ABRIDGED EVALUATION KIT AVAILABLE DATA SHEET MAX66240 DeepCover Secure Authenticator with ISO 15693, SHA-256, and 4Kb User EEPROM General Description Features and Benefits DeepCover embedded security solutions cloak sensitive Dedicated Hardware-Accelerated SHA Engine for data under multiple layers of advanced physical security Generating SHA-256 MACs to provide the most secure key storage possible. Strong Authentication with a High Bit Count User- The DeepCover Secure Authenticator (MAX66240) is a Programmable Secret and Input Challenge transponder IC that combines an ISO/IEC 15693 and ISO 4096 Bits of User EEPROM with User-Programmable 18000-3 Mode 1-compatible RF front-end, a FIPS 180- R/W Protection Options Including OTP/EPROM based SHA-256 engine, and 4096 bits of user EEPROM Emulation Mode in a single chip. A bidirectional security model enforces Unique Factory-Programmed 64-Bit Identification two-way authentication between a host system and the Number MAX66240. Each device has its own guaranteed unique ISO/IEC 15693: Up to 26kbps 64-bit ROM ID that is factory programmed into the chip. This ROM ID is used as a fundamental input parameter 2kV HBM ESD Protection for All Pins for cryptographic operations and serves as an electronic serial number within the application. Applications Access Control Asset Tracking Printer Cartridge Configuration and Monitoring Medical Sensor Authentication and Calibration System Intellectual Property Protection Ordering Information appears at end of data sheet. Typical Application Circuit 13.56MHz READER MAGNETIC TRANSMITTER COUPLING MAX66240 TX OUT IC LOAD RECEIVER RX IN SWITCHED LOAD ANTENNA For related parts and recommended products to use with this part, refer DeepCover is a registered trademark of Maxim Integrated to www.maximintegrated.com/MAX66240.related. Products, Inc. 219-0042 Rev 5 4/19ABRIDGED DATA SHEET MAX66240 DeepCover Secure Authenticator with ISO 15693, SHA-256, and 4Kb User EEPROM Absolute Maximum Ratings Voltage Range on Any Pin Relative to GND ........-0.5V to +4.0V Junction Temperature ......................................................+150C Maximum RMS Current, AC1 to AC2 .................................30mA Storage Temperature Range ............................ -55C to +125C Maximum Incident Magnetic Field Strength Lead Temperature (soldering, 10s) .................................+300C (ISO/IEC 7810-compliant antenna) ................... 141.6dBA/m Soldering Temperature (reflow) .......................................+260C Operating Temperature Range ........................... -40C to +85C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Note 1) Package Thermal Characteristics SO TDFN Junction-to-Ambient Thermal Resistance ( ).........136C/W Junction-to-Ambient Thermal Resistance ( )...........60C/W JA JA Junction-to-Case Thermal Resistance ( ) ...............38C/W Junction-to-Case Thermal Resistance ( ) ...............30C/W JC JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (T = -40C to +85C, unless otherwise noted.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS SHA-256 ENGINE Computation Time t (Note 3) 2 ms CSHA EEPROM Programming Time for a 32-Bit t (Note 4) 10 ms PROG Page Block or Protection Write/Erase Cycling Endurance N T = +85C (Notes 5, 6) 100k CY A Data Retention T = +85C (Notes 7, 8, 9) 10 Years t A DR RF PORT Carrier Frequency f (Note 10) 13.553 13.560 13.567 MHz C Internal Tuning Cap C f = 13.56MHz (Note 11) 27.5 pF TUN Operating Field H (Note 10) 150 5000 mA/m ISO T = +25C, 10% modulation A H 94 MIN 10 (Notes 11, 12) T = +25C, 30% modulation A Activation Field Strength H 104 dBA/m MIN 30 (Notes 11, 12) T = +25C, 100% modulation A H 103.5 MIN 100 (Notes 11, 12) Write/SHA Field Strength H T = +25C (Notes 11, 12, 13) 113 dBA/m WR A RF Access in Progress Time t 1.1 ms RFAIP 10% Carrier Modulation Index CMI 10 (Notes 10, 11) 10 30 % MI = (A - B)/(A + B) 100% Carrier Modulation Index CMI 100 (Notes 10, 11) 95 100 % MI = (A - B)/(A + B) 10% Modulation Min Pulse Refer to ISO 15693-2 Section t 7.0 s 1 MIN Width 7.1 (Notes 11, 14) Maxim Integrated 2 www.maximintegrated.com