19-6149 Rev 0 2/12 MAX5816 Ultra-Small, Quad-Channel, 12-Bit Buffered Output DAC 2 with Internal Reference and I C Interface General Description Benefits and Features S Four High-Accuracy DAC Channels The MAX5816 4-channel, low-power, 12-bit, voltage- 12-Bit Accuracy Without Adjustment output digital-to-analog converter (DAC) includes output 1 LSB INL Buffered Voltage Output buffers and an internal reference that is selectable to be Guaranteed Monotonic Over All Operating 2.048V, 2.500V, or 4.096V. The MAX5816 accepts a wide Conditions supply voltage range of 2.7V to 5.5V with extremely low Independent Mode Settings for Each DAC power (3mW) consumption to accommodate most low- voltage applications. A precision external reference input S Three Precision Selectable Internal References allows rail-to-rail operation and presents a 100kI (typ) 2.048V, 2.500V, or 4.096V load to an external reference. S Internal Output Buffer 2 Rail-to-Rail Operation with External Reference The MAX5816 has an I C-compatible, 2-wire interface that 4.5s Settling Time operates at clock rates up to 400kHz. The DAC output is Outputs Directly Drive 2kI Loads buffered and has a low supply current of less than 250FA per channel and a low offset error of Q0.5mV (typ). On S Small 3mm x 3mm 10-Pin TDFN Package power-up, the MAX5816 resets the DAC outputs to zero, S Wide 2.7V to 5.5V Supply Range providing additional safety for applications that drive 2 S Fast 400kHz I C-Compatible, 2-Wire Serial valves or other transducers which need to be off on pow- Interface er-up. The internal reference is initially powered down to S Power-On-Reset to Zero-Scale DAC Output allow use of an external reference. The MAX5816 allows simultaneous output updates using software LOAD com- S Three Software-Selectable Power-Down Output mands. Multiple devices can simultaneously be updated Impedances using software load command in combination with the 1kI, 100kI, or High Impedance broadcast ID. The MAX5816 is available in a 10-pin TDFN package and is specified over the -40NC to +125NC temperature range. Applications Functional Diagram Programmable Voltage and Current Sources Gain and Offset Adjustment V REF DD Automatic Tuning and Optical Control INTERNAL REFERENCE/ MAX5816 Power Amplifier Control and Biasing EXTERNAL BUFFER Process Control and Servo Loops SCL 1 OF 4 DAC CHANNELS 2 I C SERIAL CODE DAC 8-/10-/12-BIT SDA Portable Instrumentation INTERFACE REGISTER LATCH DAC OUTA BUFFER ADDR Data Acquisition OUTB OUTC CLEAR/ CLEAR/ CODE RESET LOAD RESET 100kI 1kI OUTD Ordering Information appears at end of data sheet. POR DAC CONTROL LOGIC POWER-DOWN GND For related parts and recommended products to use with this part, refer to: www.maxim-ic.com/MAX5816.related Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.MAX5816 Ultra-Small, Quad-Channel, 12-Bit Buffered Output DAC 2 with Internal Reference and I C Interface ABSOLUTE MAXIMUM RATINGS V to GND .............................................................-0.3V to +6V Maximum Continuous Current into Any Pin ....................Q50mA DD OUT , REF to GND ....0.3V to the lower of (V + 0.3V) and +6V Operating Temperature .................................... -40NC to +125NC DD Storage Temperature ....................................... -65NC to +150NC SCL, SDA to GND ...................................................-0.3V to +6V Lead Temperature (soldering, 10s) ................................+300NC ADDR to GND ........-0.3V to the lower of (V + 0.3V) and +6V DD Soldering Temperature (reflow) .................................... +260NC Continuous Power Dissipation (T = +70NC) A TDFN (derate at 24.4mW/NC above 70NC) .............1951.2mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) TDFN Junction-to-Ambient Thermal Resistance ( ) .........41NC/W JA Junction-to-Case Thermal Resistance ( ) .................9NC/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (V = 2.7V to 5.5V, V = 0V, C = 200pF, R = 2kI, T = -40NC to +125NC, unless otherwise noted. Typical values are at DD GND L L A T = +25NC.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC PERFORMANCE (Note 3) Resolution and Monotonicity N 12 Bits Integral Nonlinearity (Note 4) INL -1 Q0. 5 +1 LSB Differential Nonlinearity (Note 4) DNL -1 Q0.2 +1 LSB Offset Error (Note 5) OE -5 Q0.5 +5 mV Offset Error Drift Q10 FV/NC Gain Error (Note 5) GE -1.0 Q0.1 +1.0 %FS ppm of Gain Temperature Coefficient With respect to V Q3.0 REF FS/NC Zero-Scale Error 0 10 mV Full-Scale Error With respect to V -0.5 +0.5 %FS REF DAC OUTPUT CHARACTERISTICS No load 0 V DD V - DD Output Voltage Range (Note 6) 0 V 2kI load to GND 0.2 2kI load to V 0.2 V DD DD Maxim Integrated Products 2