MAX5112 9-Channel, 14-Bit, Current DAC 2 with I C Interface General Description Features The MAX5112 is a 14-bit, 9-channel, current-output S Low 3.0V Supply digital-to-analog converter (DAC). The device operates S Integrated Multiplexers for Outputs 1 and 2 from a low +3.0V power supply and provides 14-bit per- S Increased Current or Resolution with Outputs formance without any adjustment. Connected in Parallel The devices output ranges are optimized to bias a high- 2 S I C-Compatible Serial Interface power tunable laser source. Each of the 9 channels pro- vides a current source. Channels 1 and 2 provide 10mA S Internal Reference current. An internal multiplexer switches the outputs of S Overtemperature Protection each channel to one of four external nodes. Channel 3 S -40NC to +105NC Temperature Range provides a selectable current of 2mA or 20mA. Channel S Available in 36-Bump WLP or 32-Pin TQFN Packages 4 provides 90mA. Channel 5 provides 180mA. Channel 6 provides a selectable current of -60mA or +300mA. Applications Channel 7 provides 90mA. Channels 8 and 9 provide a selectable current of 15mA or 35mA. Connect DAC out- Tunable Laser Diode Biasing puts in parallel to obtain additional current or to achieve higher resolution. The device contains an internal refer- Ordering Information ence. PART INTERFACE PIN-PACKAGE 2 An I C-compatible interface drives the device with clock 2 MAX5112GWX+T I C 36 WLP rates of up to 400kHz. An active-high asynchronous CLR 2 MAX5112GTJ+ I C 32 TQFN-EP* input resets DAC codes to zero independent of the serial Note: All devices are specified over the -40C to +105C interface. The device provides a separate power-supply operating temperature range. input for driving the interface logic. +Denotes a lead(Pb)-free/RoHS-compliant package. The MAX5112 is specified over the -40NC to +105NC T = Tape and reel. *EP = Exposed pad. temperature range, and is available in 3mm x 3mm, 36-bump WLP and 5mm x 5mm, 32-pin TQFN packages. Typical Operating Circuit V V DD DD C7 C8 V 0.1F 0.1F SS C1 DIGITAL POWER 0.1F SUPPLY C6 0.1F 1 24 V DD SDA V SS 23 2 V SCL DD5 C2 3 A0 0.1F C 22 4 OP6 C9 A1 MAX5112 0.1F 5 21 V DDI V DD4 C5 20 V DD3 0.1F 6 19 DGND C10 OP1D 7 0.1F 18 AGND OP1C 17 8 CLR OP1B C4 C3 V V DD DD 0.1F 0.1F For pricing, delivery, and ordering information, please contact Maxim Direct 19-6060 Rev 2 5/13 at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com. 9 32 OP7 V DD7 10 31 V DD1 OP5 11 30 OP8 OP9 12 29 OP3 V DD6 13 28 N.C. OP2A 14 27 OP4 OP2B 15 26 V OP2C DD2 16 25 OP1A OP2DMAX5112 9-Channel, 14-Bit, Current DAC 2 with I C Interface ABSOLUTE MAXIMUM RATINGS V to AGND ...................-0.3V to +4.0V All Other Pins to AGND..-0.3V to +4.0V DD V to AGND ........................................................-6.0V to +0.3V Continuous Power Dissipation (T = +70NC) SS A V to AGND ......................................................-0.3V to +6.0V WLP (derate at 26.3mW/NC above +70NC) .................. 2104mW DDI OP6 to AGNDthe higher of (V - 9V), (V - 0.3V) and -6.0V TQFN (derate at 34.5mW/NC above +70NC) ..............2758mW DD SS to the lower of (V + 0.3V) and +4.0V Maximum Current Into Any Pin ........................................380mA DD OP1 to OP5 and OP7, OP8, Operating Temperature Range ........................ -40NC to +105NC OP9 to AGND ...-0.3V to the lower of (V + 0.3V) and +4.0V Storage Temperature Range ............................ -65NC to +150NC DD A1 to DGND .... -0.3V to the lower of (V + 0.3V) and +6.0V Junction Temperature .....................................................+150NC DDIO N.C. to AGND ......-0.3V to the lower of (V + 0.3V) and +4.0V Lead Temperature (TQFN only, soldering 10s) ..............+300NC DD Digital I/Os to DGND ............................................-0.3V to +6.0V Soldering Temperature (reflow) ......................................+260NC AGND to DGND ...................................................-0.3V to +0.3V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Note 1) Package Thermal Characteristics TQFN WLP Junction-to-Ambient Thermal Resistance (q ) ..........29NC/W Junction-to-Ambient Thermal Resistance (q ) ..........38NC/W JA JA Junction-to-Case Thermal Resistance (q ) ..............1.7NC/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (V = +2.6V to +3.3V, V = -4.75V to -5.46V, V = +1.8V to +5.25V, AGND = DGND, T = -40NC to +105NC, V V = DD SS DDI A OP1 OP5 V sourcing = V V and V = V - 1V, V sinking = V + 1V. Typical specifications at V = 3.0V, V = -5.2V, OP6 OP7, OP8, OP9 DD OP6 SS DD SS T = +25NC. Specifications apply to all DACs and outputs, unless otherwise noted.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS STATIC PERFORMANCE Resolution N 14 Bits Differential Nonlinearity DNL Guaranteed monotonic Q0.5 Q1.0 LSB OP1 to OP6 source, OP7, Q2 Q8 OP8, OP9 Integral Nonlinearity INL LSB OP6 sink Q8 OP1 and OP2 10 2mA FS range 2 OP3 20mA FS range 20 OP4 90 OP5 180 Full-Scale Output I mA MAX OP6 current source 300 OP6 current sink -60 OP7 90 15mA FS range 15 OP8 and OP9 35mA FS range 35 2 Maxim Integrated