X-On Electronics has gained recognition as a prominent supplier of MAX77826EWJ+ Power Management Specialised - PMIC across the USA, India, Europe, Australia, and various other global locations. MAX77826EWJ+ Power Management Specialised - PMIC are a product manufactured by Analog Devices. We provide cost-effective solutions for Power Management Specialised - PMIC, ensuring timely deliveries around the world.

MAX77826EWJ+ Analog Devices

MAX77826EWJ+ electronic component of Analog Devices
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Part No.MAX77826EWJ+
Manufacturer: Analog Devices
Category: Power Management Specialised - PMIC
Description: Power Management Specialised - PMIC PMIC for smart phone
Datasheet: MAX77826EWJ+ Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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1 : USD 10.7424
10 : USD 9.6516
50 : USD 7.9841
100 : USD 7.7902
250 : USD 7.4389
500 : USD 6.8452
1000 : USD 6.7361
2500 : USD 6.5181
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We are delighted to provide the MAX77826EWJ+ from our Power Management Specialised - PMIC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MAX77826EWJ+ and other electronic components in the Power Management Specialised - PMIC category and beyond.

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EVALUATION KIT AVAILABLE MAX77826 Power Management IC General Description Benefits and Features The MAX77826 is a subpower management IC for the Compact Total Solution Size Allows More Peripheral latest 3G/4G smartphones and tablets. The MAX77826 Devices in Smartphones and Tablets contains a high-efficiency BUCK regulator, a BUCK 3A High-Efficiency BUCK Regulator 2 BOOST regulator and 15 LDOs to power up peripherals. DVS (Dynamic Voltage Scaling) Through HS I C The MAX77826 also provides power on/off control logic 1% (typ) Output Voltage DC Accuracy 2 Low Power Mode and an I C serial interface to program individual regulator output voltages and on/off control for complete flexibility. 2A BUCK BOOST Regulator 15 Linear Regulators with Remote Cap The linear regulators support a remote cap feature and 3 NMOS LDOs (V Range: 0.6V to 2.1875V OUT provide greater than 70dB PSRR and less than 45V RMS with 12.5mV Step) noise. 1 x 150mA 2 The MAX77826 features I C-compatible, 2-wire serial 1 x 450mA interface that comprises a bidirectional serial data line 1 x 600mA (SDA) and a serial clock line (SCL). The MAX77826 sup- 6 PMOSLV LDOs (V Range: 0.8V to 3.975V OUT ports SCL clock rates up to 3.4MHz. with 25mV Step) 3 x 150mA Applications 3 x 300mA GSM, GPRS, EDGE, CDMA WCDMA, and LTE 6 PMOSLS LDOs (V Range: 0.8V to 3.975V OUT Smartphones and Tablets with 25mV Step) 3 x 150mA Ordering Information appears at end of data sheet. 3 x 300mA 1.5% Typical Output Voltage DC Accuracy 70dB PSRR at 1kHz Low Power Mode with 2A (typ) for all LDOs Simple Management of Power-Up/Down Sequence, Output Voltage Setting, and Fault Detection 2 High-Speed (Up to 3.4MHz) I C Serial Interface 19-6893 Rev 1 7/15MAX77826 Power Management IC Absolute Maximum Ratings SYS, V , INL1, INL2, INL3, LDO1, LDO2 to GND .............................-0.3V to (V + 0.3V) IO INL1 INL4, INL5 to GND ...........................................-0.3V to +6.0V LDO3 to GND .........................................-0.3V to (V + 0.3V) INL2 INB to PGNDB......................................................-0.3V to +6.0V LDO4, LDO5, LDO6, LDO7, LDO8, INBB, OUTBB to PGNDBB ..................................-0.3V to +6.0V LDO9 to GND .....................................-0.3V to (V + 0.3V) INL3 PGNDB, PGNDBB to GND ..................................-0.3V to +0.3V LDO10, LDO11 to GND ..........................-0.3V to (V + 0.3V) INL4 IRQB, CE, SDA, SCL to GND ................. -0.3V to (V + 0.3V) LDO12, LDO13, LDO14, VIO FB B, ENBB, ENB, ENL12, LDO15 to GND ...................................-0.3V to (V + 0.3V) INL5 REFBYP to GND ................................ -0.3V to (V + 0.3V) LXB Continuous RMS Current (Note 1) ..................................3A SYS FB BB to PGNDBB ............................-0.3V to (V + 0.3V) LXBB1/LXBB2 Continuous RMS Current (Note 1) ..............3.3A OUTBB LXB to PGNDB ........................................ -0.3V to (V + 0.3V) Operating Temperature Range ........................... -40C to +85C INB LXBB1 to PGNDBB ............................... -0.3V to (V + 0.3V) Junction Temperature ......................................................+150C INBB LXBB2 to PGNDBB ............................-0.3V to (V + 0.3V) Storage Temperature Range ............................ -65C to +150C OUTBB Soldering Temperature (reflow) .......................................+260C Note 1: LX node has internal clamp diodes to PGND and INB . Applications that give forward bias to these diodes should ensure that the total power loss does not exceed ICs package power dissipation limits. (Note 2) Package Thermal Characteristics WLP Junction-to-Ambient Thermal Resistance ( ) ..........37C/W JA Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. General Electrical Characteristics (V = V = +3.7V, V = 1.8V, T = -40C to +85C, unless otherwise noted.) SYS IN IO A VPARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Shutdown Supply Current I CE = low 2.5 10 A SHDN SYS Standby Current I CE = high and all regulators are off 35 A Q SYS Shutdown V Current I All regulators are off 0 A IO SHDN VIO BUCK is on in normal mode No Load Supply Current 1 I 60 A NO LOAD1 (no switching) BUCK and BUCK BOOST are on in No Load Supply Current 2 I 120 A NO LOAD2 normal mode (no switching) All regulators are on in normal No Load Supply Current 3 I 400 700 A NO LOAD3 mode (no switching) V UNDERVOLTAGE LOCKOUT SYS V V rising 2.375 2.50 2.625 UVLO R SYS V Undervoltage Lockout SYS V Threshold V V falling (default) 2.05 UVLO F SYS REFERENCE REFBYP Output Voltage 0.786 0.80 0.814 V REFBYP Supply Rejection 2.7V V 5.5V 0.2 mV/V SYS Maxim Integrated 2 www.maximintegrated.com

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
ANALOG DEVICES
Analog Devices Hittite
ANALOG DEVICES (LINEAR TECHNOLOGY)
ANALOG DEVICES (MAXIM INTEGRATED)
ANALOG DEVICES (TRINAMIC)
Analog Devices / Hittite
Analog Devices / Linear Technology
Analog Devices Inc
Analog Devices Inc.
Analog Devices Inc./Maxim Integrated
Analog Devices, Inc.
DA4
Dallas
DALLAS / MAXIM
Dallas Semiconductor (VA)
HANSCHIP semiconductor
LINEAR
LINEAR TECH
Linear Technology
Linear Technology (part of ADI)
LT
LT4
MAXIM
Maxim Integrated
MAXIM INTEGRATED / ANALOG DEVICES
Maxim Integrated Products
MAXIM-DALLAS
MX4
Technology
Trinamic
TRINAMIC / ANALOG DEVICES
Trinamic Motion Control
Trinamic Motion Control GmbH

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