Features Applications High resistance to heat and humidity Mobil phones Resistance to mechanical shock and Cellular phones pressure CTV, VCR, HIC, FDD Accurate dimensions for automatic surface mounting Wide inductance range (1.0nH to 1000uH) CM45, CM32, CM25, CM20, CM16, CM10 SMT Chip Inductors General Specifications Temperature Rise ........................................................................................................................................................................................20C max. Ambient Temperature................................................................................................................................................................................. 80C max. Operating Temperature......................................................................................................................................................................-20C to +100C Storage Temperature........................................................................................................................................................................-40C to +100C Resistance to Soldering Heat..........................................................................................................................................................260C, 5 seconds Materials Core Material CM10, CM16.................................................................................................................................................................................Alumina Ceramic CM20 ..............................................................................................................................................................................Polymer 3.9nH to 1000nH CM25 .................................................................................................................................................................................Polymer 10nH to 180nH CM32 .................................................................................................................................................................................Polymer 47nH to 180nH Ferrite Core CM25..............................................................................................................................................................................................220nH to 100uH CM32 ..........................................................................................................................................................................................................220nH + CM45 ....................................................................................................................................................................................................................All Coil Type CM10, CM16 ....................................................................................................................................................................................Copper plating CM20, CM25, CM32, CM45 .................................................................................................................................................................Copper wire Enclosure CM10, CM16 ...................................................................................................................................................................................................Resin CM20, CM25, CM32, CM45 ..................................................................................................................................................................Epoxy resin Product Dimensions CM100505, CM160808 CM201212 CM10: CM10: 0.2 0.1 0.2 0.1 1.27 0.30 (.008 .004) (.008 .004) (.050 .012) CM16: CM16: 0.3 0.15 0.3 0.15 CM10: CM16: (.012 .006) (.012 .006) 0.5 0.1 0.80 0.15 1.00 0.10 (.020 .004) (.032 .006) (. 039 .004) CM10: CM16: CM10: 1.27 0.20 MM 0.5 0.1 0.80 0.15 1.0 0.1 (.050 .008) DIMENSIONS ARE: (.020 .004) (.032 .006) (.040 .004) (INCHES) CM16: 1.6 0.15 1.20 (.063 .006) (.047) 2.0 + 0.30 - 0.20 (.079 + .012 - .008) Marking Marking Marking CM252016 CM322522 CM453232 3.2 2.5 2.0 (.125) (.079) (.079) 1.2 1.2 1.9 (.047) (.047) 4.5 2.5 3.2 (.075) (.177) (.10) (.126) 1.6 2.2 3.2 0.2 (.063) (.086) (.125 .008) 1.7 0.2 0.4 0.6 (.066 .008) (.016) (.024) 1.0 1.0 (.039) (.039) Recommended Land Pattern Dimensions Model a b c CM10 0.5 to 0.6 (.019 to .023) 1.5 to 1.7 (.059 to .067) 0.5 to 0.6 (.019 to .023) c CM16 0.8 to 1.0 (.032 to .039) 2.0 to 2.6 (.079 to .102) 0.7 to 0.9 (.028 to .035) CM20 1.0 to 1.2 (.039 to .047) 3.0 to 3.8 (.118 to .150) 0.9 to 1.3 (.028 to .051) a CM25 1.4 to 1.5 (.055 to .059) 3.5 to 4.0 (.138 to .157) 1.2 to 1.6 (.047 to .063) b CM32 1.6 to 2.0 (.063 to .079) 4.0 to 4.6 (.157 to .181) 1.9 to 2.4 (.075 to .094) CM45 2.4 to 2.6 (.094 to .102) 5.5 to 6.0 (.217 to .236) 2.0 to 3.0 (.079 to .118) Specifications are subject to change without notice. 220KCM45, CM32, CM25, CM20, CM16, CM10 SMT Chip Inductors Packaging Specifications CM10, CM16, CM20, CM25, CM32 CM45 Do t1 P3 Do t1 P3 E E F F B W B W D1 DIA. P2 t2 P2 t2 Chip P1 A Chip P1 A Component Component Tape running direction Tape running direction Model A B W F E P1 P2 P3 D0 D1 t1 t2 CM10 0.71 (.027) 1.21 (.047) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 0.60 (.024) 0.27 (.011) 1.20 (.047) CM16 1.00 (.039) 1.80 (.071) 8.00(.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 0.60 (.024) 0.27 (.011) 1.20 (.047) CM20 1.45 (.057) 2.25 (.089) 8.00(.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 1.00 (.039) 0.25 (.010) 1.55 (.061) CM25 2.40 (.094) 2.90 (.114) 8.00(.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 1.10 (.043) 0.25 (.010) 1.85 (.073) CM32 2.80 (.110) 3.60 (.142) 8.00(.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 0.25 (.010) 2.40 (.094) CM45 3.60 (.142) 4.90 (.193) 12.00(.472) 5.50 (.217) 1.75 (.069) 8.00 (.315) 2.00 (.079) 4.00 (.157) 1.50 (.059) 0.30 (.012) 3.50 (.138) Reel Dimensions Model A B C D E W CM10 178 (7.008) 60 min. 13 (.512) 21 (.827) 2 (.079) 9 (.354) CM16 178 (7.008) 60 min. 13 (.512) 21 (.827) 2 (.079) 9 (.354) E CM20 178 (7.008) 60 min. 13 (.512) 21 (.827) 2 (.079) 9 (.354) C CM25 178 (7.008) 60 min. 13 (.512) 21 (.827) 2 (.079) 9 (.354) CM32 178 (7.008) 60 min. 13 (.512) 21 (.827) 2 (.079) 9 (.354) B CM45 178 (7.008) 60 min. 13 (.512) 21 (.827) 2 (.079) 13 (.512) D Packaging Model Quantity Weight Model Quantity Weight CM10 10000 pcs 150g CM25 2000 pcs 100g CM16 3000 pcs 90g CM32 2000 pcs 190g A W CM20 3000 pcs 90g CM45 500 pcs 100g Soldering Flow Soldering 260C maximum for 5 seconds (2 wave solder method) Infra-red 200C for a maximum of 30 seconds. Peak of 240C for a maximum of 5 seconds. If the solder does not reflow simultaneously under each terminal, there may be a misalignment of the component on the board. For this reason, it is recommended that the inductor be adhered to the board prior to reflow. Vapor-phase 215C for a maximum of 30 seconds. Flow Soldering Infra-red Soldering Vapor-phase Soldering 10 seconds max. 10 seconds max. 10 seconds max. 260C 220C 230C 215C 200C Preheat: Preheat: 100 to 150 100 to 150 30 seconds max. 30 seconds max. Preheat: 2 minutes 2 minutes 100 to 150 min. min. 2 minutes min. Specifications are subject to change without notice.