CAT25-331JALF Bourns

Features n Concave terminals n RoHS compliant* n 8 bit multiple applications n Smallest bussed chip array n E 24 Series from 10 ohms to 1 megohm CAT25 - Thick Film Chip Resistor Arrays Electrical Characteristics How To Order CA T 25 - 103 J A LF Parameters CAT25 Test Method Product Number of Resistors 8 CA = Chip Array Resistance Range E24 10 ohms to 1 megohm Pin Style Resistance Tolerance 5 % JIS-C-5202.5.1 T = Concave Power Rating/Resistor 62.5 mW Model Rating Temperature +70 C Resistance Value 103 = 10K ohms T.C.R. 200 ppm/C JIS-C-5202.5.2 Tolerance Maximum Operating Voltage 25 V J = 5 % Operating Temperature -55 C to +125 C Electrical Circuit A = 8 Resistors, Bussed Type Environmental Characteristics Terminations LF = Tin-plated (RoHS compliant) Specification Characteristics Test Method Short Time Overload (3 % +0.1 ohm) JIS-C-5202.5.5 Load Life (5 % +0.1 ohm) JIS-C-5202.7.10 For Standard Values Used in Humidity Load Life (3 % +0.1 ohm) JIS-C-5202.7.9 Capacitors, Inductors, and Resistors, click here. Resistance to Soldering Heat (1 % +0.1 ohm) JIS-C-5202.6.4 Terminal Strength (1 % +0.1 ohm) JIS-C-5202.6. Temperature Cycle (2 % +0.1 ohm) JIS-C-5202.7.4 2.10 0.20 Vibration (1 % +0.1 ohm) JIS-C-5202.6.3 (.083 .008) Insulation Resistance 1000 megohms minimum JIS-C-5202.5.6 0.25 0.20 Dielectric Withstanding Voltage 50 VRMS JIS-C-5202.5.7 (.010 .008) Lead Solderability >95 % JIS-C-5202.6.5 0.30 0.20 Outline Drawing Land Pattern (.012 .008) 0.55 0.10 (.022 .004) 4.8 - 5.2 0.80 0.10 (.190 - .205) (.032 .004) 2.10 0.20 4.00 0.20 (.083 .008) 2.8 - 3.0 0.9 - 1.1 (.157 .008) (.110 - .118) 0.25 0.20 (.035 - .043) 0.35 0.20 (.010 .008) 0.50 0.20 (.014 .008) (.020 .008) 3.2 - 3.5 (.125 - .138) 3.3 - 3.4 0.30 0.20 DIA. (.130 - .133) (.012 .008) 0.55 0.10 0.30 +0.10/-0.20 (.022 .004) (.012 +.004/-.008) 0.80 0.10 (.032 .004) MM 4.00 0.20 DIMENSIONS: (INCHES) (.157 .008) 0.4 - 0.5 0.80 (.016 - .020) (.032) 0.35 0.20 0.40 0.20 0.50 0.20 (.014 .008) (.016 .008) (.020 .008) Electrical Circuit DIA. 0.30 +0.10/-0.20 (.012 +.004/-.008) 0.40 0.20 (.016 .008) *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. CAT25 - Thick Film Chip Resistor Arrays Soldering Profile for RoHS Compliant Chip Resistors and Arrays 275 <1> Maximum of 20 seconds between 260 C peak +255 C and +260 C <1> 255 C 225 220 C 190 C 60 - 90 seconds 175 Ramp Down 150 C 6 C/second 125 60 - 120 seconds 10 seconds minimum 75 Ramp Up 3 C/second maximum 25 050 100 150 200 250 300 Time (Seconds) Packaging Derating Curve 12 (.472) embossed tape 100 4,000 pcs. per reel 80 60 Material 40 Substrate Alumina 96 20 Element Ruthenium Oxide 0 -55 070 125 Coating Glass Ambient Temperature (C) Terminal Plated Ni+Sn REV. 05/20 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Temperature (C) Rated power in percentage (%)