Features n 0402 and 0603 package options n Rated for IEC 61000-4-2, level 4 n Withstands multiple ESD strikes n Low capacitance and leakage currents for invisible load protection n Tape and reel packaging n Lead free ChipGuard MLD Series Varistor ESD Clamp Protectors Description The Chip Guard CG0402MLD and CG0603MLD Series have been specifically designed to protect sensitive electronic components from electrostatic discharge damage. The MLD family has been designed to protect equipment to IEC61000-4-2, level 4 ESD specifications targeted for high speed data applications. The Chip Guard MLD Series has been manufactured to provide very low capacitance with excellent clamp qualities, making the family almost transparent under normal working conditions. Electrical Characteristics 25 C (unless otherwise noted) Continuous Breakdown Clamping Off-state Operating Capacitance Voltage Voltage Current Voltage Model V V 1 mA V 1 A 8/20 s I C DC B C L OFF (V) (V) (V) (A) (pF) Max. Typ. Max. Max. Max. CG0402MLD-12G 12 50 150 1 5 CG0603MLD-12E 12 50 150 1 5 Schematic Environmental Characteristics Operating Temperature ..................................................................................... -30 C to +85 C Storage Temperature......................................................................................... -30 C to +85 C Standard ...................................................................................................IEC 61000-4-2 Level 4 These products are RoHS compliant. There is some lead contained within the glass of the ceramic. This is acceptable under exemption no. 5 of the RoHS directive (DIRECTIVE V 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment). How to Order CG 0n0n MLD - 12 x ESD Withstand Ratings ChipGuard Product Designator Repetitions Package Option Parameter Peak Voltage (Min.) 0402 = 0402 Package 0603 = 0603 Package ESD Voltage Capability, 8 kV 100 at 8 kV Multilayer Series Designator Contact Discharge Operating Voltage 12 = 12 V ESD Voltage Capability, 15 kV 100 at 15 kV Tape & Reel Packaging Air Discharge E = 4,000 pcs. per reel (CG0603MLD Series) G = 10,000 pcs. per reel (CG0402MLD Series) Standard IEC61000-4-2 Level 4 Ni barrier terminations are standard on all ChipGuard part numbers. Asia-Pacific: Tel: +886-2 2562-4117 Email: asiacus bourns.com EMEA: Tel: +36 88 885 877 Email: eurocus bourns.com The Americas: Tel: +1-951 781-5500 Email: americus bourns.com www.bourns.com WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.W A L ChipGuard MLD Series Varistor ESD Clamp Protectors 3312 - 2 mm SMD Trimming Potentiometer W Product Dimensions Recommended Pad Layout B C A A D L W MM DIMENSIONS: (INCHES) A B L C B A D CG0402MLD CG0603MLD CG0402MLD CG0603MLD B C Dimension Series Series Dim. Series Series A B D 1.00 0.15 1.60 0.20 0.51 0.76 L A (0.04 0.006) (0.064 0.008) (0.020) (0.030) 0.50 0.10 0.80 0.20 0.61 1.02 W B (0.02 0.004) (0.032 0.008) (0.024) (0.040) B 0.50 0.10 0.80 0.20 0.51 0.50 A C (0.02 0.004) (0.032 0.008) (0.020) (0.020) 0.25 0.15 0.30 0.20 1.70 2.54 B D (0.10 0.006) (0.012 0.008) (0.067) (0.100) Solder Reflow Recommendations Preheat Stages 1-3 Soldering Cooling 300 A Stage 1 Preheat Ambient to Preheating 30 s to 60 s 250 Temperature B Stage 2 Preheat 140 C to 160 C 60 s to 120 s 200 C Stage 3 Preheat Preheat to 200 C 20 s to 40 s 150 D Main Heating 200 C 60 s to 70 s 210 C 55 s to 65 s 100 220 C 50 s to 60 s 230 C 40 s to 50 s 50 240 C 30 s to 40 s 0 E Cooling 200 C to 100 C 1 C/s to 4 C/s 110 sec. (min.) 120 sec. (min.) 30-70 sec. Time (seconds) This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Temperature (C)