MAX9820 19-4666 Rev 0 7/09 DirectDrive Headphone Amplifier with External Gain General Description Features The MAX9820 Windows Vista -compliant stereo head- Clickless/Popless Operation phone amplifier is designed for portable equipment High RF Noise Rejection where board space is at a premium. It features Maxims DirectDrive architecture to produce a ground-refer- Windows Vista Premium Mobile Compliant enced output from a single supply, eliminating the large 2.7V to 5.5V Single-Supply Operation output-coupling capacitors required by conventional single-supply headphone amplifiers. 95mW Output Power (32, V = 5V) DD The MAX9820 features an undervoltage lockout that Low-Current Shutdown Mode, < 1A prevents over discharging of the battery during brownout conditions, click-and-pop suppression that Low 3mA (V = 3.3V) Quiescent Current DD eliminates audible transients on startup, a low-power Space-Saving, 3mm x 3mm, 10-Pin TDFN Package shutdown mode, and thermal-overload and short-circuit protection. Additionally, the MAX9820 suppresses RF radiation received by input and supply traces acting as antennas and prevents the amplifier from demodulating the coupled noise. Ordering Information The MAX9820 is available in a 10-pin TDFN package (3mm x 3mm x 0.8mm) and specified over the -40C to PIN- PART TEMP RANGE TOP MARK +85C extended temperature range. PACKAGE MAX9820ETB+ -40C to +85C 10 TDFN-EP* AUU Applications +Denotes a lead(Pb)-free/RoHS-compliant package. Cell Phones *EP = Exposed pad. MP3 Players Notebook PCs PDAs Pin Configuration Simplified Block Diagram TOP VIEW MAX9820 DirectDrive OUTPUTS C1P GND 1 10 LEFT ELIMINATE DC-BLOCKING AUDIO CAPACITORS C1N29 SHDN INPUT V 3 8 V SS DD MAX9820 OUTL 4 7 INL SHDN *EP OUTR56 INR RIGHT AUDIO TDFN INPUT *EXPOSED PAD. Windows Vista is a registered trademark of Microsoft Corp. DirectDrive is a registered trademark of Maxim Integrated Products, Inc. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLEDirectDrive Headphone Amplifier with External Gain ABSOLUTE MAXIMUM RATINGS V to GND..............................................................-0.3V to +6V Junction-to-Ambient Thermal Resistance ( ) (Note 1) DD JA C1P to GND................................................-0.3V to (V + 0.3V) 10-Pin TDFN...............................................................41.0C/W DD C1N to GND ................................................(V - 0.3V) to +0.3V Continuous Power Dissipation (T = +70C) SS A V to GND...............................................................-6V to +0.3V 10-Pin TDFN Multilayer PCB (derate 24.4mW/C SS OUTR, OUTL to GND.............................................................3V above +70C)...........................................................1951mW SHDN to GND...........................................................-0.3V to +6V Junction-to-Case Thermal Resistance ( ) (Note 1) JC INR, INL to GND.........................................-0.3V to (V + 0.3V) 10-Pin TDFN.................................................................9.0C/W DD OUTR, OUTL Short Circuit to GND, V ....................Continuous Junction-to-Ambient Thermal Resistance ( ) (Note 1) DD JA Short Circuit Between OUTL and OUTR ....................Continuous 10-Pin TDFN...............................................................41.0C/W Continuous Input Current (Into All Other Pins) .................20mA Operating Temperature Range ...........................-40C to +85C Continuous Power Dissipation (T = +70C) Storage Temperature Range .............................-65C to +150C A 10-Pin TDFN Single-Layer PCB (derate 18.5mW/C Junction Temperature......................................................+150C above +70C)........................................................1481.5mW Lead Temperature (soldering, 10s) .................................+300C Junction-to-Case Thermal Resistance ( ) (Note 1) JC 10-Pin TDFN ................................................................8.5C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (V = V = 5V, V = 0V, R = R = 40.2k (gain = -1V/V), C1 = C2 = 1F, C3 = 10F, R = , T = -40C to +85C, DD SHDN GND IN FB LOAD A unless otherwise noted. Typical values are at T = +25C, unless otherwise noted.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS GENERAL Supply Voltage Range V Guaranteed by PSRR test 2.7 5.5 V DD Undervoltage Lockout UVLO 2.2 V V = 3.3V 3.0 4.6 DD Quiescent Current I mA DD V = 5V 4.0 6.0 DD Shutdown Current I V = 0V, T = +25C < 0.1 1 A SHDN SHDN A Output Signal Attenuation in V = 0V, V = 1V , R = 10k -110 dBV SHDN IN RMS LOAD Shutdown Output Impedance in V = 0V 0.6 k SHDN Shutdown Turn-On Time t 0.56 ms ON Output Offset Voltage V T = +25C (Note 3) 0.1 0.5 mV OS A Z = 32 + 1H, peak Into shutdown -79 LOAD voltage, A-weighted, 32 samples Out of per second (Notes 3, 4) -77 shutdown Click-and-Pop Level K dBV CP Z = 10k , peak voltage, Into shutdown -62 LOAD A-weighted, 32 samples per Out of second (Notes 3, 4) -58 shutdown 2 MAX9820