MAX8969 Step-Up Converter for Handheld Applications General Description Benefits and Features The MAX8969 is a simple 1A step-up converter in a small Flexible System Integration package that operates in any single-cell Li-ion application. Up to 1A Output Current 2.5V to 5.5V Input Voltage Range This IC provides protection features such as input undervolt- age lockout, short circuit, and overtemperature shutdown. 3.3V to 5.5V Output Voltage Options The IC transitions to skip mode seamlessly under light- Integrated Protection Increases System Robustness Undervoltage Lockout (UVLO) load conditions to improve efficiency. Under these condi- tions, switching occurs only as needed, reducing switching Short-Circuit Protection Overtemperature Shutdown frequency and supply current to maintain high efficiency. High Efficiency and Low Quiescent Current Extends For higher efficiency when input voltage is closer to the output voltage, two special modes of operation are avail- Battery Life Over 90% Efficiency with Internal Synchronous able: track and automatic track. These modes allow users to balance quiescent current (I ) vs. transient response Rectifier Q 60A I in Automatic Track Mode time into boost mode. In both modes, the p-channel Q 45A I in Step-Up Mode MOSFET acts as a current-limited switch such that V Q OUT 30A I in Track Mode follows V . However, in track mode, the boost circuits Q IN 1A Shutdown Current are disabled and the system controls the boost func- Skip Mode Under Light Load Condition Improves tion with the EN, TREN inputs (I = 30A). In automatic Q Efficiency track mode (ATM), the boost circuits are enabled and the True Shutdown Prevents Current Flow from device automatically transitions into boost mode when OUT to LX V falls to 95% of the target V (I = 60A). IN OUT Q Soft-Start Limits Inrush Current to 480mA The IC is available in a small, 1.25mm x 1.25mm, 9-bump Small Package and High Frequency Operation WLP (0.4mm pitch) package. Reduce Board Space 9-Bump 1.25mm x 1.25mm WLP Package Applications 3MHz PWM Switching Frequency Cell Phones Small External Components Smartphones Mobile Internet Devices GPS, PND eBooks Typical Operating Circuit L1 1H INPUT OUTPUT 2.5V TO 5.5V 3.7V, 1A LX IN OUT C IN COUT 4.7F 22F MAX8969 EN TREN Ordering Information appears at end of data sheet. GND True Shutdown is a trademark of Maxim Integrated Products, Inc. 19-6038 Rev 7 4/20MAX8969 Step-Up Converter for Handheld Applications Absolute Maximum Ratings IN, OUT to GND ...............................................-0.3V to +6.0V Operating Temperature Range ............................-40C to +85 C EN, TREN to GND ............-0.3V to lower of (V + 0.3V) or 6V Junction Temperature ......................................................+150 C IN Total LX RMS Current (Note 1) ...................................3.2A Storage Temperature Range ............................ -65 C to +150C RMS OUT Short Circuit to GND .....................................Continuous Soldering Temperature (reflow) (Note 2) .........................+260 C Continuous Power Dissipation (T = +70C) A WLP (derate 12mW/NC above +70C) .......................960mW Note 1: LX has internal silicon diodes to GND and OUT . It is normal for these diodes to briefly conduct during LX transitions. Avoid steady state conduction of these diodes. Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile that the device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder pro- files recommended in the industry-standard specification JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) WLP Junction-to-Ambient Thermal Resistance ( ) ..........83 C/W JA Junction-to-Case Thermal Resistance ( ) ...............50 C/W JC Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 2.6V, T = -40C to +85C, unless otherwise noted. Typical values are T = +25C.) (Note 4) IN A A PARAMETER CONDITIONS MIN TYP MAX UNITS Operating Input Voltage Range 2.5 5.5 V Minimum Startup Voltage 2.3 V Undervoltage Lockout Threshold (UVLO) V falling, 75mV hysteresis 2.1 2.2 2.3 V IN T = +25C 0.8 5 V = V = V = 0V, A EN TREN OUT Shutdown Supply Current A V = 4.8V T = +85C 1 IN A Thermal Shutdown Temperature T rising, 20C hysteresis +165 C J BOOST MODE Peak Output Current V > 2.5V, pulse loading (Note 5) 1 A IN V = 3.3V 0.9 OUT V = 3.5V 0.8 OUT V = 3.7V 0.7 OUT Minimum Continuous Output Current V > 2.5V (Note 5) V = 4.25V 0.7 A IN OUT V = 5.0V 0.7 OUT V = 5.3V 0.7 OUT V = 5.5V 0.7 OUT Switching Frequency (Note 6) 3 MHz Maxim Integrated 2 www.maximintegrated.com