NEW CEM130 COM Express Type 6 Compact Module with AMD Ryzen Embedded V1000 Processor 2 x DDR4 SO-DIMM Features AMD Ryzen Embedded V1000 processors 2 DDR-2400/3200 SO-DIMM for up to 64GB of memory Max. up to 7 lanes of PCI Express 2 SATA-600 AMD Ryzen Embedded 3 USB 3.0 and 8 USB 2.0 V1000 processor TPM 2.0 supported Wide voltage input from +8V to +20V DDR4DDR4 USBUSB Full Solid DDR4 USB 3.0 TripleView Low Power AMS.AXView Cap Design Core System COM Express CPU AMD Ryzen Embedded V1000 series connector V1202B / 2.3 GHz (12-25W) V1605B / 2.0 GHz (12-25W) Rear view V1756B / 3.25 GHz (35-54W) V1807B / 3.35 GHz (35-54W) System Memory 2 x DDR4-2400/3200 SO-DIMM, up to 64GB (dual channel)*, non-ECC/ECC memory *Memory speed was depend on memory rank. Display Chipset SoC integrated Graphic Radeon RX Vega Graphics with up to 11 compute units BIOS AMI uEFI (Legacy free) H.265 (10-bit) decode & (8-bit) encode, VP9 decode Storage N/A Display Interface 1 x VGA 1920 x 1200 60Hz Watchdog Timer 65536 levels, 0 to 65535 sec. 1 x LVDS dual-channel 18/24-bit or eDP 1.3 (optional) Expansion Interface 7 x PCIe x1 via PCIe bridge 2 x DDI (HDMI 1.4, DVI, DisplayPort 1.2)* Battery Lithium N/A *HDMI 2.0 needs redriver chip on carrier board/DisplayPort 1.4 needs Redriver chip on carrier board Power Input ATX: +12V, +5VSB AT: +12V Wide range input: +8V to +20V Packing List Dimensions 95 x 95 mm Board Thickness 2.0 mm Quick installation guide Operating Temperature -20C to +60C (-4F to +140F) Humidity 10% - 95% relative humidity, non-condensing Ordering Information *Memory speed was depend on memory rank. Standard I/O CEM130-V1202B COM Express Type 6 Compact module with AMD Ryzen (P/N: E38D130103) Embedded V1202B, DDI, LVDS, GbE LAN, USB 3.0 and TPM SATA 2 x SATA-600 CEM130-V1605B COM Express Type 6 Compact module with AMD Ryzen Hardware Monitoring Yes (P/N: E38D130102) Embedded V1605B, DDI, LVDS, GbE LAN, USB 3.0 and TPM Ethernet 1 x 10/100/1000 Mbps Ethernet with Intel i210 supports CEM130-V1756B COM Express Type 6 Compact module with AMD Ryzen Wake-on-LAN, PXE Boot ROM (P/N: E38D130101) Embedded V1756B, DDI, LVDS, GbE LAN, USB 3.0 and TPM Audio HD link interface to baseboard for Codec CEM130-V1807B COM Express Type 6 Compact module with AMD Ryzen USB 3 x USB 3.0 (P/N: E38D130100) Embedded V1807B, DDI, LVDS, GbE LAN, USB 3.0 and TPM 8 x USB 2.0 Serial 1 x LPC Optional 1 x SPI CEB94011 COM Express Type 6 application board 2 x TX/RX (P/N: E394011100) TPM TPM 2.0 E39J014100 CEM130 heat sink with fan SMBus Yes 2 Others 1 x I C 7128D130000E CEM130 heat spreader GPIO 4-CH in & 4-CH out Smart Battery Yes 43 * All specifications and photos are subject to change without notice. www.axiomtek.com 2021 Axiomtek Co., Ltd. All rights reserved.X-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for Heat Sinks category: Click to view products by Axiomtek manufacturer: Other Similar products are found below : 581102B00000G 656-15ABPE 657-20ABPNE 7020B-TC12-MTG 73452PPBA 7G0011A PF720G A22-4026 120-1873-007 HAH10L HAH15L 1542616-1 HS-2506-F1 HS-87M0-F2 218-40CTE3 231-69PAB-15V 25-7520 SW50-4G 231-75PAB-13V 231-75PAB-15V 253- 122ABE-22 PSC22CB HAF10L HAQ10T D10100-28 BDN183CBA01 3-21053-4 32438 TX0506-1B TX1806B LAE66A3CB WA-DT2- 101E 511-3U 73381PPBA 73403PPBA 7G0047C COMX-440-HSP 510-12M D10650-40T5 V8511 Y APF40-40-13CB/A01 780653U04500G ATS-54310K-C2-R0 FK 216 CB SA FK 231 SA 220 648-51AB 657-20ABPESC 2341BG 679-25AG FK 212 CB SA