EVALUATION KIT AVAILABLE MAX77756 24V Input, 500mA Buck Regulator with Dual-Input Power MUX General Description Benefits and Features The MAX77756 is a synchronous 500mA step-down Wide Input Power Supply DC-DC converter with integrated dual-input power multi- 3V to 24V Supply Voltage plexer (MUX). The converter operates on an input supply 500mA (max) Output Current as low as 3.0V and as high as 24V. Default output volt- 1.8V, 3.3V, or 5.0V Factory-Set V with OUT 2 age is factory-programmed to either 1.8V, 3.3V, or 5.0V. Optional I C Control: 1.5V to 7.5V in 50mV Steps Output voltage is further adjustable through external External Feedback Resistor V Option (1V to OUT 2 resistors or an I C serial interface. 99% V ) SUP Hardware or Software Enable The dual-input power MUX selects the higher voltage from two different input sources to power the step-down Dual-Input Power MUX Replaces Common-Cathode converter. Control circuitry ensures that only one channel Diode Arrays of the MUX is on at a time to prevent cross-conduction Automatic Ideal-Diode ORing Voltage Selector between input sources. For single-input applications, the 250m MOSFETs Minimize Power Consumption, MUX can be bypassed and the step-down converter can BOM, and Solution Size be powered directly from the SUP pin. Low I Enables Always-On Rails Q The MAX77756 is available in a small 2.33mm x 1.42mm 1.5A Quiescent Current (Only SUP Powered) (0.7mm max height), 15-bump wafer-level package 19A Quiescent Current (IN1/IN2 Powered) (WLP). For a similar buck converter without a power 88% Peak Efficiency (12V , 3.3V ) SUP OUT MUX, refer to the MAX77596. Safe and Easy to Use Short-Circuit Hiccup Mode and Thermal Protection Applications 8ms Soft-Start USB Type-C Power Delivery Accessories and Software-Enabled Spread Spectrum Devices Pin-Programmable Inductor Peak Current Level Notebook and Tablet Computers Small Size Home Automation, Low I Smart Hubs Q 2.33mm x 1.42mm (0.7mm max height) Battery-Powered Systems, Backup Battery, Wafer-Level Package (WLP) Uninterruptible Rails 15-Bump, 0.4mm Pitch, 3 x 5 Array Ordering Information appears at end of data sheet. Simplified Block Diagram POWER MUX 3V TO 24V DC SOURCE 1 IN1 - MAIN BATTERY - USB PD PROVIDER SUP IDEAL 3V TO 24V DC SOURCE 2 IN2 - BACKUP BATTERY - SOLAR CELL ARRAY BST 10H LX V IO V OUT BUCK 1.5V TO 7.5V SDA CONVERTER HARDWARE OR OUT/ FB DIGITAL 1.8V, 3.3V, 5.0V DEFAULTS SOFTWARE SCL 500mA MAX CONTROL ENABLE POK POWER OK EN PGND AGND, ILIM, BIAS PINS NOT DRAWN 24V, 500mA DC-DC BUCK CONVERTER WITH IDEAL-DIODE ORING MUX 19-8710 Rev 1 10/17MAX77756 24V Input, 500mA Buck Regulator with Dual-Input Power MUX Absolute Maximum Ratings IN1, IN2, SUP to PGND ........................................-0.3V to +26V IN1, IN2 Repetitive Forward Current (T = +85C) A BIAS to PGND .........................................................-0.3V to +6V 10% Duty Square Wave ...................................................4.1A EN to PGND ..............................................-0.3V to V + 0.3V IN1, IN2 SUP Continuous Current ................................1.6A SUP RMS BST to LX ..............................................................................+6V LX Continuous Current (Note 1)....................................1.6A RMS BST to PGND ........................................................-0.3V to +31V OUT/FB Short-Circuit Duration..................................Continuous OUT/FB to PGND ..................................................-0.3V to +12V Continuous Power Dissipation (T = +70C) A POK, ILIM to PGND .................................-0.3V to V + 0.3V (derate 16.22mW/C above +70C) ..........................1298mW BIAS POK, SDA Sink Current .....................................................20mA Operating Temperature Range ........................... -40C to +85C V to PGND ...........................................................-0.3V to +6V Junction Temperature ......................................................+150C IO SDA, SCL to PGND ......................................-0.3V to V + 0.3V Soldering Temperature (reflow) .......................................+260C IO AGND to PGND.................................................... -0.3V to +0.3V Note 1: LX has internal clamp diodes to PGND and SUP. Applications that forward bias these diodes should not exceed the ICs package power dissipation limits. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 15 WLP Package Code W151G2+1 Outline Number 21-100111 Land Pattern Number 90-100052 (Refer to Application Note 1891) Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 61.65C/W JA For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com