EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAXM17574 4.5V to 60V, 3A High-Efficiency, DC-DC Step-Down Power Module with Integrated Inductor General Description Benefits and Features The Himalaya series of voltage regulator ICs and power Reduces Design Complexity, Manufacturing Risks, modules enable cooler, smaller, and simpler power- and Time-to-Market supply solutions. The MAXM17574 is an easy-to-use Integrated Synchronous Step-Down DC-DC converter power module that combines a synchronous step-down DC-DC converter, fully shielded inductor, and compen- Integrated Inductor Integrated Compensation Components sation components in a low-profile, thermally-efficient, system-in-package (SiP). The device operates over a Saves Board Space in Space-Constrained wide input-voltage range of 4.5V to 60V, delivers up to Applications 3A continuous output current, and has excellent line and Complete Integrated Step-Down Power Supply in a load regulation over an output-voltage range of 0.9V to Single Package 15V. The device only requires five external components to Small Profile 9mm x 15mm x 2.92mm SiP Package complete the total power solution. The high level of inte- Simplified PCB Design with Minimal External BOM gration significantly reduces design complexity, manufac- Components turing risks, and offers a true plug-and-play power-supply Offers Flexibility for Power-Design Optimization solution, reducing time-to-market. Wide Input-Voltage Range from 4.5V to 60V The device can be operated in pulse-width modulation Output-Voltage Adjustable Range from 0.9V to 15V (PWM) or discontinuous conduction mode (DCM). Adjustable Frequency with External Frequency Synchronization (100kHz to 2.2MHz) The MAXM17574 is available in a low-profile, highly ther- Soft-Start Programmable mal-emissive, compact, 33-pin, 9mm x 15mm x 2.92mm Auxiliary bootstrap LDO for improved Efficiency SiP package that reduces power dissipation in the Optional Programmable EN/UVLO package and enhances efficiency. The feedback voltage- regulation accuracy over -40C to +125C is 0.9%. Operates Reliably in Adverse Industrial Environments The package is easily soldered onto a printed circuit Integrated Thermal Protection board and suitable for automated circuit board assembly. Hiccup Mode Overload Protection RESET Output-Voltage Monitoring Applications High Industrial Ambient Operating Temperature Industrial Power Supplies Range (-40C to +125C) / Junction Temperature Distributed Supply Regulation Range (-40C to +150C) FPGA and DSP Point-of-Load Regulator Complies with CISPR22(EN55022) Class B Base Station Point-of-Load Regulator Conducted and Radiated Emissions HVAC and Building Control Typical Application Circuit Ordering Information appears at end of data sheet. 3.3V, 3A 4.5V TO 60V OUT VIN 4.7F 47F 105k PGND MAXM17574 FB EN/UVLO EXTVCC 39.2k SS 0.022F V CC SGND RESET MODE/SYNC CF LX RT BST 19-100076 Rev 2 4/19MAXM17574 4.5V to 60V, 3A High-Efficiency, DC-DC Step-Down Power Module with Integrated Inductor Absolute Maximum Ratings V to PGND .........................................................-0.3V to +65V RESET, SS to SGND ..........................................-0.3V to +6.5V IN EN/UVLO to SGND ...............................................-0.3V to +65V MODE/SYNC, V , RT, CF to SGND ..................-0.3V to +6.5V CC EXTVCC to SGND ................................................-0.3V to +26V PGND to SGND .................................................... -0.3V to +0.3V BST to PGND ........................................................-0.3V to +70V Output Short-circuit duration .....................................Continuous BST to LX .............................................................-0.3V to +6.5V Operating Temperature Range (Note 1) ........... -40C to +125C BST to V ...........................................................-0.3V to +65V Junction Temperature ......................................................+150C CC OUT to PGND (V < 25V) ...........................-0.3V to V + 0.3V Storage Temperature Range ............................ -65C to +150C IN IN OUT to PGND (V > 25V) ....................................-0.3V to +25V Lead Temperature (soldering, 10s) .................................+300C IN LX to PGND..................................................-0.3V to V + 0.3V Soldering Temperature (reflow) .......................................+260C IN FB to SGND .........................................................-0.3V to +1.5V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 33-PIN SiP Package Code L33915 3 Outline Number 21-100175 Land Pattern Number 90-100057 THERMAL RESISTANCE, FOUR-LAYER BOARD (N ote 2) Junction to Ambient Thermal Resistance ( ) 22.6C/W JA For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Note 1: Junction temperature greater than +125C degrades operating lifetimes. Note 2: Package thermal resistance is measured on evaluation board with natural convection. 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