SCOPE: CMOS 10-BIT MULTIPLYING D/A CONVERTER Device Type Generic Number 01 MX7520S(x)/883B 02 MX7520T(x)/883B 03 MX7520U(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter Mil-Std-1835 Case Outline Package Code MAXIM Q GDIP1-T16 or CDIP2-T16 16 LEAD CERDIP J16 E CQCCI-N20 20 LEADLESS CHIP CARRIER L20 Absolute Maximum Ratings V to GND ............................................................................................ -0.3V, +17V DD V , V , to GND ................................................................................... -0.3V, V OUT1 OUT2 DD VREF to GND........................................................................................... -25V to +25V V to GND............................................................................................. -25V to +25V RFB Digital Input Voltage Range ......................................................................... -0.3V,V DD Lead Temperature (soldering, 10 seconds) ............................................................. +300C Storage Temperature ................................................................................ -65C to +150C Continuous Power Dissipation .......................................................................... T =+70C A 16 pin CERDIP(derate 10mW/C above +70C) .................................................... 800mW 20 pin LCC(derate 9.1mW/C above +70C) ......................................................... 727mW Junction Temperature T ...................................................................................... +150C J Thermal Resistance, Junction to Case, JC 16 pin CERDIP.................................................................................................. 40C/W 20 pin LCC ........................................................................................................ 50C/W Thermal Resistance, Junction to Ambient, JA: 16 pin CERDIP.................................................................................................. 20C/W 20 pin LCC ..................................................................................................... 110C/W Recommended Operating Conditions Ambient Operating Range (T ) ............................................................. -55C to +125C A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ---------------------------- Electrical Characteristics of MX7520/883B 19-1025 Rev. B Page 2 of 5TABLE 1. ELECTRICAL TESTS: CONDITIONS Group A Device -55 C <=T <= +125C 1/ Limits Limits Units A Subgroup type TEST Symbol Min Max Unless otherwise specified All Resolution RES NOTE 2 10 Bits 1,2,3 01 Relative Accuracy RA -2.0 +2.0 LSB 02 -1.0 -1.0 03 -0.5 0.5 All Nonlinearity Tempco TC NOTE 2 -2.0 +2.0 ppm/C NL All Gain Tempco TC NOTE 2 -20 +20 ppm/C AE All OUT1 Leakage Current I Digital inputs at V , 1,2,3 -200 200 nA OUT1 IL VREF=+10V All OUT2 Leakage Current I Digital inputs at V , 1,2,3 -200 200 nA OUT2 IH VREF=+10V Output Current Settling 0.5 To 0.5LSB, OUT1 load is s All Time 4 100 13pF. Digital inputs = V IH NOTE 2 to V or V to V . IL IL IH Feedthrough Error FTE VREF=20Vp-p at 10kHz sine430mVp-p NOTE 3 wave, digital inputs at V IL All Reference Input Resistance R 1,2,3 520 k IN All Input High Level Voltage V 1,2,3 2.4 V IH All Input Low Level Voltage V 1,2,3 0.8 V IL All Input Leakage Current I V =0V or V 1,2,3 -1.0 1.0 IL IN DD A C Digital Inputs at V 120 OUT1 IH Digital Inputs at V 37 IL All Output Capacitance 4 pF 37 C Digital Inputs at V OUT2 IH Digital Inputs at V 120 IL All Supply Current I Digital Inputs at V or V 1,2,3 2mA DD IH IL NOTE 1: V =+15V, V =V =0V, VREF=+10V, unless otherwise specified. DD OUT1 OUT2 NOTE 2: Characteristics supplied for use as a typical design limit but not production tested. NOTE 3: Feedthrough error can be reduced by connecting the lid of the ceramic SB package to ground. TERMINAL CONNECTIONS J16, D16 20 LCC J16, D16 20 LCC 1 OUT1 NC 11 D8 NC 2 OUT2 OUT1 12 D9 D6 3 GND OUT2 13 D10(LSB) D7 4 D1(MSB) GND 14 V D8 DD 5 D2 D1(MSB) 15 VREF D9 6D3 NC 16 R NC FB 7 D4 D2 17 D10(LSB) 8D5 D3 18 V DD 9D6 D4 19 VREF 10 D7 D5 20 R FB ---------------------------- Electrical Characteristics of MX7520/883B 19-1025 Rev. B Page 3 of 5