EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX40018 Dual nanoPower Op Amps in Tiny WLP and TDFN Packages General Description Benefits and Features The MAX40018 is a dual operational amplifier that Ultra-Low Power Preserves Battery Life consumes only 400nA supply current (per channel). At 400nA Typical Supply Current (Per Channel) such low power consumption, the device is ideal for Single 1.7V to 5.5V Supply Voltage Range battery-powered applications such as portable medical The Device Can be Powered From the Same equipment, portable instruments and wireless handsets. 1.8V/2.5V/3.3V/5V System Rails The MAX40018 operates from a single 1.7V to 5.5V Tiny Packages Save Board Space supply, allowing the device to be powered by the same 1.63mm x 0.91mm x 0.5mm WLP-8 with 0.4mm 1.8V, 2.5V, or 3.3V nominal supply that powers the Bump Pitch microcontroller. The MAX40018 features rail-to-rail 3mm x 3mm x 0.75mm TDFN-8 Package outputs and is unity-gain stable with a 9kHz gain bandwidth Precision Specifications for Buffer/Filter/Gain Stages product (GBP). Low 350V Input Offset Voltage The ultra-low supply current, ultra-low input bias current, Rail-to-Rail Output Voltage low operating voltage, and rail-to-rail output capabilities 9kHz GBP make this dual operational amplifier ideal for use with single Low 0.1pA Input Bias Current lithium-ion (Li+), or two-cell NiCd or alkaline batteries. Unity-Gain Stable The MAX40018 is available in a tiny, 8-bump, 1.63mm x -40C to +125C Temperature Range 0.91mm wafer-level package (WLP), with a bump pitch of 0.4mm, as well as in an 8-pin 3mm x 3mm TDFN Ordering Information appears at end of data sheet. package. The device is specified over the -40C to +125C, automotive temperature range. Simplified Block Diagram Applications Wearable Devices VDD Handheld Devices Notebook and Tablet Computers Portable Medical Devices Portable Instrumentation IN1+ OUT1 IN1- IN2+ OUT2 IN2- MMAAXX4001840018 V SS 19-100227 Rev 3 11/19MAX40018 Dual nanoPower Op Amps in Tiny WLP and TDFN Packages Absolute Maximum Ratings V to V ..............................................................-0.3V to +6V Continuous Power Dissipation (T = +70C TDFN-8, DD SS A OUT to V ......................................V - 0.3V to V + 0.3V derate 24.4mW/C above +70C) ...........................1951.2mW SS SS DD IN +, IN - to V ...............................V - 0.3V to V + 0.3V Operating Temperature Range ......................... -40C to +125C SS SS DD IN + to IN - ...........................................................................2V Junction Temperature ......................................................+150C Continuous Current Into Any Input Pin .............................10mA Storage Temperature Range ............................ -65C to +150C Continuous Current Into Any Output Pin ..........................20mA Lead Temperature (soldering, 10s) .................................+300C Output Short-Circuit Duration to V or V ........................ 10s Reflow Soldering Peak Temperature (Pb-free) ...............+260C DD SS Continuous Power Dissipation (T = +70C 8-Bump WLP, A derate 11.4mW/C above +70C) ................................912mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information TDFN-8 PACKAGE CODE T833+2 Outline Number 21-0137 Land Pattern Number 90-0059 Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 41C/W JA Junction to Case ( ) 8C/W JC WLP-8 PACKAGE CODE N80B1+1 Outline Number 21-100228 Land Pattern Number Refer to Application Note 1891 Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 87.71C/W JA Junction to Case ( ) N/A JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = +3V, V = 0V, V = 0.5V, V = V /2, R = 1M to V /2, T = +25C, unless otherwise noted (Note 1).) DD SS CM OUT DD L DD A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage Range V Guaranteed by PSRR tests 1.7 5.5 V DD T = +25C 0.8 1.3 A Supply Current (Dual) I T = -40C to +85C 1.4 A DD A T = -40C to +125C 1.6 A Maxim Integrated 2 www.maximintegrated.com