X-On Electronics has gained recognition as a prominent supplier of HS-0000-W3 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HS-0000-W3 Heat Sinks are a product manufactured by Arbor Technology. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HS-0000-W3 Arbor Technology

HS-0000-W3 electronic component of Arbor Technology
Images are for reference only
See Product Specifications
Part No.HS-0000-W3
Manufacturer: Arbor Technology
Category: Heat Sinks
Description: Heat Sinks Heatsink with fins for Q7 CPU Modules
Datasheet: HS-0000-W3 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 44.7331 ea
Line Total: USD 44.73 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 44.7331
10 : USD 42.5733
25 : USD 40.5636
50 : USD 37.8494
100 : USD 37.4451
250 : USD 37.0755
500 : USD 36.3478

   
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We are delighted to provide the HS-0000-W3 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HS-0000-W3 and other electronic components in the Heat Sinks category and beyond.

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70.00 27.81 19.84 15.00 34.00 1.20 11.53 3.00 64.00 2.70 EmQ-a50M1 AMD Fusion G-T40E Qseven CPU Module Features Fanless Design Soldered Onboard AMD G-T40E Dual Core Processor Integrated Gigabit Ethernet Dual Channels 18/24-bit LVDS, Analog RGB, and DDI Port Extended Operating Temp.: -20 ~ Max. 70C System Mechanical & Environmental CPU Soldered onboard AMD G-T40E 1.0GHz processor Power Requirement 5V, 5VSB Soldered onboard 2GB DDR3L SDRAM 1.55A +12V (Typical) Memory Power Consumption AMD FCH A50M -20 ~ 70C (-4 ~ 158F) with EmQ-a50M1 Chipset Operating Temp. BIOS AMI UEFI BIOS -20 ~ 60C (-4 ~ 149F) with EmQ-a50M1D 10 ~ 95% 70C with EmQ-a50M1 (non- Watchdog Timer 1~255 levels reset condensing) Operating Humidity 10 ~ 95% 60C with EmQ-a50M1D I/O (non-condensing) USB Port 8 x USB 2.0 ports 70 x 70 mm (2.76 x 2.76) Dimension (L x W) 4 x PCIe x1 lanes Expansion Bus Dimensions SPI and LPC (Low Pin Count) interfaces 2 x Serial ATA ports 600MB/s HDD transfer rate Storage 1.92 35.82 8GB NANDrive (optional) Ethernet Chipset 1 x Realtek RTL8111E PCIe GbE controller Audio HD Audio Link Display Graphics Chipset Integrated AMD Radeon HD 6250 LCD: Dual Channels 18/24-bit LVDS Support Analog RGB signals (via Qseven GF Graphics Interface reserved pin) 5.00 1 x DDI port 1.82 32.38 70.00 13.50 54.00 Unit: mm 26 All specifications are subject to change without notice.Location for optional IO connector Block Diagram EmQ-a50M1 AMD Fusion G-series Q7 CPU module DC-IN EPIC Carrier Board - PBQ-3000 Wide Range DC DDR3 2GB SDRAM Single Channel DDR3L 165 (W) x 115 (D)mm Input 10 ~ 30V Memory down 1333MHz Power buttom LEDs Analog R.G.B. DC-jack to Q7 RSV pin 24-bit Dual/ Single Channels LVDS LVDS 18/24-bit Dual Channels LVDS AMD APU G-series DDI1 G-T40E DP Chrontel DVI CH7318 DVI-D DC 1.0GHz VGA 6.4W