MAX9791/MAX9792 19-4217 Rev 1 6/10 Windows Vista-Compliant Class D Speaker Amplifiers with DirectDrive Headphone Amplifiers General Description Features The MAX9791 combines a stereo 2W Class D power Windows Vista Premium Compliant amplifier, a stereo 180mW DirectDrive headphone Low EMI Filterless Class D Speaker Amplifiers amplifier, and a 120mA low-dropout (LDO) linear regu- Pass EN55022B Emissions Limit with 30cm of lator in a single device. The MAX9792 combines a Speaker Cable mono 3W Class D power amplifier, a stereo 180mW 180mW DirectDrive Headphone Amplifier DirectDrive headphone amplifier, and a 120mA LDO linear regulator in a single device. Excellent RF Immunity The MAX9791/MAX9792 feature Maxims DirectDrive Integrated 120mA LDO headphone amplifier architecture that produces a Eliminates Headphone Ground Loop Noise ground-referenced output from a single supply, eliminat- Wake-on-Beep Function ing the need for large DC-blocking capacitors, saving Click-and-Pop Suppression cost, board space, and component height. High 107dB DC PSRR and low 0.006% THD+N ensure clean, low- Short-Circuit and Thermal-Overload Protection distortion amplification of the audio signal. Thermally Efficient, Space-Saving Package The ground sense feature senses and corrects for the 28-Pin TQFN-EP (4mm x 4mm x 0.75mm) voltage difference between the output jack ground and device signal ground. This feature minimizes head- Ordering Information phone amplifier crosstalk by sensing the impedance in the ground return trace and correcting for it at the out- STEREO/ LDO PART PIN-PACKAGE put jack. This feature also minimizes ground-loop noise MONO OUTPUT when the output socket is used as a line out connection MAX9791AETI+ Stereo 4.75V 28 TQFN-EP* to other grounded equipment (for example, a PC con- MAX9791BETI+ Stereo 3.3V 28 TQFN-EP* nected to a home hi-fi system). MAX9791CETI+ Stereo 1.8V 28 TQFN-EP* The MAX9791/MAX9792 feature low RF susceptibility, allowing the amplifiers to successfully operate in close MAX9792AETI+ Mono 4.75V 28 TQFN-EP* proximity to wireless applications. The MAX9791/ MAX9792CETI+ Mono 1.8V 28 TQFN-EP* MAX9792 Class D amplifiers feature Maxims spread- Note: All devices are specified over the -40C to +85C spectrum modulation and active emissions limiting cir- extended temperature range. cuitry. Industry-leading click-and-pop suppression +Denotes a lead(Pb)-free/RoHS-compliant package. eliminates audible transients during power-up and shut- *EP = Exposed pad. down cycles. The MAX9791/MAX9792 wake-on-beep feature wakes Simplified Block Diagrams up the speaker and headphone amplifiers when a qual- ified beep signal is detected at the BEEP input. SPEAKER AND LDO SUPPLY HEADPHONE SUPPLY 2.7V TO 5.5V 2.7V TO 5.5V For maximum flexibility, separate speaker and head- phone amplifier control inputs provide independent shutdown of the speaker and headphone amplifiers. CLASS D AMP Additionally the LDO can be enabled independently of the audio amplifiers. MAX9791 The MAX9791/MAX9792 feature thermal-overload and CLASS D output short-circuit protection. The devices are avail- AMP able in 28-pin TQFN packages and are specified over the -40C to +85C extended temperature range. Applications Notebook Computers Tablet PCs SPKR EN AVDD HP EN Portable Multimedia Players LDO EN BEEP LDO 1.8V, 3.3V, OR 4.75V DirectDrive is a registered trademark of Maxim Integrated Products, Inc. Simplified Block Diagrams continued at end of data sheet. Windows Vista is a registered trademark of Microsoft Corp. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.Windows Vista-Compliant Class D Speaker Amplifiers with DirectDrive Headphone Amplifiers ABSOLUTE MAXIMUM RATINGS Supply Voltage Continuous Input Current (All Other Pins) ........................20mA (AVDD, PVDD, HPVDD to GND)........................-0.3V to +6.0V Continuous Power Dissipation (T = +70C) A (AVDD to PVDD) .............................................................0.3V 28-Pin Thin QFN Single-Layer Board (derate 20.8mW/C GND to PGND, CPGND......................................................0.3V above +70C)..........................................................1667mW CPVSS, C1N to GND............................................-6.0V to + 0.3V Junction-to-Ambient Thermal Resistance ( ) JA HPL, HPR to CPVSS ...........................................-0.3V to lower of (Note 2) .....................................................................40C/W (HPVDD - CPVSS + 0.3V) and +9V Junction-to-Case Thermal Resistance ( ) JC HPL, HPR to HPVDD..................................+0.3V to the higher of (Note 2) ....................................................................2.7C/W (CPVSS - HPVDD - 0.3V) and -9V 28-Pin Thin QFN Multilayer Board (derate 28.6mW/C COM, SENSE........................................................-0.3V to + 0.3V above +70C)..........................................................2286mW Any Other Pin ..........................................-0.3V to (AVDD + 0.3V) Junction-to-Ambient Thermal Resistance ( ) JA Duration of Short Circuit between OUT +, OUT - and GND, (Note 2) .....................................................................35C/W PGND, AVDD, or PVDD..........................................Continuous Junction-to-Case Thermal Resistance ( ) JC Duration of Short Circuit between LDO OUT and AVDD, (Note 2) ....................................................................2.7C/W GND (Note 1) .........................................................Continuous ESD Protection, Human Body Model...................................2kV Duration of Short Circuit between HPR, HPL and Operating Temperature Range ...........................-40C to +85C GND .......................................................................Continuous Junction Temperature......................................................+150C Continuous Current (PVDD, OUT +, OUT -, PGND)............1.7A Storage Temperature Range .............................-65C to +150C Continuous Current (C1N, C1P, CPVSS, AVDD, HPVDD, Lead Temperature (soldering, 10s) .................................+300C LDO OUT, HPR, HPL) ..................................................850mA Note 1: If short is present at power-up. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (V = V = V = 5V, V = V = V = 0, I = 0, C = 2F (C = 4F for 1.8V LDO option), AVDD PVDD HPVDD GND PGND CPGND LDO OUT LDO LDO C1 = C2 = 1F. R = , unless otherwise specified. R = 20k (A = 12dB), R = 40.2k (A = 0dB), C = 470nF, L IN1 VSPKR IN2 VHP IN1 C =C = 1F, T = T to T , unless otherwise noted. Typical values are at T = +25C.) (Note 3) IN2 COM A MIN MAX A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS GENERAL V , AVDD Supply Voltage Guaranteed by PSRR test (Note 4) 2.7 5.5 V V PVDD Headphone Supply Voltage V Guaranteed by PSRR test 2.7 5.5 V HPVDD Undervoltage Lockout UVLO 2.65 V SPKR EN HP EN LDO EN 1 0 1 250 400 A MAX9791 1 1 0 4.4 6 0 0 0 10.5 15 mA I + AVDD Quiescent Current I + 0 1 0 14.4 21 PVD I HPVDD 1 0 1 250 400 A 1 1 0 4.4 6 MAX9792 mA 0 0 0 10.5 18 0 1 0 14.4 24 Shutdown Current I SPKR EN = 1.8V 3.3 7..3 A SHDN Bias Voltage V HP INR, HP INL, SPKR INR, SPKR INL 0 V BIAS 2 MAX9791/MAX9792