EVALUATION KIT AVAILABLE MAX5214/MAX5216 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with SPI Interface General Description Benefits and Features The MAX5214/MAX5216 are pin-compatible, 14-bit and Low Power Consumption (80A max) 16-bit digital-to-analog converters (DACs). The MAX5214/ 14-/16-Bit Resolution in a 3mm x 5mm, 8-Pin MAX MAX5216 are single-channel, low-power, buffered volt- Package age-output DACs. The devices use a precision external Relative Accuracy reference applied through the high resistance input for 0.40 LSB INL (MAX5214, 14-Bit typ, 1 LSB max) rail-to-rail operation and low system power consumption. 1.2 LSB INL (MAX5216, 16-Bit typ, 4 LSB max) The MAX5214/MAX5216 accept a wide 2.7V to 5.5V sup- ply voltage range. Power consumption is extremely low Guaranteed Monotonic Over All Operating Ranges to accommodate most low-power and low-voltage appli- Low Gain and Offset Error cations. These devices feature a 3-wire SPI-/QSPI-/ Wide 2.7V to 5.5V Supply Range MICROWIRE-/DSP-compatible serial interface to save Rail-to-Rail Buffered Output Operation board space and to reduce the complexity in isolated applications. The MAX5214/MAX5216 minimize the digi- Safe Power-On Reset (POR) to Zero DAC Output tal noise feedthrough from input to output with SCLK and Fast 50MHz, 3-Wire, SPI/QSPI/MICROWIRE DIN input buffers powered down after completion of each Compatible Serial Interface serial input frame. On power-up, the MAX5214/MAX5216 Schmitt-Trigger Inputs for Direct Optocoupler reset the DAC output to zero, providing additional safety Interface for applications that drive valves or other transducers that need to be off on power-up. The DAC output is buffered Asynchronous CLR Clears DAC Output to Code 0 resulting in a low supply current of 80A (max) and a low High Reference Input Resistance for Power offset error of 0.25mV. A zero level applied to the CLR Reduction pin asynchronously clears the contents of the input and Buffered Voltage Output Directly Drives 10k Loads DAC registers and sets the DAC output to zero indepen- dent of the serial interface. The MAX5214/MAX5216 are available in an ultra-small (3mm x 5mm), 8-pin MAX package and are specified over the -40C to +105C extended industrial temperature range. Functional Diagram Applications 2-Wire Sensors V REF DD Communication Systems Automatic Tuning Gain and Offset Adjustment POR MAX5214 Power Amplifier Control MAX5216 CS SERIAL-TO- Process Control and Servo Loops SCLK PARALLEL INPUT DAC Portable Instrumentation 14-/16-BIT OUT CONVERTER REGISTER REGISTER DIN DAC Programmable Voltage and Current Sources BUFFER Automatic Test Equipment Ordering Information appears at end of data sheet. GND CLR QSPI is a trademark of Motorola, Inc. MAX is a registered trademark of Maxim Integrated Products, Inc. 19-5651 Rev 2 7/13MAX5214/MAX5216 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with SPI Interface Absolute Maximum Ratings V to GND .............................................................-0.3V to +6V Maximum Current into Any Input or Output ....................Q50mA DD REF, OUT, CLR to GND .............................. -0.3V to the lower of Operating Temperature Range ........................ -40NC to +105NC Storage Temperature Range ............................ -65NC to +150NC (V + 0.3V) and +6V DD SCLK, DIN, CS to GND ...........................................-0.3V to +6V Lead Temperature (soldering, 10s) ................................+300NC Soldering Temperature (reflow) ......................................+260NC Continuous Power Dissipation (T = +70NC) A FMAX (derate at 4.8mW/NC above +70NC) .................387mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Note 1) Package Thermal Characteristics FMAX Junction-to-Ambient Thermal Resistance (B ) ........206NC/W JA Junction-to-Case Thermal Resistance (B ) ...............42NC/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 2.7V to 5.5V, V = 2.5V to V , C = 60pF, R = 10kI, T = -40NC to +105NC, unless otherwise noted. Typical values are DD REF DD L L A at T = +25NC.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS STATIC ACCURACY (Note 3) MAX5214 14 Resolution N Bits MAX5216 16 MAX5214 (14-bit) (Note 4) -1 0.4 +1 Integral Nonlinearity INL MAX5216 (16-bit) (Note 4) -4 1.2 +4 LSB MAX5216B (16-bit) (Note 4) -8 3 +8 MAX5214 (14-bit) (Note 4) -1 0.1 +1 Differential Nonlinearity DNL LSB MAX5216 (16-bit) (Note 4) -1 0.25 +1 Offset Error OE (Note 5) -1.25 0.25 +1.25 mV Offset-Error Drift 1.6 V/C Gain Error GE (Note 5) -0.06 -0.04 0 %FS ppmFS/ Gain Temperature Coefficient 2 C REFERENCE INPUT Reference-Input Voltage Range V 2 V V REF DD Reference-Input Impedance R 200 256 k REF DAC OUTPUT No load (typical) VDD VDD - 10k load to GND 0 0.2 Output Voltage Range (Note 6) V VDD - 10k load to VDD 0.2 0.2 DC Output Impedance 0.1 Series resistance = 0 0.1 nF Capacitive Load (No Sustained C L Oscillations) Series resistance = 1k 15 F Maxim Integrated 2 www.maximintegrated.com