EVALUATION KIT AVAILABLE MAX5969A/MAX5969B IEEE 802.3af/at-Compliant, Powered Device Interface Controllers with Integrated Power MOSFET General Description Features S IEEE 802.3af/at Compliant The MAX5969A/MAX5969B provide a complete interface S 2-Event Classification for a powered device (PD) to comply with the IEEE 802.3af/at standard in a power-over-Ethernet (PoE) S Simplified Wall Adapter Interface system. The MAX5969A/MAX5969B provide the PD S PoE Classification 0 to 5 with a detection signature, classification signature, S 100V Input Absolute Maximum Rating and an integrated isolation power switch with inrush S Inrush Current Limit of 180mA Maximum current control. During the inrush period, the MAX5969A/ S Current Limit During Normal Operation Between MAX5969B limit the current to less than 180mA before 720mA and 880mA switching to the higher current limit (720mA to 880mA) S Current Limit and Foldback when the isolation power MOSFET is fully enhanced. The S Legacy UVLO at 36V (MAX5969A) devices feature an input UVLO with wide hysteresis and S IEEE 802.3af/at-Compliant, 40V UVLO (MAX5969B) long deglitch time to compensate for twisted-pair cable S Overtemperature Protection resistive drop and to assure glitch-free transition during S Thermally Enhanced, 3mm x 3mm, 10-Pin TDFN power-on/-off conditions. The MAX5969A/MAX5969B can withstand up to 100V at the input. The MAX5969A/MAX5969B support a 2-event classifica- Ordering Information tion method as specified in the IEEE 802.3at standard and provide a signal to indicate when probed by Type 2 UVLO PIN- power-sourcing equipment (PSE). The devices detect the PART TEMP RANGE THRESHOLD PACKAGE presence of a wall adapter power-source connection and (V) allow a smooth switchover from the PoE power source to MAX5969AETB+ -40NC to +85NC 10 TDFN-EP* 35.4 the wall power adapter. MAX5969BETB+ -40NC to +85NC 10 TDFN-EP* 38.6 The MAX5969A/MAX5969B also provide a power- +Denotes a lead(Pb)-free/RoHS-compliant package. good (PG) signal, two-step current limit and foldback, *EP = Exposed pad. overtemperature protection, and di/dt limit. The MAX5969A/MAX5969B are available in a space- saving, 10-pin, 3mm x 3mm, TDFN power package. These Pin Configuration devices are rated over the -40NC to +85NC extended temperature range. Applications TOP VIEW IEEE 802.3af/at Powered Devices IP Phones, Wireless Access Nodes, IP Security + V 1 10 CLS DD Cameras DET 2EC 29 WiMAX Base Station MAX5969A N.C. 3 8 PG MAX5969B I.C. 4 7 WAD EP* V 56 RTN SS TDFN (3mm 3mm) IEEE is a registered service mark of the Institute of Electrical *EP = EXPOSED PAD. CONNECT TO V . SS and Electronics Engineers, Inc. WiMAX is a registered certification mark and registered service mark of the WiMAX Forum. For pricing, delivery, and ordering information, please contact Maxim Direct 19-5008 Rev 1 7/15 at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com.MAX5969A/MAX5969B IEEE 802.3af/at-Compliant, Powered Device Interface Controllers with Integrated Power MOSFET ABSOLUTE MAXIMUM RATINGS V to V ..........................................................-0.3V to +100V Operating Temperature Range .......................... -40NC to +85NC DD SS Maximum Junction Temperature .....................................+150NC DET, RTN, WAD, PG, 2EC to V -0.3V to +100V SS ....................... Storage Temperature Range ............................ -65NC to +150NC CLS to V ..............................................................-0.3V to +6V SS Soldering Temperature (reflow) .................................... +260NC Maximum Current on CLS (100ms maximum) .................100mA Continuous Power Dissipation (T = +70NC) (Note 1) A 10-Pin TDFN (derate 24.4mW/NC above +70NC) Multilayer Board ........................................................1951mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 2) Junction-to-Ambient Thermal Resistance ( ) .................. 4NC/W JA Junction-to-Case Thermal Resistance ( ) ....................... 9NC/W JC Note 1: Maximum power dissipation is obtained using JEDEC JESD51-5 and JESD51-7 specifications. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal- tutorial. ELECTRICAL CHARACTERISTICS (V = (V - V ) = 48V, R = 24.9k, R = 619. RTN, WAD, PG, and 2EC unconnected, all voltages are referenced to V IN DD SS DET CLS SS, unless otherwise noted. T = T = -40NC to +85NC, unless otherwise noted. Typical values are at T = +25NC.) (Note 3) A J A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DETECTION MODE Input Offset Current I V = 1.4V to 10.1V (Note 4) 10 FA OFFSET IN Effective Differential Input V = 1.4V up to 10.1V with 1V step, IN dR 23.95 25.00 25.5 kI Resistance V = RTN = WAD = PG = 2EC (Note 5) DD CLASSIFICATION MODE Classification Disable V V rising (Note 6) 22.0 22.8 23.6 V TH,CLS IN Threshold Classification Stability Time 0.2 ms Class 0, R = 619I 0 3.96 CLS Class 1, R = 117I 9.12 11.88 CLS V = 12.5V to IN Class 2, R = 66.5I 17.2 19.8 CLS 20.5V, V = DD Classification Current I mA CLASS RTN = WAD = Class 3, R = 43.7I 26.3 29.7 CLS PG = 2EC Class 4, R = 30.9I 36.4 43.6 CLS Class 5, R = 21.3I 52.7 63.3 CLS TYPE 2 (802.3at) CLASSIFICATION MODE Mark Event Threshold V V falling 10.1 10.7 11.6 V THM IN Hysteresis on Mark Event 0.84 V Threshold V falling to enter mark event, 5.2V P V IN IN Mark Event Current I 0.25 0.85 mA MARK P 10.1V 2 Maxim Integrated