MAX5078 4A, 20ns, MOSFET Driver General Description Features 4V to 15V Single Power Supply The MAX5078A/MAX5078B high-speed MOSFET drivers source and sink up to 4A peak current. These devices 4A Peak Source/Sink Drive Current feature a fast 20ns propagation delay and 20ns rise and 20ns (typ) Propagation Delay fall times while driving a 5000pF capacitive load. Matching Delay Between Inverting and Propagation delay time is minimized and matched Noninverting Inputs between the inverting and noninverting inputs. High V / 2 CMOS (MAX5078A)/TTL (MAX5078B) Logic DD sourcing/sinking peak currents, low propagation delay, Inputs and thermally enhanced packages make the MAX5078A/ 0.1 x V (CMOS) and 0.3V (TTL) Logic-Input DD MAX5078B ideal for high-frequency and high-power Hysteresis circuits. Up to +18V Logic Inputs (Regardless of V DD The MAX5078A/MAX5078B operate from a 4V to 15V Voltage) single power supply and consume 40A (typ) of supply Low Input Capacitance: 2.5pF (typ) current when not switching. These devices have an 40A (typ) Quiescent Current internal logic circuitry that prevents shoot-through during output state changes to minimize the operating current -40C to +125C Operating Temperature Range at a high switching frequency. The logic inputs are pro- 6-Pin TDFN Package tected against voltage spikes up to +18V, regardless of the V voltage. The MAX5078A has CMOS input logic DD Ordering Information levels while the MAX5078B has TTL-compatible input PART TEMP RANGE PIN-PACKAGE logic levels. MAX5078AATT+ -40C to +125C 6 TDFN-EP* The MAX5078A/MAX5078B feature both inverting and noninverting inputs for greater flexibility in controlling the MAX5078AATT/V+ -40C to +125C 6 TDFN-EP* MOSFET. They are available in a 6-pin TDFN (3mm x MAX5078BATT+ -40C to +125C 6 TDFN-EP* 3mm) package and operate over the automotive temper- MAX5078BATT/V+ -40C to +125C 6 TDFN-EP* ature range of -40C to +125C. *EP = Exposed pad. +Denotes a lead(Pb)-free/RoHS-compliant package. Applications *EP = Exposed pad. /V denotes an automotive qualified part. Power MOSFET Switching Motor Control Note: Devices are also available in a tape-and-reel package. Specify Switch-Mode Power Supplies Power-Supply Modules tape and reel by adding to the part number when ordering. DC-DC Converters Selector Guide PART PIN-PACKAGE LOGIC INPUT MAX5078AATT 6 TDFN-EP V / 2 CMOS DD MAX5078BATT 6 TDFN-EP TTL Pin Configuration Typical Operating Circuit TOP VIEW 4V TO 15V V MAX5078 DD + IN- 1 6 IN+ MAX5078A MAX5078B IN+ OUT N 5 OUT GND 2 GND 3 4 V DD PWM IN IN- GND TDFN-EP For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com. 19-3346 Rev 2 9/12MAX5078 4A, 20ns, MOSFET Driver ABSOLUTE MAXIMUM RATINGS (Voltages referenced to GND.) Continuous Power Dissipation (T = +70C) A V ...............................................................................-0.3V to +18V 6-Pin TDFN-EP (derate 18.2mW/C above +70C)........1454mW DD IN+, IN- ........................................................................-0.3V to +18V Operating Temperature Range..............................-40C to +125C OUT .................................................................-0.3V to (V + 0.3V) Storage Temperature Range .................................-65C to +150C DD OUT Short-Circuit Duration.......................................................10ms Junction Temperature...........................................................+150C Continuous Source/Sink Current at OUT (P < P ).....200mA Lead Temperature (soldering, 10s)......................................+300C D DMAX Soldering Temperature (reflow)............................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) Junction-to-Ambient Thermal Resistance ( )...............42C/W JA Junction-to-Case Thermal Resistance ( )......................9C/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (V = 4V to 15V, T = -40C to +125C, unless otherwise noted. Typical values are at V = 15V and T = +25C.) (Note 1) DD A DD A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY V Operating Range V 415V DD DD V Undervoltage Lockout UVLO V rising 3.00 3.5 3.85 V DD DD V Undervoltage Lockout DD 200 mV Hysteresis V Undervoltage Lockout to DD V rising 12 s DD Output Delay V = 4V 28 55 V = 0V, IN- = V DD IN+ DD I A DD (not switching) V Supply Current V = 15V 40 75 DD DD I Switching at 250kHz, C = 0 0.5 1.2 2.2 mA DD-SW L DRIVER OUTPUT (SINK) T = +25C 1.1 1.8 V = 15V, A DD I = -100mA OUT T = +125C 1.5 2.4 Driver Output Resistance Pulling A R ON-N Down T = +25C 2.2 3.3 V = 4.5V, A DD I = -100mA OUT T = +125C 3.0 4.5 A Peak Output Current (Sinking) I V = 15V, C = 10,000pF 4 A PK-N DD L V = 4.5V 0.45 DD Output-Voltage Low I = -100mA V OUT V = 15V 0.24 DD Latchup Protection I Reverse current I (Note 2) 400 mA LUP OUT DRIVER OUTPUT (SOURCE) T = +25C 1.5 2.1 V = 15V, A DD I = 100mA OUT T = +125C 1.9 2.75 Driver Output Resistance Pulling A R ON-P Up T = +25C 2.75 4 V = 4.5V, A DD I = 100mA OUT T = +125C 3.75 5.5 A Peak Output Current (Sourcing) I V = 15V, C = 10,000pF 4 A PK-P DD L Maxim Integrated 2