MAX9994 19-3435 Rev 1 12/10 SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch General Description Features The MAX9994 high-linearity downconversion mixer pro- 1400MHz to 2200MHz RF Frequency Range vides 8.3dB gain, +26.2dBm IIP3, and 9.7dB NF for 1400MHz to 2000MHz LO Frequency Range 1400MHz to 2200MHz UMTS/WCDMA, DCS, and PCS (MAX9994) base-station receiver applications. With a wide LO range 1900MHz to 2400MHz LO Frequency Range of 1400MHz to 2000MHz, the MAX9994 can be used in (MAX9996) either high-side or low-side LO injection architectures, 40MHz to 350MHz IF Frequency Range depending on the RF band of interest. Higher LO appli- cations are supported by the MAX9996, which is pin-pin 8.3dB Conversion Gain and functionally compatible with the MAX9994. +26.2dBm Input IP3 In addition to offering excellent linearity and noise per- +12.6dBm Input 1dB Compression Point formance, the MAX9994 also yields a high level of com- 9.7dB Noise Figure ponent integration. This device includes a double- 67dBc 2RF - 2LO Spurious Rejection at balanced passive mixer core, an IF amplifier, a dual- P = -10dBm RF input LO selectable switch, and an LO buffer. On-chip Integrated LO Buffer baluns are also integrated to allow for single-ended RF and LO inputs. The MAX9994 requires a nominal LO Integrated RF and LO Baluns for Single-Ended drive of 0dBm, and supply current is guaranteed to be Inputs below 235mA. Low -3dBm to +3dBm LO Drive The MAX9994/MAX9996 are pin compatible with the Built-In SPDT LO Switch with 45dB LO1 to LO2 MAX9984/MAX9986 815MHz to 995MHz mixers, mak- Isolation and 50ns Switching Time ing this entire family of downconverters ideal for appli- Pin Compatible with the MAX9984/MAX9986 cations where a common PC board layout is used for 815MHz to 995MHz Mixers both frequency bands. The MAX9994 is also functional- Functionally Compatible with the MAX9993 ly compatible with the MAX9993. External Current-Setting Resistors Provide Option The MAX9994 is available in a compact, 20-pin, thin for Operating Mixer in Reduced Power/Reduced QFN package (5mm x 5mm) with an exposed pad. Performance Mode Electrical performance is guaranteed over the extended -40C to +85C temperature range. Ordering Information Applications UMTS/LTE Base Stations PART TEMP RANGE PIN-PACKAGE TD-SCDMA/TD-LTE Base Stations 20 Thin QFN-EP** MAX9994ETP+ -40C to +85C 5mm 5mm DCS1800/PCS1900 EDGE Base Stations bulk cdmaOne and cdma2000 Base Stations 20 Thin QFN-EP** MAX9994ETP+T -40C to +85C 5mm 5mm PHS/PAS Base Stations T/R Predistortion Receivers **EP = Exposed pad. Fixed Broadband Wireless Access +Denotes a lead(Pb)-free/RoHS-compliant package. T = Tape and reel. Wireless Local Loop Private Mobile Radios Pin Configuration/Functional Diagram and Typical Military Systems Application Circuit appear at end of data sheet. Microwave Links Digital and Spread-Spectrum Communication Systems cdma2000 is a registered trademark of Telecommunications Industry Association. cdmaOne is a trademark of CDMA Development Group. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLESiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch ABSOLUTE MAXIMUM RATINGS V to GND...........................................................-0.3V to +5.5V (Note 1) ...................................................................+38C/W CC JA IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (V + 0.3V) (Note 1) .....................................................................+8C/W CC JC TAP........................................................................-0.3V to +1.4V Operating Temperature Range (Note 2).....T = -40C to +85C C LO1, LO2, LEXT to GND........................................-0.3V to +0.3V Junction Temperature......................................................+150C RF, LO1, LO2 Input Power .............................................+12dBm Storage Temperature Range .............................-65C to +150C RF (RF is DC shorted to GND through a balun) .................50mA Lead Temperature (soldering 10s) ..................................+300C Continuous Power Dissipation (T = +70C) Soldering Temperature (reflow) .......................................+260C A 20-Pin Thin QFN-EP (derate 20mW/C above +70C)..............1.8W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 2: T is the temperature on the exposed pad of the package. C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to V through inductive CC CC chokes, R = 806, R = 549, T = -40C to +85C, unless otherwise noted. Typical values are at V = +5V, T = +25C, unless 1 2 C CC C otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5.00 5.25 V CC Supply Current I 206 235 mA CC LO SEL Input Logic-Low V 0.8 V IL LO SEL Input Logic-High V 2V IH RECOMMENDED AC OPERATING CONDITIONS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS RF Frequency Range f (Note 3) 1400 2200 MHz RF LO Frequency Range f (Note 3) 1400 2000 MHz LO IF Frequency Range f (Note 3) 40 350 MHz IF LO Drive Level P (Note 3) -3 +3 dBm LO 2 MAX9994