MAX6023 19-2182 Rev 2 12/02 Precision, Low-Power, Low-Dropout, UCSP Voltage Reference General Description Features The MAX6023 is a family of low-dropout, micropower 5-Bump UCSP Package (1.0mm 1.5mm 0.3mm) voltage references in a 5-bump, chip-scale package No Output Capacitor Needed (UCSP). The MAX6023 series-mode (three-terminal) references, which operate with input voltages from 2.5V 0.2% (max) Initial Accuracy to 12.6V (1.25V and 2.048V options) or (V + 0.2V) to OUT 30ppm/C (max) Temperature Coefficient 12.6V (all other voltage options), are available with out- 35A (max) Quiescent Supply Current put voltage options of 1.25V, 2.048V, 2.5V, 3.0V, 4.096V, 4.5V, and 5.0V. These devices are guaranteed 0.8A/V (max) Supply Current Variation with V IN an initial accuracy of 0.2% and 30ppm/C tempera- 100mV Dropout at 500A Load Current ture drift over the -40C to +85C extended temperature range. Line Regulation: 160V/V (max) UCSPs offer the benefit of moving to smaller footprint Output Voltage Options: 1.25V, 2.048V, 2.5V, 3.0V, and lower profile devices, significantly smaller than even 4.096V, 4.5V, 5.0V SC70 or SOT23 plastic surface-mount packages. The significantly lower profile (compared to plastic SMD Ordering Information packages) of the UCSP makes the device ideal for height-critical applications. Miniature UCSP packages BUMP- TOP PART TEMP RANGE PACKAGE MARK also enable device placement close to sources and allow more flexibility in a complex or large design layout. MAX6023EBT12-T -40C to +85C 5 UCSP*-5 AAO The MAX6023 voltage references use only 27A of sup- MAX6023EBT21-T -40C to +85C 5 UCSP-5 AAT ply current. And unlike shunt-mode (two-terminal) refer- MAX6023EBT25-T -40C to +85C 5 UCSP-5 AAP ences, the supply current of the MAX6023 family varies MAX6023EBT30-T -40C to +85C 5 UCSP-5 AAS only 0.8A/V with supply-voltage changes, translating to MAX6023EBT41-T -40C to +85C 5 UCSP-5 AAQ longer battery life. Additionally, these internally compen- sated devices do not require an external compensation MAX6023EBT45-T -40C to +85C 5 UCSP-5 AAR capacitor and are stable up to 2.2nF of load capaci- MAX6023EBT50-T -40C to +85C 5 UCSP-5 AAU tance. The low-dropout voltage and the low supply cur- *UCSP reliability is integrally linked to the users assembly meth- rent make these devices ideal for battery-operated ods, circuit board material, and environment. See the UCSP systems. Reliability Notice in the UCSP Reliability section of this data sheet Applications for more information. Hand-Held Equipment Data Acquisition Systems Typical Operating Circuit Industrial and Process Control Systems +SUPPLY INPUT (SEE SELECTOR GUIDE) Battery-Operated Equipment Hard-Disk Drives IN OUT REFERENCE Selector Guide OUT * PART V (V) INPUT VOLTAGE (V) MAX6023 OUT MAX6023EBT12 1.250 2.5V to 12.6 MAX6023EBT21 2.048 2.5V to 12.6 GND MAX6023EBT25 2.500 (V + 200mV) to 12.6 OUT MAX6023EBT30 3.000 (V + 200mV) to 12.6 OUT MAX6023EBT41 4.096 (V + 200mV) to 12.6 OUT *CAPACITOR IS OPTIONAL. MAX6023EBT45 4.500 (V + 200mV) to 12.6 OUT MAX6023EBT50 5.000 (V + 200mV) to 12.6 OUT Pin Configuration appears at end of data sheet. UCSP is a trademark of Maxim Integrated Products, Inc. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.Precision, Low-Power, Low-Dropout, UCSP Voltage Reference ABSOLUTE MAXIMUM RATINGS (Voltages Referenced to GND) Continuous Power Dissipation (T = +70C) A IN.........................................................................-0.3V to +13.5V 5-Bump UCSP (derate 3.4mW/C above +70C)........273mW OUT .............................................................-0.3V to (V + 0.3V) Operating Temperature Range ..........................-40C to +85C IN Output Short Circuit to GND or IN (V < 6V) ............Continuous Storage Temperature Range .............................-65C to +150C IN Output Short Circuit to GND or IN (V 6V) .........................60s Bump Temperature (soldering, 10s)................................+300C IN Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of solder profiles recom- mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICSMAX6023EBT12 (V = 1.250V) OUT (V = +5V, I = 0, T = T to T , unless otherwise noted. Typical values are at T = +25C.) (Note 2) IN OUT A MIN MAX A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS OUTPUT Output Voltage V T = +25C 1.247 1.250 1.253 V OUT A Initial Voltage Accuracy T = +25C -0.24 +0.24 % A Output Voltage Temperature (Note 3) 10 30 ppm/C Coefficient V / OUT Line Regulation 2.5V V 12.6V 10 80 V/V IN V IN 0 I 400A 0.4 1.0 V / OUT OUT Load Regulation V/A I OUT -400A I 0 0.5 1.1 OUT Short to GND 4 Short-Circuit Current I mA SC Short to IN 10 Temperature Hysteresis (Note 4) 90 ppm V / ppm/ OUT Long-Term Stability 1000hr at T = +25C30 A time 1000hr DYNAMIC CHARACTERISTICS f = 0.1Hz to 10Hz 25 Vp-p Noise Voltage e OUT f = 10Hz to 10kHz 65 V RMS V / OUT Ripple Rejection V = +5V 100mV, f = 120Hz 86 dB IN I OUT To V within 0.1% of final value, OUT Turn-On Settling Time t 30 s R C = 50pF OUT Capacitive-Load Stability Range C (Note 3) 0 2.2 nF OUT INPUT Supply-Voltage Range V Guaranteed by line-regulation test 2.5 12.6 V IN Supply Current I 27 35 A IN Change in Supply Current I / V 2.5V V 12.6V 0.8 2.0 A/V IN IN IN 2 MAX6023