EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAXM17575 4.5V to 60V, 1.5A High-Efficiency, DC-DC Step-Down Power Module with Integrated Inductor General Description Benefits and Features The Himalaya series of voltage regulator ICs and power Reduces Design Complexity, Manufacturing Risks, modules enable cooler, smaller, and simpler power sup- and Time-to-Market ply solutions. The MAXM17575 is an easy-to-use power Integrated Step-Down DC-DC Converter module that combines a synchronous step-down DC-DC Integrated Inductor converter, a fully shielded inductor, and compensation Integrated Compensation Components components into a low-profile, thermally-efficient, system- Saves Board Space in Space-Constrained Applications in-package (SiP). The device operates over a wide input- Complete Integrated Step-Down Power Supply in a voltage range of 4.5V to 60V, delivers up to 1.5A continuous Single Package output current and has excellent line and load regulation Small Profile 6.5mm 10mm 2.92mm SiP Package over an output-voltage range of 0.9V to 12V. The high Simplified PCB Design with Minimal External BOM level of integration significantly reduces design complexity, Components manufacturing risks, and offers a true plug-and-play power- Offers Flexibility for Power-Design Optimization supply solution, reducing time-to-market. Wide Input-Voltage Range from 4.5V to 60V The MAXM17575 offers resistor-programmable switching Output-Voltage Adjustable Range from 0.9V to 12V frequency, RESET output-voltage monitoring, adjustable Adjustable Frequency with External Frequency input undervoltage lockout, and programmable soft-start. Synchronization (400kHz to 2.2MHz) Soft-Start Programmable The device also features hiccup-mode overload protec- tion, and thermal shutdown function. PWM Mode of Operation Optional Programmable EN/UVLO The MAXM17575 is available in a low-profile, highly Operates Reliably in Adverse Industrial Environments thermal-emissive, compact, 28-pin 6.5mm 10mm Integrated Thermal Fault Protection 2.92mm SiP package, which reduces power dissipation Hiccup Mode Overload Protection and enhances efficiency. The package is easily soldered RESET Output-Voltage Monitoring onto a printed circuit board and is suitable for automated High Industrial Ambient Operating Temperature circuit board assembly. The device can operate over the Range (-40C to +125C) / Junction Temperature industrial temperature range from -40C to +125C. Range (-40C to +150C) Complies with CISPR22(EN55022) Class B Applications Conducted and Radiated Emissions Industrial Power Supplies Distributed Supply Regulation Typical Application Circuit FPGA and DSP Point-of-Load Regulator 3.3V,1.5A VIN C1 C2 Base Station Point-of-Load Regulator 4.7F 22F V OUT IN R1 HVAC and Building Control 60.4k EN/UVLO FB RESET R2 22.6k RT/SYNC R3 Ordering Information appears at end of data sheet. MAXM17575 33.2k EXTVCC R SS EXTVCC C SS C SGND PGND LX BST VCC 19-100080 Rev 2 4/19MAXM17575 4.5V to 60V, 1.5A High-Efficiency, DC-DC Step-Down Power Module with Integrated Inductor Absolute Maximum Ratings V to PGND ........................................................-0.3V to +65V FB to SGND ...........................................................-0.3V to 1.5V IN EN/UVLO to SGND ....................................-0.3V to (V + 0.3V) RT/SYNC, SS, RESET, V , SS C to SGND ......-0.3V to +6.5V IN CC EXTVCC C to SGND ............................................-0.3V to +26V PGND to SGND ....................................................-0.3V to +0.3V BST to PGND ........................................................-0.3V to +70V Output Short-Circuit Duration ....................................Continuous BST to LX .............................................................-0.3V to +6.0V Operating Temperature Range (Note 1) ........... -40C to +125C BST to V ...........................................................-0.3V to +65V Junction Temperature ......................................................+150C CC LX, EXTVCC R, OUT to Storage Temperature Range ............................ -40C to +150C PGND (V < 25 V) ................................ -0.3V to (V + 0.3V) Soldering Temperature (reflow) .......................................+260C IN IN LX, EXTVCC R, OUT to PGND (V > 25V) ........-0.3V to +25V Lead Temperature (soldering, 10s) .................................+300C IN Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 28-PIN SiP Package Code L286510 7 Outline Number 21-100180 Land Pattern Number 90-100058 THERMAL RESISTANCE, FOUR-LAYER BOARD (N ote 2) Junction to Ambient ( ) 25.5C/W JA For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Note 1: Junction temperature greater than +125C degrades operating lifetimes. Note 2: Package thermal resistance is measured on an evaluation board with natural convection. 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