EVALUATION KIT AVAILABLE Click here to ask about the production status of specific part numbers. MAX77812 20A User-Configurable Quad-Phase Buck Converter General Description Benefits and Features The MAX77812 is a quad-phase high-efficiency step- 20A Maximum Output Current (5A per Phase) down (buck) converter capable of delivering up to 20A V Range: 2.5V to 5.5V IN of maximum current. Programmable startup/shutdown V Range: 0.250V to 1.525V with 5mV Steps OUT sequence and user-selectable phase configurations make the MAX77812 ideal for powering the latest generations 0.5% Initial Output Accuracy with Differential Sensing of processors. With high-efficiency and small solution 5 User-Selectable Phase Configurations size, the MAX77812 is optimized for space constrained 91% Peak Efficiency (V = 3.8V, V = 1.1V) IN OUT single-cell battery powered applications. Auto (SKIP/PWM) and Forced PWM Modes The MAX77812 uses an adaptive on-time PWM control Enhanced Load Transient Response scheme and it has SKIP and low-power SKIP modes for improved light-load efficiency. A programmable current Programmable Ramp-Up/Down Slew Rates limit reduces the overall solution footprint by optimizing Programmable Startup/Shutdown Sequence inductors size. Differential sensing provides high output UVLO, Short-Circuit, and Thermal Protections voltage accuracy, while enhanced transient response (ETR) allows fast output voltage adjustments to load tran- 2 User-Programmable General-Purpose Inputs sients. Programmable soft-start/stop and ramp-up/down 2 3.4MHz High Speed I C and 30MHz SPI Interface slew rate provides control over an inrush current as the 3.408mm x 3.368mm, 64-Bump WLP Package regulator transitions between operating states. 2 A 3.4MHz high-speed I C or 30MHz SPI interface with Applications dedicated logic inputs provide full configurability and CPU/GPU, FPGAs, and DSPs Power Supply control for system power optimization. AR/VR Headsets and Game Consoles The MAX77812 is available in 3.408mm x 3.368mm, Li-ion Battery Powered Equipment 64-bump 0.4mm pitch wafer-level package (WLP). Space Constrained Portable Electronics Ordering Information appears at end of data sheet. Typical Application Circuit VSYS SYS IN12 VSYS 1 DGND 5A 2.5V to 5.5V 2.5V to 5.5V + AGND 1 5A 0.25V to 1.525V + LX1 10A 1 5A SNS1P 2 CE MAX77812 10A + SNS1N + MULTI-PHASE 5A VVIO VIO PGND1 1 1 BUCK 5A + LX2 1 SNS2P 2 5A 10A IRQB SNS2N SCL PGND2 + SDA/MOSI 3 VSYS IN34 10A MISO 2 15A 2.5V to 5.5V SCS + I2C SPI SEL 0.25V to 1.525V EN LX3 1 5A 5A LPM SNS3P WDTRSTB IN SNS3N 4 20A GPI0 PGND3 0.25V to 1.525V PHASE-CONFIGURABLE GPI1 LX4 5A QUAD-OUTPUT V PH CFG0 SNS4P SYS PH CFG1 SNS4N 2.5V to 5.5V PH CFG2 PGND4 19-8541 Rev 11 12/20MAX77812 20A User-Configurable Quad-Phase Buck Converter Absolute Maximum Ratings SYS, VIO to AGND ...............................................-0.3V to +6.0V PGND1/2/3/4 to AGND .........................................-0.3V to +0.3V DGND to AGND .................................................... -0.3V to +0.3V SNS1P, SNS2P, SNS3P, SNS4P to AGND ..-0.3V to (V + 0.3V) IN SCL, SDA/MOSI, MISO, SCS, IRQB, CE, EN, LPM, GPI0, GPI1, SNS1N, SNS2N, SNS3N, SNS4N to AGND ........-0.3V to +0.3V WDTRSTB IN to DGND...................... -0.3V to (V + 0.3V) Continuous Power Dissipation at T = +70C VIO A PH CFG0, PH CFG1, PH CFG2, (derate 26.17mW/C above +70C) ..........................2094mW I2C SPI SEL to AGND ...................... -0.3V to (V + 0.3V) Junction Temperature ..................................................... +150C SYS IN12, IN34 to PGNDx ............................. -0.3V to (V + 0.3V) Storage Temperature Range ............................ -65C to +150C SYS LX1/2/3/4 to PGNDx .................................-0.3V to (V + 0.3V) Soldering Temperature (reflow) .......................................+260C IN LX1/2/3/4 to PGNDx (Pulsed <10ns Voltage) ......-3.0V to +7.0V Note 1: LXx node has internal clamp diodes to PGNDx and INx. Applications that give forward bias to these diodes should ensure that the total power loss does not exceed the power dissipation limit of IC package. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Recommended Operating Conditions TYPICAL PARAMETER SYMBOL CONDITION UNITS RANGE Input Voltage Range V 2.5 to 5.5 V IN For continuous operation at 5A (per phase), the junction temperature (T ) is limited to +115C. If the junction J Output Current Range I 0 to 5 A OUT temperature is higher than +115C, the expected lifetime at 5A continuous operation is reduced Junction Temperature T -40 to +125 C J Range Note: These limits are not guaranteed. Package Thermal Characteristics (Note 2) WLP Junction-to-Ambient Thermal Resistance ( ) .......33.2C/W JA Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics Top-Level Electrical Characteristics (V = V = +3.8V, V = +1.8V, T = T = -40C to +125C, typical values are at T = T = +25C) SYS INx VIO A J A J PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS GLOBAL INPUT SUPPLY Operating Voltage Range V 2.5 5.5 V SYS Shutdown Supply Current I CE = low, T = +25C 2 5 A SHDN A CE = high and all outputs are off, Standby Current I 25 A STBY T = +25C A Maxim Integrated 2 www.maximintegrated.com