Click here for production status of specific part numbers. MAX77813 5.5V Input, 2A, High-Efficiency Buck-Boost Converter General Description Features and Benefits The MAX77813 is a high-efficiency step-up/step-down V Range: 2.30V to 5.5V IN (buck-boost) converter targeted for single-cell Li+/Li-ion V Range: 2.60V to 5.14V OUT battery powered applications. The device maintains a 2 (I C Programmable in 20mV Steps) regulated output voltage from 2.6V to 5.14V across an Up to 2A Output Current in Boost Mode input voltage range of 2.3V to 5.5V. The device supports (V = 3.0V, V = 3.4V, ILIM = High) IN OUT up to 2A of output current in boost mode and up to 3A in buck mode. Up to 3A Output Current in Buck Mode (ILIM = High) The device seamlessly transitions between buck and Up to 97% Peak Efficiency boost modes. A unique control algorithm allows high- SKIP Mode for Optimal Light Load Efficiency efficiency, outstanding load, and line transient response. 55A (Typ) Low Quiescent Current Dedicated enable and power-OK pins allow simple hard- 2 3.4MHz High Speed I C Serial Interface 2 ware control. An I C serial interface is optionally used for Input Current Limit Selection Pin dynamic voltage scaling, system power optimization, and fault read-back. The device supports two inductor current Power-OK Output limit options selected by the ILIM pin. 2.5MHz Switching Frequency The MAX77813 is available in a 20-bump, 1.83mm x Protection Features 2.13mm wafer-level package (WLP). Soft-Start Thermal Shutdown Applications Overvoltage Protection Single-Cell Li+/Li-ion Battery Powered Devices Overcurrent Protection Handheld Scanners, Mobile Payment Terminals, 1.827mm x 2.127mm, 20-Bump WLP Security Cameras AR/VR Headsets Ordering Information appears at end of data sheet. Typical Application Circuit 1H BOOST TO BUCK LX1 LX2 LINE TRANSIENT RESPONSE MAX77813 IOUT = 1.5A DC INPUT IN OUT V OUT V = 3.3V OUT 2.3V TO 5.5V 3.4V 2.6V TO 5.14V 10F VSYS 2A (BOOST MODE) 2.9V 47F OUTS 1F V 500mV/div 3A (BUCK MODE) IN PGND BOOST BOOST BUCK MODE MODE MODE V IO SERIAL SDA 20mV/div V OUT HOST POWER-OK POK SCL CURRENT LIMIT ILIM ENABLE EN SELECT 100s/div HIGH-EFFICIENCY BUCK-BOOST CONVERTER 2 WITH OPTIONAL I C CONTROL IN TINY 20-BUMP WLP 19-8238 Rev 2 3/19MAX77813 5.5V Input, 2A, High-Efficiency Buck-Boost Converter Absolute Maximum Ratings SYS, V to GND .................................................-0.3V to +6.0V LX2 to PGND..........................................-0.3V to (V + 0.3V) IO OUT IN, OUT to PGND .................................................-0.3V to +6.0V LX1/LX2 Continuous RMS Current (Note 1) ........................3.2A PGND to GND ......................................................-0.3V to +0.3V Operating Junction Temperature Range .......... -40C to +125C SCL, SDA to GND ..................................... -0.3V to (V + 0.3V) Junction Temperature ......................................................+150C IO EN, ILIM, POK to GND........................... -0.3V to (V + 0.3V) Storage Temperature Range ............................ -65C to +150C SYS FB to GND ..............................................-0.3V to (V + 0.3V) Soldering Temperature (Reflow) ......................................+260C OUT LX1 to PGND..............................................-0.3V to (V + 0.3V) IN Note 1: LX1 and LX2 nodes have internal clamp diodes to PGNDBB and INBB. Applications that forward bias to these diodes should ensure that the total power loss does not exceed the power dissipation limit of the IC package. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information WLP Package Code W201F2+1 Outline Number 21-0771 Land Pattern Number Refer to Application Note 1891 Thermal Resistance, Four-Layer Board: Junction to Ambient Thermal Resistance ( ) 55.49C/W JA For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com