MAX3956 11.3Gbps Transceiver with DDM and DC-Coupled Laser Interface General Description Benefits and Features The MAX3956 is an 11.3Gbps, highly-integrated, low- Low Power Consumption power transceiver with digital diagnostics monitoring Enables < 0.8W Total SFP+ Module Power (DDM) designed for next-generation Ethernet transmis- Dissipation sion systems. The receiver incorporates a limiting ampli- 380mW Typical IC Power Dissipation at 3.3V fier and loss-of-signal (LOS) circuit. The limiting ampli- (I = 45mA, I = 45mA) LD MOD BIAS fier features dual-path architecture optimizing the perfor- mance for signals up to 4.25Gbps and up to 11.3Gbps, Flexibility respectively. The transmitter incorporates Maxims propri- Multirate up to 11.3Gbps (NRZ) Operation with Rate etary DC-coupled laser driver interface and closed-loop Select for 1.25Gbps to 4.25Gbps Operation control of laser average power. This part is optimized to Programmable Laser-Diode Modulation Current from enable 0.8W maximum power dissipation target of SFP+ 10mA to 85mA MSA based modules. Programmable Tx Input Equalization and Rx Output The MAX3956 supports differential AC-coupled signaling Deemphasis with 50 termination at Rx input, Rx output, and Tx input. Safety and Monitoring The Tx output is a DC-coupled 25 laser diode interface with dedicated pins for the laser anode (TOUTA) and the Integrated Eye Safety Features with Maskable Fault laser cathode (TOUTC). and Interrupt Signal Generation An integrated 12-bit analog-to-digital converter (ADC) Analog Monitors with Integrated 12-Bit ADC, Fully is utilized to provide digital monitors of internal/external Supporting SFF-8472 DDM temperature, V , and received signal strength indica- CC Accurate Analog Measurements tion (RSSI). The MAX3956s digital monitors and the use High-Accuracy Temperature, V , and RSSI of a 2-wire or 3-wire slave interface enables configuration CC Sensors through a digital-only microcontroller (C). Enables Use of Simple Digital-Only C The MAX3956 operates from a single +3.3V supply and over a -40C to +95C temperature range and is available in a standard 5mm x 5mm, 32-pin TQFN-EP package. Simplified Block Diagram Applications 1.25Gbps TO 11.3Gbps, DUAL-PATH LIMITING AMPLIFIER 10GBASE-LR SFP+ Optical Transceivers 50 50 50 50 LPF 4G RIN+ ROUT+ RIN- MUX ROUT- 10G LOS RX-LOS CSEL DDM SDA 2-WIRE/3-WIRE RSSI VCC TEMP BADC TX-POWER RSSI SCL 1.25Gbps to 11.3Gbps, DC-COUPLED LASER DRIVER APC 50 50 VCCTO TX-LOS DC-COUPLED TOUTA TIN+ TOUTC LASER DRIVER EQUALIZER VOUT TIN- Ordering Information appears at end of data sheet. 19-6787 Rev 3 9/14MAX3956 11.3Gbps Transceiver with DDM and DC-Coupled Laser Interface Absolute Maximum Ratings Voltage at V , V , V , V ...............-0.3V to 4.0V Voltage at TSNS, TGND .......................................-0.3V to 1.2V CCX CCRO CCT CCTO Voltage at REGFILT ..............................................-0.3V to 2.0V Voltage at BADC, I.C..............................................-0.3V to 2V Current into V ....................................... -15mA to +180mA Voltage at TOUTA ................(V - 1.3V) to (V + 1.3V) CCTO CCTO CCTO Current into REGFILT ...................................... -15mA to +15mA Voltage at TOUTC and VOUT ...............0.3V to (V - 0.4V) CCTO Current into TOUTA and TOUTC ..................................+150mA Continuous Power Dissipation (T = +70C) A Current into VOUT ............................................. -2mA to +90mA TQFN (derate 34.5mW/C above +70C)..................2759mW Current into TIN+, TIN-, RIN+, and RIN- ......... -15mA to +15mA Junction Temperature ......................................................+150C Current into ROUT+ and ROUT- ..................... -30mA to +30mA Storage Temperature Range ............................ -55C to +150C Voltage at TIN+, TIN-, RIN+, RIN-, LOS, Lead Temperature (soldering, 10s) .................................+300C DISABLE, FAULT, MDIN, Soldering Temperature (reflow) .......................................+260C RSSI, SCL, SDA, INTRPT, and CSEL -0.3V to (V + 0.3V) CCX Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Note 1) Package Thermal Characteristics TQFN Junction-to-Ambient Thermal Resistance ( ) ..........29C/W JA Junction-to-Case Thermal Resistance ( ) ..............1.7C/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = V = V = 2.85V to 3.47V, V = 2.97V to 3.47V, V = 0V, T = -40C to +95C. Typical values are at V = CCX CCRO CCT CCTO GND A CCX V = V = V = 3.3V, 14 single-ended load for TOUTC/TOUTA, and T = +25C, unless otherwise noted. See Figure 1 CCRO CCT CCTO A for electrical setup.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Excludes current through TOUTC and Power-Supply Current I TOUTA I = 60mA, I = 105 130 mA CC LD MOD LD DC 40mA, and SET CML 4:0 = 3d Power-On-Reset (Enable Part) V 2.5 V POR DE Power-On-Reset (Disable Part) V 2.4 V POR AS RX INPUT SPECIFICATION -12 31 Input Sensitivity for BER < 10 V 2 -1 PRBS at 11.3Gbps 3 mV RIN MIN P-P Differential Input Resistance R 100 RIN RX OUTPUT SPECIFICATION (SET RXDE 2:0 = 0xx) Differential Output Voltage V See Table 7 for more information 450 800 mV ROUT P-P Programming Range Differential Output Voltage V SQ EN = 1 5 mV ROUT P-P when Squelched Differential Output Resistance R 100 ROUT Maxim Integrated 2 www.maximintegrated.com