EVALUATION KIT AVAILABLE MAX5977A/MAX5977B 1V to 16V, Single-Channel, Hot-Swap Controllers with Precision Current-Sensing Output General Description Features The MAX5977A/MAX5977B hot-swap controllers provide 1% Accurate Current-Sense Amplifier Output complete protection for systems with a 1V to 16V single- Hot-Swap Monitors Operation from 1V to 16V supply voltage. Integrated Charge Pump Fully Enhances the During the initial insertion, the hot-swap controllers limit External n-Channel FET (V = V + 5V) GATE IN the inrush current from damaging the board or from short- VariableSpeed/BiLevel Fault Protection Provides ing out the backplane. When the input voltage is above Electronic Circuit-Breaker Function the undervoltage threshold and below the overvoltage threshold, a 5A current source powered from the internal Output Latched Off After Fault Condition (MAX5977A) 5V charge pump drives the gate of an external n-channel MOSFET, providing a slow turn-on response. An internal Autoretry After Fault Condition (MAX5977B) current-sense amplifier in the IC monitors the current Power-Good Indicator across an external shunt resistor, providing current sens- Calibration Mode ing for wide input-sense voltage range. The devices pro- vide two levels of overcurrent circuit-breaker protections: Small, 20-Pin, 4mm x 4mm TQFN-EP Package a fast-trip threshold for a fast turn-off and a lower slow-trip threshold for a delayed turn-off. Applications Exceeding either of the overcurrent circuit-breaker thresh- Servers olds forces the device into fault mode where the exter- Storage Systems nal n-channel MOSFET is disabled. The MAX5977 is Network Switches and Routers available in two versions that provide a latched-off General Hot-Swap (MAX5977A) or autoretry (MAX5977B) output when the device is in fault mode. Ordering Information appears at end of data sheet. A calibration mode allows further calibration of the inte- grated transconductance amplifier for production testing of the final design. The devices are offered in a 20-pin, 4mm x 4mm, TQFN-EP package and are fully specified VariableSpeed/BiLevel is a trademark of Maxim Integrated Products, Inc. from -40C to +85C. Typical Application Circuit RSENSE V IN TO LOAD 1V TO 16V C L R R R GATE SCOMP FCOMP R CAL C GATE SCOMP FCOMP IN SENSE GATE CALSENSE SOURCE CURRENT-SENSE CSOUT AMPLIFIER OUTPUT RCSOUT CALIBRATION CAL MODE INPUT MAX5977A +3.3V MAX5977B 2.7V TO 16V PWR FAULT FAULT OUTPUT PG POWER-GOOD OUTPUT AGND GND 19-5553 Rev 3 10/16MAX5977A/MAX5977B 1V to 16V, Single-Channel, Hot-Swap Controllers with Precision Current-Sensing Output Absolute Maximum Ratings PWR, SENSE, IN, FCOMP, SCOMP, Continuous Power Dissipation (T = +70C) A GATE, SOURCE, CALSENSE to GND .............-0.3V to +28V 20-Pin TQFN, Single-Layer Board PG, CAL, BIAS, UV, OV, FAULT, CSOUT to GND ...-0.3V to +6V (derate 16.9mW/C above +70C) .........................1355.9mW REG to GND..........................................................-0.3V to +4V 20-Pin TQFN, Multilayer Board GATE to SOURCE ..................................................-0.3V to +6V (derate 25.6mW/C above +70C) .........................2051.3mW IN to FCOMP, IN to SCOMP, IN to SENSE, Operating Temperature Range ........................... -40C to +85C IN to CALSENSE .................................................-0.3V to +1V Junction Temperature ......................................................+150C GND to AGND ......................................................-0.3V to +0.3V Storage Temperature Range ............................ -65C to +150C FAULT, PG Current ............................................ -1mA to +50mA Lead Temperature (soldering, 10s) .................................+300C GATE, SOURCE, GND Current .......................................750mA Soldering Temperature (reflow) .......................................+260C Input/Output Current (all other pins)...................................20mA Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 20-PIN TQFN Package Code T2044+3 Outline Number 21-0139 Land Pattern Number 90-0037 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) Single-Layer Board +59C/W JA Junction to Ambient ( ) Multilayer Board +39C/W JA Junction to Case ( ) Single-Layer and Multilayer JC +6C/W Board For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com