Click here for production status of specific part numbers. MAX44284 36V, Input Common-Mode, High-Precision, Low-Power Current-Sense Amplifier General Description Benefits and Features The MAX44284 is a high-side, current-sense amplifier Supports Use of Small Current-Sense Resistors to that operates with a 1.7V to 5.5V single supply and is Improve Power-Supply Conversion Efficiency and optimized for very low power operation with only 21A of Measurement Accuracy quiescent current. Input Bias Current of 80nA (max) The MAX44284 offers precision accuracy specifications Very Low 2V Input Offset Voltage (MAX44284F/H) of 2V V and gain error of 0.05%. The device features OS Extremely Low 50nV/C Input Offset Tempco an input common-mode voltage range from -0.1V to Coefficient +36V. This current-sense amplifier has a voltage output -0.1V to +36V Wide Input Common-Mode Range and is offered in four different gain versions. Low 0.05% Gain Error The MAX44284 is offered in small 6-bump, 0.4mm-pitch Extends Battery Life WLP (1.3mm x 0.9mm) and 6-pin SOT23 packages and is Low Supply Current of 21A specified for operation over the -40C to +125C automotive temperature range. 1.7V to 5.5V Single Supply Shutdown Input (Independent of V ) DD Applications Four Fixed Gain Options Simplify Design Smartphones and Tablets 50V/V MAX44284F Notebook Computers 100V/V MAX44284H DC-DC Current Sensing in Power Management 200V/V MAX44284W Portable-/Battery-Powered Systems 500V/V MAX44284E Medical Pulse Oximeters and Infusion Pumps Base Stations Ordering Information appears at end of data sheet. Typical Application Circuit I LOAD R SENSE VBATT = UP TO 36V RS+ RS- LOAD VDD = 3.3V MAX44284 V = 3.3V DD OUT C ADC 19-6862 Rev 9 5/19MAX44284 36V, Input Common-Mode, High-Precision, Low-Power Current-Sense Amplifier Absolute Maximum Ratings V to GND ............................................................-0.3V to +6V Operating Temperature Range ......................... -40C to +125C DD RS+, RS- to GND ..................................................-0.3V to +40V Junction Temperature ......................................................+150C RS+ to RS- ..........................................................................40V Storage Temperature Range ............................ -65C to +150C OUT, SHDN to GND ................................. -0.3V to (V + 0.3V) Lead Temperature (soldering, 10s) .................................+300C DD Continuous Input Current (any pin) ..................................20mA Soldering Temperature (reflow) .......................................+260C Continuous Power Dissipation (T = +70C) A WLP (derate 10.5mW/C above +70C) ......................840mW SOT23 (derate 4.3mW/C above +70C) .................347.8mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 6 SOT23 PACKAGE CODE U6+1, U6+1A Outline Number 21-0058 Land Pattern Number 90-0175 Thermal Resistance, Single-Layer Board: Junction to Ambient - (C/W) N/A JA Junction to Case - (C/W) 80 JC Thermal Resistance, Multi-Layer Board Junction to Ambient ( ) (C/W) 115 JA Junction to Case ( ) (C/W) 80 JC 6 WLP PACKAGE CODE W60A1+1 Outline Number 21-0656 Land Pattern Number Refer to Application Note 1891 Thermal Resistance, Multi-Layer Board Junction to Ambient ( ) (C/W) 95.15 JA Junction to Case ( ) (C/W) N/A JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com