MAX5877 19-3632 Rev 2 3/07 14-Bit, 250Msps, High-Dynamic-Performance, Dual DAC with LVDS Inputs General Description Features The MAX5877 is an advanced 14-bit, 250Msps, dual 250Msps Output Update Rate digital-to-analog converter (DAC). This DAC meets the Noise Spectral Density = -160dBFS/Hz demanding performance requirements of signal synthesis at f = 16MHz OUT applications found in wireless base stations and other Excellent SFDR and IMD Performance communications applications. Operating from +3.3V and SFDR = 75dBc at f = 16MHz (to Nyquist) OUT +1.8V supplies, this dual DAC offers exceptional dynamic SFDR = 71dBc at f = 80MHz (to Nyquist) OUT performance such as 75dBc spurious-free dynamic range IMD = -87dBc at f = 10MHz OUT (SFDR) at f = 16MHz and supports update rates of OUT IMD = -73dBc at f = 80MHz OUT 250Msps, with a power dissipation of only 287mW. ACLR = 75dB at f = 61MHz OUT The MAX5877 utilizes a current-steering architecture 2mA to 20mA Full-Scale Output Current that supports a 2mA to 20mA full-scale output current LVDS-Compatible Digital and Clock Inputs range, and allows a 0.1V to 1V differential output P-P P-P voltage swing. The device features an integrated +1.2V On-Chip +1.20V Bandgap Reference bandgap reference and control amplifier to ensure Low 287mW Power Dissipation high-accuracy and low-noise performance. A separate Compact 68-Pin QFN-EP Package (10mm x 10mm) reference input (REFIO) allows for the use of an exter- Evaluation Kit Available (MAX5878EVKIT) nal reference source for optimum flexibility and improved gain accuracy. Ordering Information The clock inputs of the MAX5877 accept both LVDS and LVPECL-compatible voltage levels. The device fea- PIN- PKG PART TEMP RANGE tures an interleaved data input that allows a single PACKAGE CODE LVDS bus to support both DACs. The MAX5877 is avail- MAX5877EGK-D -40C to +85C 68 QFN-EP* G6800-4 able in a 68-pin QFN package with an exposed pad (EP) and is specified for the extended temperature MAX5877EGK+D -40C to +85C 68 QFN-EP* G6800-4 range (-40C to +85C). *EP = Exposed pad. + = Lead-free package. D = Dry pack. Refer to the MAX5876 and MAX5878 data sheets for pin-compatible 12-bit and 16-bit versions of the MAX5877, respectively. Refer to the MAX5874 data Pin Configuration sheet for a CMOS-compatible version of the MAX5877. TOP VIEW Applications Base Stations: Single/Multicarrier UMTS, CDMA, GSM 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 Communications: Fixed Broadband Wireless Access, B2N 1 51 B10P Point-to-Point Microwave B1P 2 50 B11N B1N 3 49 B11P Direct Digital Synthesis (DDS) B0P 4 48 B12N Cable Modem Termination Systems (CMTS) B0N 5 47 B12P N.C. 6 46 B13N Automated Test Equipment (ATE) N.C. 7 45 B13P Instrumentation N.C. 8 44 SELIQN N.C. 9 43 SELIQP MAX5877 GND 10 42 XORP Selector Guide DV 11 41 XORN DD3.3 GND 12 40 PD RESOLUTION UPDATE LOGIC PART GND 13 39 TORB (BITS) RATE (Msps) INPUTS AV 14 38 CLKP DD3.3 MAX5873 12 200 CMOS GND 15 37 CLKN REFIO 16 36 GND MAX5874 14 200 CMOS FSADJ 17 35 AV CLK MAX5875 16 200 CMOS 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 MAX5876 12 250 LVDS MAX5877 14 250 LVDS MAX5878 16 250 LVDS QFN Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLE DACREF B2P AV B3N DD1.8 B3P GND AV B4N DD3.3 AV B4P DD3.3 GND B5N OUTQN B5P OUTQP DV DD1.8 B6N GND GND B6P OUTIN B7N OUTIP B7P GND B8N AV DD3.3 B8P AV DD3.3 B9N GND B9P AV B10N DD1.814-Bit, 250Msps, High-Dynamic-Performance, Dual DAC with LVDS Inputs ABSOLUTE MAXIMUM RATINGS AV , DV to GND, DACREF...................-0.3V to +2.16V Continuous Power Dissipation (T = +70C) DD1.8 DD1.8 A AV , DV , AV to GND, DACREF........-0.3V to +3.9V 68-Pin QFN-EP DD3.3 DD3.3 CLK REFIO, FSADJ to (derate 41.7mW/C above +70C) (Note 1)............3333.3mW GND, DACREF..................................-0.3V to (AV + 0.3V) Thermal Resistance (Note 1)...................................+24C/W DD3.3 JA OUTIP, OUTIN, OUTQP, Operating Temperature Range ......................... -40C to +85C OUTQN to GND, DACREF...................-1V to (AV + 0.3V) Junction Temperature .................................................... +150C DD3.3 CLKP, CLKN to GND, DACREF..............-0.3V to (AV + 0.3V) Storage Temperature Range ........................... -60C to +150C CLK B13P/B13NB0P/B0N, XORN, XORP, SELIQN, Lead Temperature (soldering, 10s) ............................... +300C SELIQP to GND, DACREF ...................-0.3V to (DV + 0.3V) DD1.8 TORB, PD to GND, DACREF ...............-0.3V to (DV + 0.3V) DD3.3 Note 1: Thermal resistance based on a multilayer board with 4 x 4 via array in exposed paddle area. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (AV = DV = AV = +3.3V, AV = DV = +1.8V, GND = 0, f = 2 x f , external reference V = +1.25V, out- DD3.3 DD3.3 CLK DD1.8 DD1.8 CLK DAC REFIO put load 50 double-terminated, transformer-coupled output, I = 20mA, T = T to T , unless otherwise noted. Typical values OUTFS A MIN MAX are at T = +25C.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS STATIC PERFORMANCE Resolution 14 Bits Integral Nonlinearity INL Measured differentially 0.5 LSB Differential Nonlinearity DNL Measured differentially 0.2 LSB Offset Error OS -0.025 0.001 +0.025 %FS Offset-Drift Tempco 10 ppm/C Full-Scale Gain Error GE External reference -4.6 -0.6 +4.6 %FS FS Internal reference 100 Gain-Drift Tempco ppm/C External reference 50 Full-Scale Output Current I (Note 3) 2 20 mA OUTFS Output Compliance Single-ended -0.5 +1.1 V Output Resistance R 1M OUT Output Capacitance C 5pF OUT DYNAMIC PERFORMANCE Clock Frequency f 2 500 MHz CLK Output Update Rate f f = f / 2 1 250 Msps DAC DAC CLK f = 150MHz f = 16MHz, -12dBFS -160 DAC OUT dBFS/ Noise Spectral Density Hz f = 250MHz f = 80MHz, -12dBFS -157 DAC OUT 2 MAX5877