MAX5876 19-3634 Rev 2 3/07 12-Bit, 250Msps, High-Dynamic-Performance, Dual DAC with LVDS Inputs General Description Features The MAX5876 is an advanced 12-bit, 250Msps, dual 250Msps Output Update Rate digital-to-analog converter (DAC). This DAC meets the Noise Spectral Density = -154dBFS/Hz demanding performance requirements of signal synthesis at f = 16MHz applications found in wireless base stations and other OUT communications applications. Operating from +3.3V and Excellent SFDR and IMD Performance +1.8V supplies, this dual DAC offers exceptional dynamic SFDR = 75dBc at f = 16MHz (to Nyquist) OUT performance such as 75dBc spurious-free dynamic range SFDR = 71dBc at f = 80MHz (to Nyquist) OUT (SFDR) at f = 16MHz and supports update rates of OUT IMD = -87dBc at f = 10MHz OUT 250Msps, with a power dissipation of only 287mW. IMD = -73dBc at f = 80MHz OUT The MAX5876 utilizes a current-steering architecture ACLR = 75dB at f = 61MHz OUT that supports a 2mA to 20mA full-scale output current range, and allows a 0.1V to 1V differential output 2mA to 20mA Full-Scale Output Current P-P P-P voltage swing. The device features an integrated +1.2V LVDS-Compatible Digital and Clock Inputs bandgap reference and control amplifier to ensure On-Chip +1.20V Bandgap Reference high-accuracy and low-noise performance. A separate reference input (REFIO) allows for the use of an exter- Low 287mW Power Dissipation nal reference source for optimum flexibility and Compact 68-Pin QFN-EP Package (10mm x 10mm) improved gain accuracy. Evaluation Kit Available (MAX5878EVKIT) The clock inputs of the MAX5876 accept both LVDS and LVPECL-compatible voltage levels. The device fea- Ordering Information tures an interleaved data input that allows a single PIN- PKG LVDS bus to support both DACs. The MAX5876 is avail- PART TEMP RANGE PACKAGE CODE able in a 68-pin QFN package with an exposed pad (EP) and is specified for the extended temperature MAX5876EGK-D -40C to +85C 68 QFN-EP* G6800-4 range (-40C to +85C). MAX5876EGK+D -40C to +85C 68 QFN-EP* G6800-4 Refer to the MAX5877 and MAX5878 data sheets for *EP = Exposed pad. pin-compatible 14-bit and 16-bit versions of the += Lead-free package. D = Dry pack. MAX5876, respectively. Refer to the MAX5873 data sheet for a CMOS-compatible version of the MAX5876. Pin Configuration Applications TOP VIEW Base Stations: Single-Carrier UMTS, CDMA, GSM Communications: Fixed Broadband Wireless Access, 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 Point-to-Point Microwave B0N 1 51 B8P Direct Digital Synthesis (DDS) N.C. 2 50 B9N N.C. 3 49 B9P Cable Modem Termination Systems (CMTS) N.C. 4 48 B10N Automated Test Equipment (ATE) N.C. 5 47 B10P N.C. 6 46 B11N Instrumentation N.C. 7 45 B11P N.C. 8 44 SELIQN N.C. 9 43 SELIQP Selector Guide MAX5876 GND 10 42 XORP DV 11 41 XORN RESOLUTION UPDATE LOGIC DD3.3 PART GND 12 40 PD (BITS) RATE (Msps) INPUTS GND 13 39 TORB MAX5873 12 200 CMOS AV 14 38 CLKP DD3.3 GND 15 37 CLKN MAX5874 14 200 CMOS REFIO 16 36 GND MAX5875 16 200 CMOS FSADJ 17 35 AV CLK 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 MAX5876 12 250 LVDS MAX5877 14 250 LVDS MAX5878 16 250 LVDS QFN Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLE DACREF B0P AV B1N DD1.8 GND B1P AV B2N DD3.3 AV B2P DD3.3 GND B3N OUTQN B3P OUTQP DV DD1.8 GND B4N GND B4P OUTIN B5N OUTIP B5P GND B6N AV DD3.3 B6P AV B7N DD3.3 GND B7P AV B8N DD1.812-Bit, 250Msps, High-Dynamic-Performance, Dual DAC with LVDS Inputs ABSOLUTE MAXIMUM RATINGS AV , DV to GND, DACREF...................-0.3V to +2.16V Continuous Power Dissipation (T = +70C) DD1.8 DD1.8 A AV , DV , AV to GND, DACREF........-0.3V to +3.9V 68-Pin QFN-EP DD3.3 DD3.3 CLK REFIO, FSADJ to (derate 41.7mW/C above +70C) (Note 1)............3333.3mW GND, DACREF..................................-0.3V to (AV + 0.3V) Thermal Resistance (Note 1)...................................+24C/W DD3.3 JA OUTIP, OUTIN, OUTQP, Operating Temperature Range ......................... -40C to +85C OUTQN to GND, DACREF...................-1V to (AV + 0.3V) Junction Temperature .................................................... +150C DD3.3 CLKP, CLKN to GND, DACREF..............-0.3V to (AV + 0.3V) Storage Temperature Range ........................... -60C to +150C CLK B11P/B11NB0P/B0N, XORN, XORP, SELIQN, Lead Temperature (soldering, 10s) ............................... +300C SELIQP to GND, DACREF ...................-0.3V to (DV + 0.3V) DD1.8 TORB, PD to GND, DACREF ...............-0.3V to (DV + 0.3V) DD3.3 Note 1: Thermal resistance based on a multilayer board with 4 x 4 via array in exposed paddle area. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (AV = DV = AV = +3.3V, AV = DV = +1.8V, GND = 0, f = 2 x f , external reference V = +1.25V, out- DD3.3 DD3.3 CLK DD1.8 DD1.8 CLK DAC REFIO put load 50 double-terminated, transformer-coupled output, I = 20mA, T = T to T , unless otherwise noted. Typical values OUTFS A MIN MAX are at T = +25C.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS STATIC PERFORMANCE Resolution 12 Bits Integral Nonlinearity INL Measured differentially 0.2 LSB Differential Nonlinearity DNL Measured differentially 0.1 LSB Offset Error OS -0.025 0.001 +0.025 %FS Offset-Drift Tempco 10 ppm/C Full-Scale Gain Error GE External reference -4.6 -0.6 +4.6 %FS FS Internal reference 100 Gain-Drift Tempco ppm/C External reference 50 Full-Scale Output Current I (Note 3) 2 20 mA OUTFS Output Compliance Single-ended -0.5 +1.1 V Output Resistance R 1M OUT Output Capacitance C 5pF OUT DYNAMIC PERFORMANCE Clock Frequency f 2 500 MHz CLK Output Update Rate f f = f / 2 1 250 Msps DAC DAC CLK f = 150MHz f = 16MHz, -12dBFS -154 DAC OUT dBFS/ Noise Spectral Density Hz f = 250MHz f = 80MHz, -12dBFS -153 DAC OUT 2 MAX5876