These models are currently available Features but not recommended for new n For use in telecommunication circuit designs. applications requiring low current protection with high surge tolerance n Overcurrent protection to Telcordia GR-1089-CORE Issue 4 (B1250T only) n Agency recognition: File: E198545 & UL 1950/60950 n RoHS compliant* n Bourns TISP products are recommended for the overvoltage section of the circuit Telefuse SMD Power Cross Protection Fuse Electrical Characteristics Typical Volt-drop Maximum Melting I2T Melting I2T Power Ampere Voltage Cold 100 % In Model Rating Rating Resistance (Volts) < 10 msec 10 In Dissipation Max. (A2 sec.) (A2 sec.) (W) Number (A) (VRMS) (Ohms) B0500T 0.500 600 0.350 0.23 2 2.3 0.20 B1250T 1.25 600 0.075 0.18 14 17 0.40 B2000T 2.0 600 0.056 0.16 33 37 0.52 Temperature Range Lightning Surge Withstand Capabilities ................................-55 C to +125 C Minimum Minimum Withstand Peak Current Repetitions (A) Max. Rise/ Peak Environmental Characteristics Min. Decay Each Voltage Thermal Shock ................ MIL-STD-202, (s) Total Polarity (V) B0500T B1250T B2000T Method 107, Test Condition B 10/1000 50 25 1000 25 100 120 (-65 C to +125 C) 10/360 50 25 1000 30 125 150 Shock.......... MIL-STD-202, Method 213, 2/10 20 10 2500 120 500 600 Test Condition I 10/360 10 5 1000 30 125 150 (100 Gs peak for 6 milliseconds) 2/10 2 1 5000 120 500 600 Vibration ...... MIL-STD-202, Method 201 8/20 2 1 5000 75 300 350 (10-55 Hz, 0.06 inch total excursion) Test Methods per GR-1089/TIA-968-A (FCC Pt. 68) Salt Spray ... MIL-STD-202, Method 101, Test Condition B (48 hrs.) AC Power Fault Tests Insulation Resistance ...... MIL-STD-202, Short Fuse Characteristics Method 302, Test Condition A GR-1089 Circuit (after opening) 1st Level Voltage Current 10,000 ohms minimum Test (VRMS) (A) Applications Duration B0500T B1250T B2000T Solderability 1 50 0.33 1 15 min................ MIL-STD-202, Method 208 2 100 0.17 1 15 min. Resistance to Solder Heat 3 200, 1 60 1 sec............... MIL-STD-202, Method 210, 400, Parts pass all 1st Level tests Test Condition J (235 C, 30 sec.) 600 Physical Characteristics 4 1000 1 60 1 sec. 6 600 0.5 1 30 sec. Body Material 7 440 2.2 5 2 sec. Will open ..... Ceramic with tin plated brass caps Parts pass all 1st 8 600 3 5 1.1 sec. Will open Solder ........ RoHS 6 Compliant lead free Level tests 9 1000 5 5 0.4 sec. Will open RoHS reflow compatible reference 240 C, 30 sec. max. Soldering Process Window AC Current Limiting Protector Tests/Fusing Coordination Tests IR Reflow 240 C for 30 seconds max. Voltage Current Maximum Time for Fuse to Open (Seconds) (Not recommended for (Vac) (A) Duration B0500T B1250T B2000T Wave solder direct immersion) 600 2.2 1.0 900 Will not open Packaging ..........2,000 pcs. per 13 reel 600 2.6 0.8 50 2000 600 3.0 0.5 10 100 600 3.75 0.3 5 10 600 5 0.2 2 3 600 7 Up to 15 Min. 0.08 1 2 600 10 0.04 0.5 0.7 600 12.5 0.01 0.2 0.3 600 20 0.005 0.07 0.1 600 25 0.004 0.04 0.07 600 30 0.003 0.02 0.05 *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. *RoHS COMPLIANT VERSIONS AVAILABLE *RoHS COMPLIANT LEAD FREE LEAD FREE VERSIONS ARE RoHS COMPLIANT* Telefuse SMD Power Cross Protection Fuse Time/Current Characteristic Curve Product Dimensions 2.03 .102 1000 (.080 .004) 100 9.65 .254 10 (.38 .01) B2000T B1250T 3.05 .127 1 (.120 .005) B0500T 3.05 .127 (.120 .005) 0.1 0.01 0.01 0.1 110 100 1000 10000 Time (Seconds) Recommended Pad Layout Solder Profile 3.81 (.15) 4.06 T P T -5 C c (.16) t p MAX. RAMP-UP RATE = 3 C/sec. MAX. RAMP-DOWN RATE = 6 C/sec. T L t 5.08 (.20) TMAX. S MM DIMENSIONS: (INCHES) TMIN. S t s PREHEAT 25 C t 25 C TO PEAK WAVEFORM DURATION OF A/B SECONDS CURRENT Time (Peak Value) lp A = Rise Time = T1 - T0 (1.25/b-a) 0.9 lp B = Duration = T2 - T0 IR Reflow Profile Reflow Parameter Value Minimum Preheat Temperature (T MIN) 130 C S 0.5 lp Maximum Preheat Temperature (T MAX) 170 C S Preheat Time 60-180 seconds 0.1 lp T MAX to T Ramp-Up Rate 3 C / second max. TIME S L ab T0 T1 T2 Time above Temperature T (t ) 200 C for 60-120 seconds L L Peak Temperature (T ) 240 C max. P Time within 5 C of Peak T 20-30 seconds P Ramp-Down Rate 6 C / second. max. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Temperature Current (Amperes)