MAX4410 19-2386 Rev 2 10/02 80mW, DirectDrive Stereo Headphone Driver with Shutdown General Description Features The MAX4410 stereo headphone driver is designed for No Bulky DC-Blocking Capacitors Required portable equipment where board space is at a Ground-Referenced Outputs Eliminate DC-Bias premium. The MAX4410 uses a unique DirectDrive Voltages on Headphone Ground Pin architecture to produce a ground-referenced output No Degradation of Low-Frequency Response Due from a single supply, eliminating the need for large DC- blocking capacitors, saving cost, board space, and to Output Capacitors component height. 80mW Per Channel into 16 The MAX4410 delivers up to 80mW per channel into a Low 0.003% THD + N 16 load and has low 0.003% THD + N. A high power- High PSRR (90dB at 1kHz) supply rejection ratio (90dB at 1kHz) allows this device to Integrated Click-and-Pop Suppression operate from noisy digital supplies without an additional linear regulator. The MAX4410 includes 8kV ESD pro- 1.8V to 3.6V Single-Supply Operation tection on the headphone outputs. Comprehensive click- Low Quiescent Current and-pop circuitry suppresses audible clicks and pops on Independent Left/Right, Low-Power startup and shutdown. Independent left/right, low-power Shutdown Controls shutdown controls make it possible to optimize power savings in mixed mode, mono/stereo applications. Short-Circuit and Thermal Overload Protection The MAX4410 operates from a single 1.8V to 3.6V supply, 8kV ESD-Protected Amplifier Outputs consumes only 7mA of supply current, has short-circuit Available in Space-Saving Packages and thermal overload protection, and is specified over the 16-Bump UCSP (2mm x 2mm x 0.6mm) extended -40C to +85C temperature range. The 14-Pin TSSOP MAX4410 is available in a tiny (2mm x 2mm x 0.6mm), 16-bump chip-scale package (UCSP) and a 14-pin Ordering Information TSSOP package. PIN/BUMP- PART TEMP RANGE Applications PACKAGE Notebooks MP3 Players MAX4410EBE-T* -40C to +85C 16 UCSP-16 Cellular Phones Web Pads MAX4410EUD -40C to +85C 14 TSSOP PDAs Portable Audio Equipment *Future productcontact factory for availability. Functional Diagram MAX4410 LEFT AUDIO INPUT SHDNL SHDNR RIGHT AUDIO INPUT UCSP is a trademark of Maxim Integrated Products, Inc. Pin Configurations and Typical Application Circuit appear at end of data sheet. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.80mW, DirectDrive Stereo Headphone Driver with Shutdown ABSOLUTE MAXIMUM RATINGS PGND to SGND .....................................................-0.3V to +0.3V Continuous Power Dissipation (T = +70C) A PV to SV -0.3V to +0.3V 14-Pin TSSOP (derate 9.1mW/C above +70C) ..........727mW DD DD ................................................................. PV to SV .........................................................-0.3V to +0.3V 16-Bump UCSP (derate 15.2mW/C above +70C)....1212mW SS SS PV and SV to PGND or SGND .........................-0.3V to +4V Junction Temperature......................................................+150C DD DD PV and SV to PGND or SGND ..........................-4V to +0.3V Operating Temperature Range ...........................-40C to +85C SS SS IN to SGND..........................................................-0.3V to +0.3V Storage Temperature Range .............................-65C to +150C SHDN to SGND........................(SGND - 0.3V) to (SV + 0.3V) Bump Temperature (soldering) (Note 1) DD OUT to SGND ............................(SV - 0.3V) to (SV + 0.3V) Infrared (15s) ...............................................................+220C SS DD C1P to PGND.............................(PGND - 0.3V) to (PV + 0.3V) Vapor Phase (60s) .......................................................+215C DD C1N to PGND .............................(PV - 0.3V) to (PGND + 0.3V) Lead Temperature (soldering, 10s) .................................+300C SS Output Short Circuit to GND or V ...........................Continuous DD Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom- mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (PV = SV = 3V, PGND = SGND = 0, SHDNL = SHDNR = SV , C1 = C2 = 2.2F, R = R = 10k , R = , T = T to T , DD DD DD IN F L A MIN MAX unless otherwise noted. Typical values are at T = +25C.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage Range V Guaranteed by PSRR test 1.8 3.6 V DD One channel enabled 4 Quiescent Supply Current I mA DD Two channels enabled 7 11.5 Shutdown Supply Current I SHDNL = SHDNR = GND 6 10 A SHDN 0.7 x V IH SV DD SHDN Thresholds V 0.3 x V IL SV DD SHDN Input Leakage Current -1 +1 A SHDN to Full Operation t 175 s SON CHARGE PUMP Oscillator Frequency f 272 320 368 kHz OSC AMPLIFIERS Input Offset Voltage V Input AC-coupled, R = 32 0.5 2.4 mV OS L Input Bias Current I -100 +100 nA BIAS 1.8V V 3.6V DC 75 90 DD Power-Supply Rejection Ratio PSRR f = 1kHz 90 dB RIPPLE 200mV ripple P-P f = 20kHz 55 RIPPLE R = 32 65 L Output Power P THD + N = 1% mW OUT R = 16 40 80 L 2 MAX4410