EVALUATION KIT AVAILABLE MAX9985 Dual, SiGe, High-Linearity, 700MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch General Description Features The MAX9985 high-linearity, dual-channel downconver- 700MHz to 1000MHz RF Frequency Range sion mixer is designed to provide approximately 6dB 570MHz to 865MHz LO Frequency Range gain, +28.5dBm of IIP3, and 10.5dB of noise figure (NF) 50MHz to 250MHz IF Frequency Range ideal for diversity receiver applications. With a 700MHz to 1000MHz RF frequency range and a 570MHz to 6dB Typical Conversion Gain 865MHz LO frequency range, this mixer is ideal for low- 10.5dB Typical Noise Figure side LO injection architectures. In addition, the broad frequency range makes the MAX9985 ideal for GSM +28.5dBm Typical Input IP3 850/950, 2G/2.5G EDGE, WCDMA, cdma2000 , and +16.2dBm Typical Input 1dB Compression Point iDEN base-station applications. 77dBc Typical 2RF-2LO Spurious Rejection at The MAX9985 dual-channel downconverter achieves a P = -10dBm RF high level of component integration. The MAX9985 inte- Dual Channels Ideal for Diversity Receiver grates two double-balanced active mixer cores, two LO buffers, a dual-input LO selectable switch, and a pair of Applications differential IF output amplifiers. In addition, integrated 47dB Typical Channel-to-Channel Isolation on-chip baluns at the RF and LO ports allow for single- -3dBm to +3dBm LO Drive ended RF and single-ended LO inputs. The MAX9985 requires a typical 0dBm LO drive. Supply current is Integrated LO Buffer adjustable up to 400mA. Internal RF and LO Baluns for Single-Ended The MAX9985 is available in a 36-pin thin QFN pack- Inputs age (6mm x 6mm) with an exposed paddle. Electrical Built-In SPDT LO Switch with 43dB LO1-to-LO2 performance is guaranteed over the extended tempera- Isolation and 50ns Switching Time ture range, from T = -40C to +100C. C Pin-Compatible with MAX9995 1700MHz to Applications 2200MHz Mixer 850MHz WCDMA Base Stations Lead(Pb)-Free Package GSM 850/GSM 950, 2G/2.5G EDGE Base Stations cdmaOne and cdma2000 Base Stations Ordering Information iDEN Base Stations PKG PART TEMP RANGE PIN-PACKAGE Fixed Broadband Wireless Access CODE Wireless Local Loop 36 Thin Q FN-E P * MAX9985ETX+ -40 C to + 100C (6mm x 6mm), T3666-2 Private Mobile Radios lead free, bulk Military Systems 36 Thin Q FN-E P * Digital and Spread-Spectrum Communication MAX9985ETX+T -40 C to + 100C (6mm x 6mm), T3666-2 Systems lead free, T/R Microwave Links *EP = Exposed paddle. cdma2000 is a registered trademark of Telecommunications T = Tape-and-reel package. Industry Association. +Denotes lead(Pb)-free and RoHS compliant. iDEN is a registered trademark of Motorola, Inc. cdmaOne is a trademark of CDMA Development Group. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com. 19-0705 Rev 1 12/12MAX9985 Dual, SiGe, High-Linearity, 700MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch ABSOLUTE MAXIMUM RATINGS V to GND...........................................................-0.3V to +5.5V Operating Case Temperature Range (Note 2)......-40C to +100C CC LO1, LO2 to GND ...............................................................0.3V Junction Temperature......................................................+150C Any Other Pins to GND...............................-0.3V to (V + 0.3V) Storage Temperature Range .............................-65C to +150C CC RFMAIN, RFDIV, and LO Input Power..........................+20dBm Lead Temperature (soldering, 10s) .................................+300C RFMAIN, RFDIV Current (RF is DC shorted to GND through Soldering Temperature (reflow) .......................................+260C balun)...............................................................................50mA Continuous Power Dissipation (Note 1) .............................6.75W Note 1: Based on junction temperature T = T + ( x V x I ). This formula can be used when the temperature of the exposed J C JC CC CC pad is known while the device is soldered down to PCB. See the Application Information section for details. The junction temperature must not exceed +150C. Note 2: T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB. C A PACKAGE THERMAL CHARACTERISTICS Junction-to-Ambient Thermal Resistance ( ) Junction-to-Case Thermal Resistance ( ) JA JC (Notes 3, 4)...................................................................38C/W (Notes 1, 4)..................................................................7.4C/W Junction-to-Board Thermal Resistance ( )................12.2C/W JB Note 3: Junction temperature T = T + ( x V x I ). This formula can be used when the ambient temperature of the PCB is J A JA CC CC known. The junction temperature must not exceed +150C. Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (Using the Typical Application Circuit, no input RF or LO signals applied, V = 4.75V to 5.25V, T = -40C to +85C. Typical values CC C are at V = 5.0V, T = +25C, unless otherwise noted.) CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5 5.25 V CC Total supply current (see Table 1 for lower 400 440 current settings) V (pin 16) 80 CC Supply Current I mA CC V (pin 30) 80 CC IFM+/IFM- (total of both) 105 IFD+/IFD- (total of both) 105 LOSEL Input High Voltage V 2V IH LOSEL Input Low Voltage V 0.8 V IL LOSEL Input Current I and I -10 +10 A IH IL 2 Maxim Integrated