MAX9963/MAX9964 19-2977 Rev 1 1/04 Quad, Low-Power, 500Mbps ATE Driver/Comparator General Description Features 2 The MAX9963/MAX9964 four-channel, low-power, high- Small FootprintFour Channels in 0.4in speed pin electronics driver and comparator ICs Low Power Dissipation: 825mW/Channel (typ) include, for each channel, a three-level pin driver, a dual High Speed: 500Mbps at 3V P-P comparator, and variable clamps. The driver features a wide voltage range and high-speed operation, includes Low Timing Dispersion high-Z and active-termination (3rd-level drive) modes, Wide -1.5V to +6.5V Operating Range and is highly linear even at low-voltage swings. The dual Active Termination (3rd-Level Drive) comparator provides low dispersion (timing variation) over a wide variety of input conditions. The clamps pro- Low-Leakage Mode: 15nA (max) vide damping of high-speed DUT waveforms when the Integrated Clamps device is configured as a high-impedance receiver. Interface Easily with Most Logic Families High-speed, differential control inputs compatible with ECL, LVPECL, LVDS, and GTL levels are provided for Digitally Programmable Slew Rate each channel. ECL/LVPECL or flexible open-collector Internal Logic Termination Resistors outputs are available for the comparators. Low Gain and Offset Error The A-grade version provides tight matching of gain and offset for the drivers and comparators, allowing ref- erence levels to be shared across multiple channels in Ordering Information cost-sensitive systems. For system designs that incor- porate independent reference levels for each channel, PART TEMP RANGE PIN-PACKAGE the B-grade version is available at reduced cost. MAX9963ADCCQ* 0C to +70C 100 TQFP-EPR Optional internal resistors at the high-speed inputs pro- MAX9963AKCCQ* 0C to +70C 100 TQFP-EPR vide differential termination of LVDS inputs, while optional internal resistors provide the pullup voltage MAX9963AGCCQ* 0C to +70C 100 TQFP-EPR and source termination for open-collector comparator MAX9963AHCCQ* 0C to +70C 100 TQFP-EPR outputs. These features significantly reduce the dis- MAX9963AJCCQ 0C to +70C 100 TQFP-EPR crete component count on the circuit board. MAX9963BDCCQ* 0C to +70C 100 TQFP-EPR Low-leakage, slew rate, and tri-state/terminate controls MAX9963BKCCQ* 0C to +70C 100 TQFP-EPR are operational configurations that are programmed MAX9963BGCCQ 0C to +70C 100 TQFP-EPR through a 3-wire, low-voltage, CMOS-compatible serial interface. MAX9963BHCCQ* 0C to +70C 100 TQFP-EPR The MAX9963/MAX9964 operating range is -1.5V to MAX9963BJCCQ* 0C to +70C 100 TQFP-EPR +6.5V, with power dissipation of only 825mW per channel. MAX9964ADCCQ* 0C to +70C 100 TQFP-EP** These devices are available in a 100-pin, 14mm x MAX9964AKCCQ* 0C to +70C 100 TQFP-EP** 14mm body, 0.5mm pitch TQFP with an exposed 8mm MAX9964AGCCQ* 0C to +70C 100 TQFP-EP** x 8mm die pad on the top (MAX9963) or bottom MAX9964AHCCQ* 0C to +70C 100 TQFP-EP** (MAX9964) of the package for efficient heat removal. The MAX9963/MAX9964 are specified to operate with MAX9964AJCCQ* 0C to +70C 100 TQFP-EP** an internal die temperature of +70C to +100C, and MAX9964BDCCQ* 0C to +70C 100 TQFP-EP** feature a die temperature monitor output. MAX9964BKCCQ* 0C to +70C 100 TQFP-EP** MAX9964BGCCQ 0C to +70C 100 TQFP-EP** Applications MAX9964BHCCQ* 0C to +70C 100 TQFP-EP** Flash Memory Testers MAX9964BJCCQ* 0C to +70C 100 TQFP-EP** *Future productcontact factory for availability. Commodity DRAM Testers **EP = Exposed pad. Low-Cost Mixed-Signal/System-on-Chip Testers Active Burn-In Systems Pin Configurations appear at end of data sheet. Structural Testers Selector Guide appears at end of data sheet. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.Quad, Low-Power, 500Mbps ATE Driver/Comparator ABSOLUTE MAXIMUM RATINGS V to GND .........................................................-0.3V to +11.5V DLV to DTV .......................................................................10V CC V to GND............................................................-7.0V to +0.3V CHV or CLV to DUT ........................................................10V EE All Other Pins....................................(V - 0.3V) to (V + 0.3V) CH , NCH , CL , NCL to GND...............................-2.5V to +5V EE CC V - V ................................................................-0.3V to +18V Current into DHV , DLV , DTV , CHV , CC EE DUT to GND.........................................................-2.5V to +7.5V CLV , CPHV , CPLV ...................................................10mA DATA , NDATA , RCV , NRCV to GND..............-2.5V to +5.0V Current into TEMP............................................-0.5mA to +20mA DATA to NDATA ..............................................................1.5V DUT Short Circuit to -1.5V to +6.5V..........................Continuous RCV to NRCV ..................................................................1.5V Power Dissipation (T = +70C) A V to GND ........................................................-0.3V to +5V MAX9963 CCQ (derate 167mW/C above CCO SCLK, DIN, CS, RST to GND ...................................-1.0V to +5V T = +70C) ..................................................................13.3W* A DHV , DLV , DTV , CHV , CLV to GND .............-2.5V to +7.5V MAX9964 CCQ (derate 47.6mW/C above CPHV to GND ......................................................-2.5V to +8.5V T = +70C) ....................................................................3.8W* A CPLV to GND.......................................................-3.5V to +7.5V Storage Temperature Range .............................-65C to +150C DHV to DLV ......................................................................10V Junction Temperature .....................................................+125C DHV to DTV ......................................................................10V Lead Temperature (soldering, 10s) .................................+300C *Dissipation wattage values are based on still air with no heat sink for the MAX9963 and slug soldered to board copper for the MAX9964. Actual maximum power dissipation is a function of the users heat-extraction technique and will vary. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (V = +9.75V, V = -5.25V, V = 2.5V, SC1 = SC0 = 0, V = 7.2V, V = -2.2V, T = +85C, unless otherwise noted. All tem- CC EE CCO CPHV CPLV J perature coefficients are measured at T = +70C to +100C, unless otherwise noted.) (Note 1) J PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLIES Positive Supply V 9.5 9.75 10.5 V CC Negative Supply V -6.5 -5.25 -4.5 V EE Positive Supply I (Note 2) 165 200 mA CC Negative Supply I (Note 2) -320 -380 mA EE Calculated at typical V and V CC EE Power Dissipation P 3.3 4.0 W D (Notes 2, 3) DUT CHARACTERISTICS Operating Voltage Range V (Note 4) -1.5 +6.5 V DUT Maximum LLEAK = 0, 0V V 3V 1.5 DUT Leakage Current in High-Z Mode I A DUT LLEAK = 0, V = -1.5V, 6.5V 3 DUT LLEAK = 1, 0 V 3V, T < +90C 10 DUT J LLEAK = 1, V = -1.5V,T < +90C 15 Leakage Current in Low-Leakage DUT J nA Mode LLEAK = 1, V = 6.5V, V = V = DUT CHV CLV 15 -1.5V, T < +90C J Driver in term mode (DUT = DTV ) 3 Combined Capacitance C pF DUT Driver in high-Z mode 5 2 MAX9963/MAX9964