EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX6495MAX6499 72V, Overvoltage-Protection Switches/Limiter Controllers with an External MOSFET General Description Benefits and Features The MAX6495MAX6499 is a family of small, low-current, Integration and Small Package Saves Board Space overvoltage-protection circuits for high-voltage transient While Ensuring Reliable System Operation systems such as those found in automotive and industrial 3mm x 3mm TDFN Package applications. These devices monitor the input voltage and Supply Voltage Range: +5.5V to +72V control an external nMOSFET switch to isolate the load Fast Gate Shutoff During Overvoltage with 100mA Sink Capability at the output during an input overvoltage condition. The Internal Charge-Pump Circuit Ensures 10V Gate-to- devices operate over a wide supply voltage range from Source Enhancement for Low R Performance DS(ON) +5.5V to +72V. Supports Series pMOSFET for Reverse-Battery The gate of the nMOSFET is driven high while the Voltage Protection (MAX6496) monitored input is below the user-adjustable overvoltage POK Indicator (MAX6497/MAX6498) threshold. An integrated charge-pump circuit provides a Adjustable Overvoltage Threshold 10V gate-to-source voltage to fully enhance the nMOSFET. Adjustable Undervoltage Threshold (MAX6499) When the input voltage exceeds the user-adjusted over- Integrated Protection Features and Wide voltage threshold, the gate of the MOSFET is quickly Temperature Range Improve Reliability pulled low, disconnecting the load from the input. In some Overvoltage-Protection Switch Controller Allows applications, disconnecting the output from the load is not User to Size External nMOSFETs desirable. In these cases, the protection circuit can be nMOSFET Latches Off After an Overvoltage Condition (MAX6497/MAX6499) configured to act as a voltage limiter where the GATE output Thermal-Shutdown Protection saw-tooths to limit the voltage to the load (MAX6495/ -40C to +125C Operating Temperature Range MAX6496/MAX6499). AEC-Q100 Qualified (MAX6495ATT/V+, The MAX6496 supports lower input voltages and reduces MAX6496ATA/V+T, and MAX6499ATA/V+ Only) power loss by replacing the external reverse battery diode with an external series pMOSFET. The MAX6496 generates Applications the proper bias voltage to ensure that the pMOSFET is Automotive on during normal operations. The gate-to-source voltage is Industrial clamped during load-dump conditions, and the pMOSFET is Telecom/Servers/Networking off during reverse-battery conditions. FireWire The MAX6497/MAX6498 feature an open-drain, undedicated Notebook Computers comparator that notifies the system if the output falls Selector Guide and Ordering Information appear at end of below the programmed threshold. The MAX6497 keeps data sheet. the MOSFET switch latched off until either the input power or the SHDN pin is cycled. The MAX6498 will autoretry when V falls below 130mV. OVSET These devices are available in small, thermally enhanced, 6-pin and 8-pin TDFN packages and are fully specified from -40C to +125C. FireWire is a registered trademark of Apple, Inc. 19-3778 Rev 18 2/21MAX6495MAX6499 72V, Overvoltage-Protection Switches/Limiter Controllers with an External MOSFET (All pins referenced to GND.) Absolute Maximum Ratings IN, GATE, GATEP .................................................-0.3V to +80V Continuous Power Dissipation (T = +70C) A SHDN, CLEAR ...........................................-0.3V to (V + 0.3V) 6-Pin TDFN (derate 23.8mW/C above +70C) .....1904.8mW IN POK, OUTFB .........................................................-0.3V to +80V 8-Pin TDFN (derate 24.4mW/C above +70C) .....1951.2mW GATE to OUTFB ....................................................-0.3V to +12V Operating Temperature Range ......................... -40C to +125C GATEP to IN ..........................................................-12V to +0.3V Junction Temperature ......................................................+150C OVSET, UVSET, POKSET ....................................-0.3V to +12V Storage Temperature Range ............................ -60C to +150C Current Sink/Source (All Pins) ...........................................50mA Lead Temperature (soldering, 10s) .................................+300C All Other Pins to GND ................................-0.3V to (V + 0.3V) Soldering Temperature (reflow) .......................................+260C IN Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 6 TDFN-EP PACKAGE CODE T633+2 Outline Number 21-0137 Land Pattern Number 90-0058 Thermal Resistance, Single-Layer Board: Junction to Ambient ( ) 55C/W JA Junction to Case ( ) 9C/W JC Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 42C/W JA Junction to Case ( ) 9 JC 8 TDFN-EP PACKAGE CODE T833+2 Outline Number 21-0137 Land Pattern Number 90-0059 Thermal Resistance, Single-Layer Board: Junction to Ambient ( ) 54C/W JA Junction to Case ( ) 8C/W JC Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 41C/W JA Junction to Case ( ) 8C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com