EVALUATION KIT AVAILABLE MAX9995 Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch General Description Features The MAX9995 dual, high-linearity, downconversion 1700MHz to 2700MHz RF Frequency Range mixer provides 6.1dB gain, +25.6dBm IIP3, and 9.8dB 1400MHz to 2600MHz LO Frequency Range NF for WCDMA, TD-SCDMA, LTE, TD-LTE, and 40MHz to 350MHz IF Frequency Range GSM/EDGE base-station applications. 6.1dB Conversion Gain This device integrates baluns in the RF and LO ports, a dual-input LO selectable switch, an LO buffer, two double- +25.6dBm Input IP3 balanced mixers, and a pair of differential IF output ampli- 9.8dB Noise Figure fiers. The MAX9995 requires a typical LO drive of 0dBm 66dBc 2RF - 2LO Spurious Rejection at and supply current is guaranteed to be below 380mA. P = -10dBm RF These devices are available in a compact 36-pin TQFN Dual Channels Ideal for Diversity Receiver package (6mm 6mm) with an exposed pad. Electrical performance is guaranteed over the extended tempera- Applications ture range, from T = -40C to +100C. C Integrated LO Buffer Integrated RF and LO Baluns for Single-Ended Applications Inputs WCDMA, TD-SCDMA, PHS/PAS Base Stations Low -3dBm to +3dBm LO Drive and cdma2000 3G Fixed Broadband Built-In SPDT LO Switch with 50dB LO1 - LO2 Base Stations Wireless Access Isolation and 50ns Switching Time LTE and TD-LTE Wireless Local Loop 44dB Channel-to-Channel Isolation Base Stations Private Mobile Radio GSM/EDGE Military Systems Base Stations Pin Configuration/ Functional Diagram Ordering Information PART TEMP RANGE PIN-PACKAGE TOP VIEW MAX9995ETX+ T * = -40C to +100C 36 TQFN-EP** C MAX9995ETX+T T * = -40C to +100C 36 TQFN-EP** C +Denotes a lead(PB)-free and RoHS-compliant package. 1 27 RFMAIN LO2 *T = Case temperature. C MAX9995 **EP = Exposed pad. TAPMAIN 2 26 GND T = Tape and reel. 3 25 GND GND V 4 24 CC GND GND 5 23 LOSEL V 6 22 GND CC 7 21 V GND CC EXPOSED 8 20 TAPDIV PAD* GND 9 19 RFDIV LO1 6mm x 6mm TQFN cdma2000 is a registered trademark of Telecommunications *EXPOSED PAD ON THE BOTTOM OF THE PACKAGE Industry Association. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com. 19-3383 Rev 2 12/12 V V CC 10 36 CC IFD SET 35 IFM SET 11 GND GND 12 34 IFD+ 13 33 IFM+ IFD- IFM- 14 32 IND EXTD 15 31 IND EXTM V CC V 16 30 CC LO ADJ D 17 29 LO ADJ M N.C. 18 28 N.C.MAX9995 Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch ABSOLUTE MAXIMUM RATINGS V ........................................................................-0.3V to +5.5V Continuous Power Dissipation (Note 1) .............................6.75W CC LO1, LO2 to GND ...............................................................0.3V Operating Temperature Range (Note 2)...T = -40C to +100C C IFM , IFD , IFM SET, IFD SET, LOSEL, Maximum Junction Temperature .....................................+150C LO ADJ M, LO ADJ D to GND.............-0.3V to (V + 0.3V) Storage Temperature Range .............................-65C to +150C CC RFMAIN, RFDIV, and LO Input Power..........................+20dBm Lead Temperature (soldering, 10s) .................................+300C RFMAIN, RFDIV Current Soldering Temperature (reflow) .......................................+260C (RF is DC shorted to GND through balun)......................50mA Note 1: Based on junction temperature T = T + ( x V x I ). This formula can be used when the temperature of the exposed J C JC CC CC pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150C. Note 2: T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB. C A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS TQFN Junction-to-Case Thermal Resistance ( ) JC Junction-to-Ambient Thermal Resistance ( ) (Note 1, 4) ...................................................................7.4C/W JA (Note 3, 4) ....................................................................38C/W Junction-to-Board Thermal Resistance ( )................12.2C/W JB Note 3: Junction temperature T = T + ( x V x I ). This formula can be used when the ambient temperature of the PCB is J A JA CC CC known. The junction temperature must not exceed +150C. Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, no input RF or LO signals applied, V = 4.75V to 5.25V, T = -40C to +85C. Typical values are at V CC C CC = 5.0V, T = +25C, unless otherwise noted.) C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5 5.25 V CC Total supply current 332 380 V (pin 16) 82 90 CC Supply Current I V (pin 30) 97 110 mA CC CC IFM+/IFM- (total of both) 70 90 IFD+/IFD- (total of both) 70 90 LOSEL Input High Voltage V 2V IH LOSEL Input Low Voltage V 0.8 V IL LOSEL Input Current I and I -10 +10 A IL IH RECOMMENDED AC OPERATING CONDITIONS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS RF Frequency Range f (Note 5) 1700 2700 MHz RF LO Frequency Range f (Note 5) 1400 2600 MHz LO IF Frequency Range f (Note 5) 40 350 MHz IF LO Drive Level P (Note 5) -3 +3 dBm LO 2 Maxim Integrated