, Low-Power, AC-Coupled Laser Driver General Description Benefits and Features The MAX3949 is a 3.3V, multirate, low-power laser diode Low Power Consumption driver designed for Ethernet, Fibre Channel, and SONET Saves Board Space transmission systems at data rates up to 11.3Gbps. Small 3mm x 3mm Package This device is optimized to drive a differential transmit- Flexibility ter optical subassembly (TOSA) with a 25 flex circuit. Programmable Modulation Current Up to The unique design of the output stage enables use of 85mA (5 Load) unmatched TOSAs. Programmable Bias Current Up to 105mA The device receives differential AC-coupled signals with Programmable Input Equalization and Output on-chip termination. It can deliver laser modulation cur- Deemphasis rents of up to 85mA at an edge speed of 22ps (20% to Safety 80%) into a 5 external differential load. The device is Supports SFF-8431 SFP+ MSA and SFF-8472 designed to have a high-bandwidth differential signal path Digital Diagnostic with on-chip back termination resistors integrated into its Integrated Eye Safety Features with Maskable outputs. An input equalization block can be activated to Faults compensate for SFP+ host connector losses. The inte- Bias Current Monitor grated bias circuit provides programmable laser bias cur- rents up to 105mA. Both the laser bias current generator Applications and the laser modulator can be disabled from a single pin. 10GBASE-LR SFP+ Optical Transceivers The use of a 3-wire digital interface reduces the pin count 10GBASE-LRM SFP+ Optical Transceivers while permitting adjustment of input equalization, polar- OC192-SR SFP+ SDH/SONET Transceivers ity, output deemphasis, and modulation and bias currents without the need for external components. The device is available in a 3mm x 3mm, 16-pin TQFN package, and Ordering Information appears at end of data sheet. is specified for the -40C to +95C extended temperature range. 19-6317 Rev 1 4/14MAX3949 11.3Gbps, Low-Power, AC-Coupled Laser Driver Absolute Maximum Ratings V , V ............................................................-0.3V to +4.0V Voltage Range at BIAS ...........................................0.4V to 2.5V CC CCT V - V .................................................................... < 0.5V Current into TOUT+ and TOUT- .....................................+150mA CC CCT Voltage Range at TIN+, TIN-, DISABLE, Continuous Power Dissipation (T = +70C) A SDA, SCL, CSEL, VSEL, FAULT, and BMON .... -0.3V to V TQFN (derate 20.8mW/C above +70C)...............1666.7mW CC Voltage Range at Storage Temperature Range ............................ -55C to +150C TOUT-, TOUT+ ......................(V - 1.3V) to (V + 1.3V) Die Attach Temperature ...................................................+400C CCT CCT Current Range into TIN+ and TIN- ................... -20mA to +20mA Lead Temperature (soldering, 10s) .................................+300C Current Range into BIAS ................................... 0mA to +120mA Soldering Temperature (reflow) .......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 16-PIN TQFN Package Code T1633+5 Outline Number 21-0136 Land Pattern Number 90-0032 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 48C/W JA Junction to Case ( ) 10C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com