Click here for production status of specific part numbers. MAX44299 Current and Voltage Sense with Power Measurement General Description Benefits and Features The MAX44299 is a low-side current, voltage, and power High Accuracy Improves Measurement Quality monitoring circuit that provides an analog output current Accurate Power Measurement: < 1.1% of Reading proportional to the measured current, voltage, and the Total Error internally calculated instantaneous power. Zero Thermal Drift Current-Sense Input Instantaneous power is calculated internally by multiplying High Integration Saves Cost and Space the load current and a fraction of the load voltage set by Power, Current, and Voltage Monitoring Plus Reference an external resistive divider. All three outputs are scaled 5mV, 10mV, and 20mV Programmable Current- to a full-scale current of 100A. An additional output Sensing Full-Scale Voltage current of 100A is available at the reference (REF) Calibration Point at 10A upon Command output this current can be used to create a reference Single-Supply Range and Low Power Simplify voltage for the ADC that is being used to measure the Power-Supply Design power, voltage, and current signals. Current Output Signals Overcome Trace Output By providing the ADC with both the measured signals and Voltage Drops and Noise the input reference voltage, the ADC can make a ratiometric 3V to 5.5V Single Supply measurement, allowing improved accuracy. The use of Power-Down Mode with High-Impedance Output currents, rather than voltage, to convey the measured 0C to +85C Temperature Range signals to the ADC eliminates any errors caused by Tiny 16-Bump, 2.4mm x 2.4mm WLP voltage drops across the parasitic resistance of PCB, which can be significant for high-current systems. To allow Applications full-system calibration, the CAL bump provides a way to Power Monitoring and Management Data Center calibrate gain and offset for the ADC. and Telecom Renewable Energy System The device measures load current by using a precision, auto-zeroed current-sense amplifier (CSA), which due to Smart Battery Packs and Chargers its ultra-low offset voltage allows precise measurement of full-scale voltages of 5mV, 10mV, and 20mV. The load volt- age is measured via a user-selectable resistive network, Ordering Information appears at end of data sheet. dividing the input voltage down to a full scale of 1.00V. The wide supply voltage range of 3V to 5.5V allows the simple sharing of supplies with either the ADC or a microcontroller. The device can be powered down and the outputs will then go high impedance. The device is available in a 2.4mm x 2.4mm, 16-bump wafer-level package (WLP) and is specified for the 0C to +85C temperature range. See the MAX44298 for a very similar product with a choice of 50A output current and alternate pinout. 19-8500 Rev 1 9/18MAX44299 Current and Voltage Sense with Power Measurement Absolute Maximum Ratings V to GND1 .......................................................-0.3V to +6V CAL, G1, G0, ISET, CF Continuous Current ....................10mA DD1 V to GND2 .......................................................-0.3V to +6V V , I , P , REF Continuous Current ..................10mA DD2 OUT OUT OUT V to V ......................................................-0.3V to +0.3V Continuous Power Dissipation (T = +70C) DD1 DD2 A GND1 to GND2 ...................................................-0.3V to +0.3V WLP (derate 20.4mW/C above +70C) ....................1632mW RS+, RS- to GND2 .................................................-0.3V to +2V Operating Temperature Range ...............................0C to +85C RS+ to RS- ...........................................................................2V Junction Temperature ......................................................+150C V , CAL, G1, G0, ISET, I , V , REF, Storage Temperature Range .............................-65C to +150C IN OUT OUT P to GND1 ..................................- 0.3V to (+V + 0.3V) Lead Temperature (soldering, 10s) .................................+300C OUT DD Output Short-Circuit Duration ....................................Continuous Soldering Temperature (reflow) .......................................+260C Package Thermal Characteristics (Note 1) WLP Junction-to-Ambient Thermal Resistance ( ) ..........49C/W JA Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Electrical Characteristics (V = V = V = 3.3V, V = 0V, V = V /2, R = 1m, V = 0.54V, R = 30.1k to GND, C = 100pF, T = 0C DD DD1 DD2 ISET SENSE FS SENSE IN L L A to +85C, unless otherwise noted. Typical values are at T = +25C.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS CURRENT SENSE (RS+, RS-) Input Common-Mode Voltage (V + V )/2 -0.1 +0.1 V RS+ RS- Range G1 = 1, G0 = 1 20 V Input Full-Scale V - SENSE RS+ FSR I G1 = 1, G0 = 0 10 mV Range V RS- G1 = 0, G0 = 1 5 LOAD VOLTAGE SENSE (V ) IN Input Voltage Range V 0.45 0.75 1.005 V IN V Output Full-Scale OUT ISET = 0 100 A Current Range Compliance Output Voltage V - V (0.1% accuracy) 300 mV DD VOUT V Output-Referred Noise Noise BW = 10kHz 40 V OUT RMS Voltage between 50% and 90% Total Error (100A Range) 0.5 2.5 % RDG of FSR Settling Time to 1% V steps from 0.6V to 0.8V 20 s IN Maxim Integrated 2 www.maximintegrated.com