MAX4950 19-4439 Rev 0 5/09 Quad PCI Express Equalizer/Redriver General Description Features The MAX4950 PCI Express (PCIe ) quad equalizer/ Single +3.3V Supply Operation redriver operates from a single +3.3V supply. This Generation I (2.5GT/s) and Generation II (5.0GT/s) device improves signal integrity at the receiver through Capable programmable input equalization and programmable redrive circuitry. The output circuitry reestablishes de- Return Loss: emphasis lost on the board, compensating for circuit 10dB (f 1.25GHz) board loss. This device permits optimal placement of 8dB (f 2.5GHz) key PCIe components and longer runs of stripline, microstrip, or cable. Very Low Latency The MAX4950 contains four identical buffers capable of 280ps Propagation Delay equalizing differential signals at data rates up to 5GT/s, Individual Lane Detection and features electrical idle and receiver detection on each channel. The MAX4950 is ideal for use with PCIe Low Lane-to-Lane Skew: 50ps Gen I (2.5GT/s) and Gen II (5.0GT/s) data rates and -12 Total Jitter 35ps at BER = 10 P-P features a power-saving mode. Three-Level-Programmable Input Equalization The MAX4950 is available in a small, lead-free, 42-pin (3.5mm x 9.0mm) TQFN package for optimal layout and Three-Level-Programmable Output Deemphasis minimal space requirements. The board traces are flow- On-Chip 50 Input/Output Terminations through for ease of layout. The MAX4950 is specified over the 0C to +70C operating temperature range. 2kV Human Body Model (HBM) Protection on All Pins Applications Space-Saving, 3.5mm x 9.0mm, TQFN Packaging Servers Industrial PCs Ordering Information Test Equipment Desktop Computers PART TEMP RANGE PIN-PACKAGE Laptop Computers (for External Video Cards) MAX4950CTO+ 0C to +70C 42 TQFN-EP* +Denotes a lead(Pb)-free/RoHS-compliant package. Communications Switchers *EP = Exposed pad. Storage Area Networks PCIe is a registered trademark of PCI-SIG Corp. Pin Configuration TOP VIEW 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 OEQ0 EN 39 *EP 21 40 20 OEQ1 RX DET O AMP 41 MAX4950 19 INEQ0 P SAV 42 18 INEQ1 + 123456789 10 11 12 13 14 15 16 17 TQFN *CONNECT EXPOSED PAD (EP) TO GND. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim s website at www.maxim-ic.com. EVALUATION KIT AVAILABLE V CC V CC GND GND IN0P OUT0P IN0N OUT0N GND GND IN1P OUT1P IN1N OUT1N GND GND V V CC CC GND GND IN2P OUT2P IN2N OUT2N GND GND IN3P OUT3P OUT3N IN3N GND GND V V CC CCQuad PCI Express Equalizer/Redriver ABSOLUTE MAXIMUM RATINGS (Voltages referenced to GND.) Junction-to-Case Thermal Resistance ( ) (Note 2) JC V ........................................................................-0.3V to +4.0V 42-Pin TQFN................................................................2.0C/W CC All Other Pins (Note 1)................................-0.3V to (V + 0.3V) Junction-to-Ambient Thermal Resistance ( ) (Note 2) CC JA Continuous Current IN P and IN N..................................30mA 42-Pin TQFN..............................................................29.0C/W Peak Current IN P and IN N (pulsed for 1s, Operating Temperature Range...............................0C to +70C 1% duty cycle)............................................................100mA Storage Temperature Range .............................-65C to +150C Continuous Power Dissipation (T = +70C) Junction Temperature......................................................+150C A 42-Pin TQFN (derate 34.5mW/C above +70C) .......2759mW Lead Temperature (soldering, 10s) .................................+300C Note 1: All I/O pins are clamped by internal diodes. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (V = +3.0V to +3.6V, C = 75nF coupling capacitor on each output, R = 50 resistor on each output, T = 0C to +70C, unless CC CL L A otherwise noted. Typical values are at V = +3.3V and T = +25C.) (Note 3) CC A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC PERFORMANCE Power-Supply Range V 3.0 3.6 V CC EN = V 262 328 O AMP = GND, CC Supply Current I mA CC P SAV = G N D ( N ote 4) EN = GND 100 125 Differential Input Impedance Z DC 80 100 120 RX-DIFF-DC Differential Output Z DC 80 100 120 TX-DIFF-DC Impedance Common-Mode Resistance Z V = V = 0 to +200mV, input RX-HIGH-IMP- IN P IN N 50 k to GND terminations not powered DC-POS Common-Mode Resistance Z V = V = -150mV to 0, input terminations RX-HIGH-IMP- IN P IN N 1k to GND not powered DC-NEG Common-Mode Resistance to GND, Input Terminations Z DC 40 50 60 RX-DC Powered Output Short-Circuit Current I Single-ended 90 mA TX-SHORT Common-Mode Delta V TX-CM-DC- Between Active and Idle O AMP = GND 100 mV ACTIVE-IDLE- States DELTA DC Output Offset During V TX-CM-DC- (V + V ) 25 mV OUT P OUT N Active State LINE-DELTA DC Output Offset During V TX-IDLE-DIFF- (V + V ) 10 mV OUT P OUT N Electrical Idle DC AC PERFORMANCE (Note 5) f = 0.05GHz to 1.25GHz 10 Differential Input Return Loss RL dB RX-DIFF f = 1.25GHz to 2.5GHz 8 Common-Mode Input Return RL f = 0.05GHz to 2.5GHz 6 dB RX-CM Loss 2 MAX4950