Features RoHS Compliant* Low reverse leakage current Low forward voltage drop High current capability CD214B-F350~F3600 Surface Mount Fast Response Rectifiers General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers Glass Passivated Rectifiers for rectification applications, in compact chip DO-214AA (SMB) size format, which offers PCB real estate savings and are considerably smaller than most competitive parts. The Glass Passivated Rectifier Diodes offer a forward current of 3.0 A with a choice of repetitive peak reverse voltage of 50 V up to 600 V. Bourns Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. Electrical Characteristics ( T = 25 C Unless Otherwise Noted) A CD214B- Parameter Symbol Unit F350 F3100 F3150 F3200 F3400 F3600 Maximum Repetitive V 50 100 150 200 400 600 V RRM Peak Reverse Voltage Maximum RMS Voltage V 35 70 105 140 280 420 V RMS Maximum DC Blocking Voltage V 50 100 150 200 400 600 V DC Maximum Average Forward I 3.0 A 1 (AV) Rectified Current DC Reverse Current Rated DC I 5.0 A R Blocking Voltage ( T = 25 C) J DC Reverse Current Rated DC I 120.0 A R Blocking Voltage ( T = 125 C) J 2 Typical Junction Capacitance C 10 pF J Maximum Instantaneous V 0.95 1.25 1.7 V F Forward Voltage 1 A 3 Typical Thermal Resistance R 34 C/W JA Peak forward surge current 8.3 ms single half sine-wave superimposed on I 100 A FSM rated load (JEDEC Method) 4 Maximum Reverse Recovery Time T 35 ns rr Notes: 1 See Forward Derating Curve. 2 Measured at 1 MHz and an applied reverse voltage of 4.0 V. 3 Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 x 0.2 (5.0 x 5.0 mm) copper pad areas. 4 Reverse recovery test condition: IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A Thermal Characteristics ( T = 25 C Unless Otherwise Noted) A Parameter Symbol CD214B-F350~F3600 Unit Operating Temperature Range TJ -55 to +150 C Storage Temperature Range TSTG -55 to +150 C *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specic applications. *RoHS COMPLIANTCD214B-F350~F3600 Surface Mount Fast Response Rectifiers Product Dimensions How To Order CD 214B - F 3 50 This is an RoHS compliant product. It is a molded plastic package. Common Code A cathode band indicates the polarity. The package weighs CD = Chip Diode approximately 0.064 g. The package and dimensions are shown Package below. 214B = SMB/DO-214AA Model Series 4.06 - 4.57 F = Fast Response Rectifier (0.167 - 0.187) Forward Current I (AV) 3 = 3 A Reverse Voltage 50 = 50 V 100 = 100 V 3.30 - 3.94 1.96 - 2.21 150 = 150 V (0.130 - 0.150) (0.075 - 0.087) 200 = 200 V 400 = 400 V 600 = 600 V Typical Part Marking CD214B-F350 ........................................................................... F3A CD214B-F3100 ......................................................................... F3B CD214B-F3150 ......................................................................... F3C 2.01 - 2.62 CD214B-F3200 ......................................................................... F3D (0.079 - 0.103) CD214B-F3400 ......................................................................... F3G CD214B-F3600 ......................................................................... F3J 0.05 - 0.20 0.15 - 0.31 0.76 - 1.52 (0.039 - 0.052) (0.002 - 0.008) (0.006 - 0.012) 5.21 - 5.59 (0.197 - 0.236) Recommended Pad Layout A B MM DIMENSIONS: C (INCHES) Dimension SMA (DO-214AC) 2.90 A (0.114) 3.00 B (0.118) 2.30 C (0.091) Specications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specic applications.