Connector Analog RGB 3 x PCIex1 Q7 RSV pin EmQ-i2506 only SCDB-5291 Battery charger board PCIex1 Realtek GbE LAN1 RTL8111E Charger IC Embedded LPC I/F Battery 1 BQ24851A LPC LPC LPC I/F Controller UMI x4 connector connector IT8512 Charger IC Battery 2 BQ24851A LPC I/F 8-bit DIO 8-bit Digital IO Connector (PH) Fintek LPC I/F COM1, COM2 HD Audio Link RS-232 (DB-9) F81866D-I RS-232/422/485 (DB-9) Super IO COM3, COM4 SMBus RS-232 (PH) USB/ PCIex1 1 x Mini-Card socket 8 x USB 2.0 host ports AMD Realtek HD Audio Link Mic/ Line-in/ Lin-out ALC662 A50M AUDIO (Phone Jacks) PCIex1 HD CODEC FCH PCIex1 Intel 82583V (default) GbE LAN2 SATA0 6GB/s or 82574L GbE RJ-45 Controller + Double Stacked USB Type A 2 x USB Ports SATA1 6GB/s GbE LAN1 RJ-45 + Double Stacked SATA2 6GB/s SATA NANDriver 2 x USB Ports (Optional) USB Type A 2 x USB Ports 2 x USB (2x5-PH) SATA 0, 1 2 x SATA Conn. SATA SATA1 NANDrive (Except for EmQ-i2506D) 8GB AMD Fusion G-series Processors Ordering Information G-T56N 1.65GHz Dual Core 18W AMD Radeon HD 6320 G-T48N 1.4GHz Dual Core 18W AMD Radeon HD 6310 EmQ-a50M1 AMD G-T40E Dual Core Q7 CPU module w/ 2GB memory soldered on module G-T40N 1.0GHz Dual Core 9W AMD Radeon HD 6320 G-T40E 1.0GHz Dual Core 6.4W AMD Radeon HD 6290 G-T52R 1.5GHz Single Core 18W AMD Radeon HD 6310 EmQ-a50M1D (BTO) AMD G-T40E Dual Core Q7 CPU module w/ 2GB memory and 8GB NANDrive soldered on module G-T44R 1.2GHz Single Core 9W AMD Radeon HD 6250 G-T40R 1.0GHz Single Core 5.5W AMD Radeon HD 6250 StarterKit-003-50M1 Qseven Starter Kit for EmQ-a50M1 1 x VGA up to 2560x1600 60Hz & 30bpp 1 x Dual DVI/ HDMI up to 1920x1080 60Hz & 36bpp or DiaplsyPort up to 2560x1600 60Hz & 30bpp(Configurable) 1 x LVDS (Single channel 24-bit up to 1440x900 60Hz & 18bpp) Optional Accessories 2 x DDR3 SO-DIMM up to 1333MHz 4 x PCIex1 (configurable to 1xPCIex4/ 2xPCIex2/ 4xPCIex1) HS-0520-F1 Heat spreader (70.0 x 65.0 x 8.0mm) A50M (2.7 ~ 4.7W) 14 x USB 2.0 Universal evaluation heatsink kit for Qseven CPU module (70x70x30mm) HS-0000-W3 2 x USB 1.1 6 x SATA 6GB/s w/ RAID 0, 1, 5, 10 Qseven EPIC evaluation board Page 60 PBQ-3000 Integrated Ethernet MAC HD link Cable kit 4 x PCIex1 (Not configurable) 1 x USB cable 1 x USB2 cable CBK-06-3000-00 2 x Serial port cables Cedarview NM10 (Solder side) (Solder side) 1 x SATA cable 1 x SATA power cable Qseven spec Max. Min. * SATA ports 2 0 * PCIex1 4 2 * USB 2.0 host 8 4 Memory Down: * LVDS 2 channels 24-bit 0 1GB (Total system memory capacity) * DisplayPort, TMDS, SDVO 1 0 1GB (Mem Size per Rank) * GbE port 1 0 2Gb(density per DRAM Chip) * One I2C 1 1 x8 (DRAM Chip Data Width) * SMBus 1 1 x4 (DRAM Chip per Rank) * 8-bit Secure Digital IO 1 0 * HD I/F 1 1 * I2C 1 1 27 All specifications are subject to change without notice. Q7 Golden Finger MXM socket

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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