The CG0805MLA series is Features currently available but not n RoHS compliant* recommended for new designs. n ESD protection >25 kV n Surge protection n Low capacitance ChipGuard CG0805MLA Series - ESD Protector Array General Information The ChipGuard CG0805MLA series has been designed to provide a competitive solution for applications where capacitance of the ESD protector is less critical. General ESD applications in end products such as computers, analog modems and PDAs include IC supply lines, MOSFET gate protection, and low frequency digital and control lines. The ChipGuard CG0805MLA quad device is designed to protect equipment to IEC61000-4-2, Level 4 (8 kV Contact / 15 kV Air Discharge) ESD specification. Electrical & Thermal Characteristics TA = 25 C (unless otherwise noted) Parameter Symbol CG0805MLA-5.5ME CG0805MLA-18KE Unit Maximum AC Working Voltage 10 A Max. V 4 14 V RMS Maximum DC Working Voltage 10 A Max. V 5.5 18 V DC Minimum Resistance 3.3 VDC I 10 Megohms R Maximum Peak Current 8/20 S Pulse I 10 5 A S Maximum Transient Energy 10/1000 S Pulse W 0.01 Joules Max Nominal Breakdown Voltage 1 mA V 12 28 V BR Breakdown Voltage Tolerance % V 20 10 % BR Maximum Clamping Voltage 1 A 8/20 S Pulse V 28 58 V C Typical Capacitance 1 VRMS 1 kHz C 36 17 pF O1 Typical Capacitance 1 VRMS 1 MHz C 33 15 pF O2 Maximum Response Time R 1 ns T ESD Protection: Per IEC 61000-4-2 Min. Contact Discharge (>100 Reps) 8 kV Min. Air Discharge (>100 Reps) 15 kV Operating Temperature T -40 to +85 C OPR Storage Temperature T -40 to +85 C STG WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.Applications n IC supply line protection n MOSFET gate protection E n Control line protection D n Low frequency I/O line protection A BL B C L ChipGuard CG0805MLA Series - ESD Protector Array E Product Dimensions Recommended Pad Layout D W A E BL X X D P A B BL S C L B T C L BW W CG0805 X X Dimension Series MM DIMENSIONS: P W (INCHES) 1.25 0.20 L S CG0805 X X (0.049 0.008) Dimension Series P 2.00 0.20 W 0.64 S T A (0.080 0.008) (0.025) 0.90 T 1.27 T B (0.035) MAX. BW (0.050) 0.20 0.10 BW 1.91 C (0.008 0.004) BW (0.075) 0.20 0.10 BL 0.28 D (0.008 0.004) (0.011) 0.50 P 0.51 E (0.020) (0.020) 0.75 0.10 X (0.029 0.004) 0.25 0.10 S (0.009 0.004) Solder Reflow Recommendations Preheat Stages 1-3 Soldering Cooling 300 A Stage 1 Preheat Ambient to Preheating 30 s to 60 s 250 Temperature B Stage 2 Preheat 140 C to 160 C 60 s to 120 s 200 C Stage 3 Preheat Preheat to 200 C 20 s to 40 s 150 D Main Heating 200 C 60 s to 70 s 210 C 55 s to 65 s 100 220 C 50 s to 60 s 230 C 40 s to 50 s 50 240 C 30 s to 40 s 0 E Cooling 200 C to 100 C 1 C/s to 4 C/s 110 sec. (min.) 120 sec. (min.) 30-70 sec. Time (seconds) This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Temperature (C)