Features Meets test requirements of Telcordia Patented Multi-stage protection (MSP ) GR 974, GR1361, SBC SR 5165 and Balanced TRIGARD RUS PE-80 Patented Switch-Grade Fail-Short Device Telcordia Analysis report DA-1547 Quick response and high energy handling Solid brass, gold-plated pins Ideal for high-speed networks in high Test point access option exposure environments Sealed option for harsh environments Listed per UL 497 (File: 53117) 2410 Series - 5-Pin Multi-Stage Protector (MSP ) Bourns 5-Pin Multi-Stage Protector (MSP ) is the latest generation telecommunications protector for high performance and long life in overvoltage protection of copper pair voice-band and high-speed data circuits. Bourns MSP combines the advantages of gas tube and solid state protection while integrating three advanced technologies: a proprietary high-ef ciency gas discharge tube, precision matched metal oxide varistors and a patented Switch-Grade Fail-Short mechanism. The Switch-Grade Fail-Short mechanism ensures superior thermal protection with fast acting, highly reliable response to thermal overload conditions. This combined technology provides lower capacitance, higher reliability and longer life than competitive hybrid technologies. Bourns 2410 can be used universally for POTS and high speed data, e.g. ISDN, ADSL, ADSL2+, VDSL, VDSL2, other xDSL protocols and high speed Ethernet. Bourns MSP technology provides unparalleled overvoltage protection with low loss on paired copper communications circuits. The 2410 series is the most economical, reliable and effective choice for overvoltage protection of copper pair circuits. Characteristics Test Methods per UL 497, CSA C22.2, Telcordia GR 974, 1361 and SBC SR 5165. DC Breakdown ............................................................................................................................................... 300-400 V AC Breakdown 60 Hz ................................................................................................................................ 300-400 V Impulse Breakdown 100 V/s .................................................................................................................................................... 600 V 1000 V/s .................................................................................................................................................. 650 V Insulation Resistance 100 Vdc .................................................................................................................. >1 G 1 Insertion Loss 100 MHz ............................................................................................................................. <0.4 dB 1 Return Loss 100 MHz ................................................................................................................................ >14 dB Capacitance Tip to Ring 1 MHz ................................................................................................................. 10 pF typical Capacitance Tip or Ring to Ground 1 MHz ................................................................................................ 20 pF typical 5 Impulse Reset 52 V, 260 mA ............................................................................................................................................. <10 ms 135 V, 200 mA ........................................................................................................................................... <10 ms 150 V, 200 mA ........................................................................................................................................... <150 ms Impulse Life Characteristics (Tip and Ring to Ground Simultaneously) 2 10 to 100 A, 10/1000 s ............................................................................................................................ >3000 operations 2 300 A, 10/1000 s ..................................................................................................................................... >1000 operations 4 500 A, 10/1000 s ..................................................................................................................................... >1000 operations 2 2,000 A, 10/250 s .................................................................................................................................... >100 operations 2 5,000 A, 20/100 s .................................................................................................................................... >10 operations 4 20,000 A, 8/20 s ...................................................................................................................................... >10 operations AC Life Characteristics (Tip and Ring to Ground Simultaneously) 0.5 A rms continuous ................................................................................................................................. >30 seconds 1 A rms, 1 second, 600 ft. cable ................................................................................................................ >60 seconds 1 A rms, 1 second, 1 mile cable ................................................................................................................. >60 operations 10 A rms, 1 second .................................................................................................................................... >5 operations 3 65 A rms, 11 cycles .................................................................................................................................... >1 operation 120 A rms, 0.1 second ............................................................................................................................... 1 operation High Current Capability and Thermal Operation (Tip and Ring to Ground, Vented or Non-Vented Gas Tube) .................................................................................................................. >30 A rms, simultaneously Storage and Operating Temperature .............................................................................................................. -55 to +85 C Telcordia analyzed for controlled (non-sealed) and uncontrolled, high-exposure (sealed) environments per GR 974 and SBC SR 5165. Telcordia Technical Analysis Report DA-1547. Notes: 1 Tested according to Category 5 requirements 2 Exceeds Telcordia (Bellcore) GR 1361 3 Surpasses Telcordia GR 974 4 RUS (REA) PE-80 5 Network applied Line to Line voltage is approximately 1.8 to 2 times the stated Line to Ground breakdown voltage. Speci cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their speci c applications. 2410 Series - 5-Pin Multi-Stage Protector (MSP ) How To Order 2410 - X XX - X - XXX - XX Model Number Designator Module Length 3 = Standard: 52.37 mm (2.06 in.) 7 = Special Short: 41.19 mm (1.62 in.) Housing Color/Circuit Type 1 = Black/Standard 6 = Blue/Standard 10 = Yellow/Standard 3 = Red/Special 9 = Orange/Standard Service (non-Bridgelifter) Pin Plating G = Gold Plated N = Tin Plated Protector Type MSP = Multi-Stage Protector BC = Balanced Capacitance* Special Options S = Sealed Case ST = Sealed Case and Test Points** T = Test Points** *For use on DSL Systems that require balanced capacitance of 1 pF. **T and ST options are not available on 2410-7x short module. Product Dimensions 2410-3 MODULE 42.17 (1.66) 12.8 29.9 5.7 (0.50) (1.18) (0.223) 2.3 2.2 DIA. 5 PLCS. DIA. 2 PLCS. (.092) (.085) 19.0 (0.75) 5.6 11.2 11.2 (0.44) (0.220) (0.440) 5.1 3.6 (0.20) 6.1 (0.240) (0.14) 10.2 (0.40) 2410-7 MODULE 30.99 MM (1.22) DIMENSIONS: (INCHES) 24.9 (0.98) 6.15 (0.24) 5.1 (0.20) 10.2 (0.40) REV. O 04/15 MSP and TRIGARD are registered trademarks of Bourns, Inc. Speci cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their speci c applications.