X-On Electronics has gained recognition as a prominent supplier of HS-56M0-F1 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HS-56M0-F1 Heat Sinks are a product manufactured by Arbor Technology. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HS-56M0-F1 Arbor Technology

HS-56M0-F1 electronic component of Arbor Technology
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See Product Specifications
Part No.HS-56M0-F1
Manufacturer: Arbor Technology
Category: Heat Sinks
Description: Heat Sinks Heatspreader for EmNANO-a56M0
Datasheet: HS-56M0-F1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 42.9323 ea
Line Total: USD 42.93

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Mon. 05 Aug to Wed. 07 Aug
MOQ : 1
Multiples : 1
1 : USD 46.7665
10 : USD 44.5084
25 : USD 42.4074
50 : USD 39.5698
100 : USD 39.1472
250 : USD 38.7607
500 : USD 38

   
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Product Category
RoHS - XON
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We are delighted to provide the HS-56M0-F1 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HS-56M0-F1 and other electronic components in the Heat Sinks category and beyond.

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EmNANO-a56M0 AMD G-Series SoC Dual Core 210HA COM Express Mini Type 10 CPU Module Features Soldered onboard AMD G-Series SoC Dual Core 210HA processor Integrated Gigabit Ethernet Single Channel 18-bit LVDS and 1 x DDI port Supporting Dual Independent Displays Extended Operating Temp.: -20 ~ 70C System Mechanical & Environmental AMD G-Series SoC Dual Core 210HA CPU +12V Power Requirement Soldered onboard 2GB DDR3L SDRAM Memory 1.08A +12V (Typical) Power Consumption AMI UEFI BIOS BIOS -20 ~ 70C (-4 ~ 158F) Operating Temp. 1~255 levels reset Watchdog Timer 0 ~ 90% (non-condensing) Operating Humidity 84 x 55 mm (3.30 x 2.17 ) Dimensions (L x W) I/O 8 x USB 2.0 ports USB Port Dimensions 8-bit programmable Digital Input/Output Digital I/O 3 x PCIe x1 Gen2 lanes Expansion Bus SPI, and LPC (Low Pin Count) interface 2 x Serial ATA ports Storage 1 x Realtek RTL8111E PCIe GbE controller Ethernet Chipset HD AUDIO link AUDIO/ Interface Display 2.00 41.66 Integrated in 210HA Kabini Graphics Chipset 84.00 LCD: Single Channel 18-bit LVDS up to 1400 x 1050 60Hz Graphics Interface 1 x DDI port 76.00 4.00 Unit: mm All specifications are subject to change without notice. 1 2.70 38.99 4.00 25.02 47.00 25.78 55.00Block Diagram DDR3L-1333 Onboard DDR3 2GB SDRAM Analog RGB VGA conn. Single Channel 18-bit LVDS 1 x DDI port HD Audio 8 x USB Ports 3 x PCIe x 1 AMD G-Series SoC Dual Core SATA0, 1 210HA LPC I/F SPI I/F BIOS ROM SPI 8MB SMBus 8 GPIO F75111RG Giga LAN 1 x PCIe x 1 GbE LAN Realtek RTL8111E Ordering Information Kabini Spec DDR3 DP0: COM Express Mini Type 10 CPU Module with AMD G-Series SoC Dual Core 210HA and 2GB memory soldered on EmNANO-a56M0-210HA Single Channel 18-bit LVDS --> up to 1400x1050 60Hz & 18bpp module DVI --> 1920x1200 60 w/ reduced blonking, 600x1200 60Hz w/ WESA standard timing DisplayPort 1.2 (DP) --> up to 2506x1600 60Hz & 24bpp Heat spreader HS-56M0-F1 DP1: HDMI --> up to 1920x1080 60Hz & 48bpp Heat spreader with fan HS-56M0-C1 DVI --> 1920x1200 60 w/ reduced blonking, 600x1200 60Hz w/ WESA standard timing DisplayPort 1.2 (DP) --> up to 2506x1600 60Hz & 24bpp PBN-9007 COM Express Mini evaluation carrier board (EPIC form factor) 1 x VGA DAC --> up to 1920x1200 60Hz & 30bpp 1 x PCIex4 Gen2 Cable Kit 4 x PCIex1 Gen2 1 x USB cable 8 x USB 2.0 1 x serial port cable 2 x USB 3.0 CBK-05-9007-00 2 x SATA Gen 1/2/3, RAID 0, 1 x SA 1 suppTA cableorted HD AUDIO I/F 1 x SATA power cable SD I/F 1 x PS/2 cable LPC I/F GPU: Sea Islands family of GPUs Type 10 function 1 x GbE LPC bus 2 x SATA HD link All specifications are subject to change without notice. 2 8 x USB 2.0 4 x PCIe x1 Single channel 24-bit LVDS 1 x DDI port 8-bit GPIO 5VSB & +12V Connector AB

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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