EVALUATION KIT AVAILABLE MAX5113 9-Channel, 14-Bit Current DAC with SPI Interface General Description Features The MAX5113 is a 14-bit, 9-channel, current-output S Low 3.0V Supply digital-to-analog converter (DAC). The device operates S Integrated Multiplexers for Outputs 1 and 2 from a low +3.0V power supply and provides 14-bit per- S Increased Current or Resolution with Outputs formance without any adjustment. Connected in Parallel The devices output ranges are optimized to bias a high- S SPI-Compatible Serial Interface power tunable laser source. Each of the 9 channels pro- vides a current source. Channels 1 and 2 provide 10mA S Internal Reference current. An internal multiplexer switches the outputs of S Overtemperature Protection each channel to one of four external nodes. Channel 3 pro- S Operates Over the -40NC to +105NC Temperature Range vides a selectable current of 2mA or 20mA. Channel 4 pro- S Available in 36-Bump WLP or 32-Pin TQFN Packages vides 90mA. Channel 5 provides 180mA. Channel 6 pro- vides a selectable current of -60mA or +300mA. Channel Applications 7 provides 90mA. Channels 8 and 9 provide a selectable current of 15mA or 35mA. Connect DAC outputs in parallel Tunable Laser Diode Biasing to obtain additional current or to achieve higher resolution. The device contains an internal reference. Ordering Information An SPI interface drives the device with clock rates of PART INTERFACE PIN-PACKAGE up to 25MHz. An active-high asynchronous CLR input MAX5113GWX+T SPI 36 WLP resets DAC codes to zero independent of the serial MAX5113GTJ+ SPI 32 TQFN-EP* interface. The device provides a separate power-supply Note: All devices are specified over the -40C to +105C input for driving the interface logic. operating temperature range. The MAX5113 is specified over the -40NC to +105NC +Denotes a lead(Pb)-free/RoHS-compliant package. temperature range, and is available in 3mm x 3mm, *EP = Exposed pad. 36-bump WLP and 5mm x 5mm, 32-pin TQFN packages. Typical Operating Circuit V V DD DD C7 C8 V 0.1F 0.1F SS C1 DIGITAL POWER 0.1F SUPPLY C6 0.1F 1 24 V DD DIN V SS 2 23 V SCLK DD5 C2 3 0.1F C CS 22 4 OP6 C9 DOUT MAX5113 0.1F 5 21 V DDI V DD4 C5 20 V DD3 0.1F 6 19 DGND C10 OP1D 7 0.1F 18 AGND OP1C 17 8 CLR OP1B C4 C3 V V 0.1F DD DD 0.1F For pricing, delivery, and ordering information, please contact Maxim Direct 19-6401 Rev 2 5/13 at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com. 9 32 OP7 V DD7 10 31 V OP5 DD1 11 30 OP8 OP9 12 29 OP3 V DD6 13 28 N.C. OP2A 14 27 OP4 OP2B 15 26 V DD2 OP2C 16 25 OP1A OP2DMAX5113 9-Channel, 14-Bit Current DAC with SPI Interface ABSOLUTE MAXIMUM RATINGS V to AGND ...................-0.3V to +4.0V AGND to DGND ...................................................-0.3V to +0.3V DD V to AGND ........................................................-6.0V to +0.3V All Other Pins to AGND..-0.3V to +4.0V SS V to AGND ......................................................-0.3V to +6.0V Continuous Power Dissipation (T = +70NC) DDI A OP6 to AGN.....the higher of (V - 9V), (V - 0.3V) and -6.0V to WLP (derate at 26.3mW/NC above +70NC) .................. 2104mW DD SS the lower of (V + 0.3V) and +4.0V TQFN (derate at 34.5mW/NC above +70NC) ..............2758mW DD OP1 to OP5 and OP7, OP8, Maximum Current Into Any Pin ........................................380mA OP9 to AGND ...-0.3V to the lower of (V + 0.3V) and +4.0V Operating Temperature Range ........................ -40NC to +105NC DD DOUT to DGND ................. -0.3V to the lower of (V + 0.3V) Storage Temperature Range ............................ -65NC to +150NC DDIO and +6.0V Junction Temperature .....................................................+150NC N.C. to AGND ......-0.3V to the lower of (V + 0.3V) and +4.0V Lead Temperature (TQFN only, soldering, 10s) .............+300NC DD Digital I/Os to DGND ............................................-0.3V to +6.0V Soldering Temperature (reflow) ......................................+260NC Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) TQFN WLP Junction-to-Ambient Thermal Resistance (q ) ..........29NC/W Junction-to-Ambient Thermal Resistance (q ) ..........38NC/W JA JA Junction-to-Case Thermal Resistance (q ) ..............1.7NC/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (V = +2.6V to +3.3V, V = -4.75V to -5.46V, V = +1.8V to +5.25V, AGND = DGND, T = -40NC to +105NC, V V = V DD SS DDI A OP1 OP5 OP6 sourcing = V V and V = V - 1V, V sinking = V + 1V, unless otherwise noted. Typical specifications are at V OP7, OP8, OP9 DD OP6 SS DD = +3.0V, V = -5.2V, T = +25NC. Specifications apply to all DACs and outputs, unless otherwise noted.) (Note 2) SS A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS STATIC PERFORMANCE Resolution N 14 Bits Differential Nonlinearity DNL Guaranteed monotonic Q0.5 Q1.0 LSB OP1OP6 source and OP9 Q2 Q8 Integral Nonlinearity INL LSB OP6 sink Q8 14 Ideal Gain I I /2 mA/LSB GAIN MAX All but OP3, 2mA and OP6 sink Q1.3 Gain Error (Note 3) GE %FS OP3, 2mA Q1.5 OP6 sink Q5 All but OP6 sink Q50 Gain Error Tempco (Note 4) GETC ppm/NC OP6 sink Q15 OP1 and OP2 10 2mA FS range 2 OP3 20mA FS range 20 OP4 90 OP5 180 Full-Scale Output I mA MAX OP6 current source 300 OP6 current sink -60 OP7 90 15mA FS range 15 OP8 and OP9 35mA FS range 35 2 Maxim Integrated