EVALUATION KIT AVAILABLE MAX44280 1.8V, 50MHz, Low-Offset, Low-Power, Rail-to-Rail I/O Op Amp General Description Features The MAX44280 offers a unique combination of high S Low 1.8V Supply Rail Over the -40C to +125C speed, precision, low noise, and low-voltage operation Range making it ideally suited for a large number of signal pro- S 1.7V Supply Rail Over the 0C to +70C Range cessing functions such as filtering and amplification of S 50MHz Bandwidth signals in portable and industrial equipment. S Low 12.7nV/Hz Input Voltage-Noise Density The amplifier features an input offset of less than 50FV S Low 1.2fA/Hz Input Current-Noise Density and a high-gain bandwidth product of 50MHz while S Low 50V (max) V at +25C OS maintaining a low 1.8V supply rail. The device is internally compensated for gains of 5V/V or greater. The devices S 500fA Low Input Bias Current rail-to-rail input/outputs and low noise guarantee maxi- S 750A Quiescent Current per Amplifier mum dynamic range in demanding applications such S < 1A Supply Current in Shutdown as 12- to 16-bit SAR ADC drivers. Unlike traditional S Small, 2mm x 2mm SC70 and 1mm x 1.5mm Thin rail-to-rail input structures, input crossover distortion is DFN Packages absent due to an optimized input stage with an ultra-quiet S Low -110dB Total Harmonic Distortion charge pump. S 5V/V Minimum Stable Gain The MAX44280 includes a fast-power-on shutdown mode for further power savings. Applications The MAX44280 operates from a supply range of 1.8V to 5.5V over the -40NC to +125NC temperature range and Notebooks can operate down to 1.7V over the 0NC to +70NC tem- 3G/4G Handsets perature range. The MAX44280 is available in a small, Portable Media Players 6-pin SC70 package and is also available in a 1mm x Portable Medical Instruments 1.5mm thin DFN (ultra-thin LGA) package. Battery-Operated Devices Ordering Information appears at end of data sheet. Analog-to-Digital Converter Buffers Transimpedance Amplifiers General-Purpose Signal Processing Typical Application Circuit +3.3V MAX44280 V SIG 10kI ADC MAX11645 2.4kI 3.3nF 24kI For related parts and recommended products to use with this part, refer to: www.maximintegrated.com/MAX44280.related For pricing, delivery, and ordering information, please contact Maxim Direct at 19-6157 Rev 2 8/12 1-888-629-4642, or visit Maxim Integrateds website at www.maximintegrated.com.MAX44280 1.8V, 50MHz, Low-Offset, Low-Power, Rail-to-Rail I/O Op Amp ABSOLUTE MAXIMUM RATINGS IN+, IN-, OUT .................................(V - 0.3V) to (V + 0.3V) Thin DFN (Ultra-Thin LGA) SS DD (derate 2.1mW/NC above +70NC) .............................110.2mW V to V ...............................................................-0.3V to +6V DD SS Operating Temperature Range ........................ -40NC to +125NC SHDN .......................................................................-0.3V to +6V Junction Temperature .....................................................+150NC Output to Short-Circuit Ground Duration .............................. 10s Lead Temperature (soldering, 10s) ................................+300NC Continuous Input Current into Any Pin ............................Q20mA Soldering Temperature (reflow) ......................................+260NC Continuous Power Dissipation (T = +70NC) A SC70 (derate 3.1mW/NC above +70NC) ......................245mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) SC70 Thin DFN (Ultra-Thin LGA) Junction-to-Ambient Thermal Resistance (B ) .... 326.5NC/W Junction-to-Ambient Thermal Resistance (B ) ....... 470NC/W JA JA Junction-to-Case Thermal Resistance (B ) .............115NC/W Junction-to-Case Thermal Resistance (B ) ............ 120NC/W JC JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (V = 3.3V, V = 0V, V = V = V /2, R = 10kI to V /2, V = V , T = -40NC to +125NC. Typical values are at L DD SS IN+ IN- DD DD SHDN DD A T = +25NC, unless otherwise noted.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS V DD Input Voltage Range V V Guaranteed by CMRR test -0.1 V IN+ IN- + 0.1 T = +25NC 10 50 A Input Offset Voltage V T = -40C to +125C after calibration 100 FV OS A T = -40C to +125C 500 A Input Offset Voltage Drift V - TC 0.8 5 FV/NC OS T = +25NC 0.01 0.5 A Input Bias Current (Note 3) I T = -40NC to +85NC 10 pA B A T = -40NC to +125NC 100 A Input Capacitance C 0.4 pF IN Common-Mode Rejection Ratio CMRR V = -0.1V to (V + 0.1V) 75 90 dB CM DD 0.4V P V P V - 0.4V, R = 10kI 100 115 OUT DD OUT Open-Loop Gain A 0.4V P V P V - 0.4V, R = 600I 91 100 dB OL OUT DD OUT 0.4V P V P V - 0.4V, R = 32I 80 OUT DD OUT Output Short-Circuit Current I To V or V 85 mA SC DD SS Maxim Integrated 2