Model CMF-SD is currently available, Features although not recommended for new n Two resistance-matched PTCs in a designs. Model CMF-SDP is ceramic housing recommended. n Narrow resistance tolerance n RoHS compliant* CMF-SD Series - Telecom CPTC Resettable Fuses Electrical Characteristics Time to Rated Induction Resistance Trip Resistance Voltage Rated Matching in Hold Trip Imax Imax / 230 Model Withstand Voltage (RN) 25C Housing Current Current 230 VAC VAC VAC Volts Ohms Tolerance Ohms Amps 25 C Amps 25 C Amps Seconds CMF-SD10 600 220 10 20 % 1.0 0.150 0.360 1 <4.5 CMF-SD25 600 230 25 20 % 0.5 0.130 0.260 2.8 < 0.3 CMF-SD25-10 600 220 25 10 % 0.5 0.130 0.260 2.5 < 0.3 CMF-SD35 600 230 35 20 % 0.5 0.100 0.200 3 < 0.2 CMF-SD35-10 600 230 35 10 % 0.5 0.100 0.200 3 < 0.2 CMF-SD35A 600 230 35 20 % 0.5 0.100 0.200 2.5 < 0.2 CMF-SD35A-10 600 230 35 10 % 0.5 0.100 0.200 2.5 < 0.2 CMF-SD50 600 230 50 20 % 0.5 0.090 0.190 3 < 0.1 CMF-SD50-10 600 230 50 10 % 0.5 0.090 0.190 3 < 0.1 CMF-SD50A 600 230 50 20 % 0.5 0.090 0.190 3 < 0.1 CMF-SD50A-10 600 230 50 10 % 0.5 0.090 0.190 3 < 0.1 Test Procedures And Requirements For Model CMF-SD Series Primary Test Protection Test Condition Requirements Mains Power Contact - ITU-T K.20, K.21 .... None .............. 230 V rms, 10 ohms, 15 Min....................................................(Ri-Rf) / Ri < 10 % Power Induction - ITU-T K.20, K.21 ............ None .............. 600V rms, 600 ohms, 0.2 seconds, 10 cycles, every 1 Min....(Ri-Rf) / Ri < 10 % Power Induction - ITU-T K.20, K.21 ............ GDT................ 600 V rms, 600 ohms, 1 second, 10 cycles, every 1 Min.......(Ri-Rf) / Ri < 10 % Power Induction - ITU-T K.20, K.21 ............ GDT................ 600 V rms, 200 ohms, 1 second, 10 cycles, every 1 Min.......(Ri-Rf) / Ri < 10 % Lightning Surge - ITU-T K.20, K.21 ..................................... 10/700 s, 25 ohms, 1.0 kV, 10 Tests, every 1 Min................(Ri-Rf) / Ri < 10 % Lightning Surge ................................................................... 10/1000 s, 40 ohms, 1.0 kV, 30 Tests, every 3 Min...............(Ri-Rf) / Ri < 10 % Ri = R initial Rf = R final Typical Part Marking How to Order Represents total content. Layout may vary. CMF - SD 35 A -10 - 2 PART MANUFACTURER S Product Designator TRADEMARK IDENTIFICATION: 10 = CMF-SD10 Style 25 = CMF-SD25 SD = Surface Mount Dual Pkg. BI-WEEKLY 35 = CMF-SD35 356G DATE CODE: Rated Resistance (RN) 50 = CMF-SD50 WEEK 13-14 = G 10, 25, 35, 50 (25, 35, 50 Ohms) 35A = CMF-SD35A 50A = CMF-SD50A Reduced Footprint and Height YEAR CODE: 25K = CMF-SD25-10 Option* 6 = 2016 35K = CMF-SD35-10 Resistance Tolerance Option 50K = CMF-SD50-10 Blank = Standard (20 %) 35AK = CMF-SD35A-10 50AK = CMF-SD50A-10 -10 = 10 % Packaging Options - 2 = Tape & Reel *Reduced footprint and height option currently unavailable for Model CMF-SD25. *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. *RoHS COMPLIANT VERSIONS AVAILABLE *RoHS COMPLIANT LEAD FREE LEAD FREE VERSIONS ARE RoHS COMPLIANT*A A B H B H G F G F Applications Used as a secondary overcurrent protection device in: E n Customer Premise Equipment (CPE) n Central Office (CO) D E n Access equipment A C D C CMF-SD Series - Telecom CPTC Resettable Fuses B H B Product Dimensions Recommended Pad Layout G F B A CMF-SD10 1 CMF-SD25 CMF-SD35 2 CMF-SD35A 1 Dim. CMF-SD50 CMF-SD50A A 3 G 2 F 9.00 7.15 B A MAX. MAX. A 4 (.354) (.281) 3 G H F 10.80 8.50 D E B MAX. MAX. 4 C (.425) (.355) H G F D E 10.20 8.10 C C MAX. MAX. (.402) (.319) E H MM DIMENSIONS: 4.88 - 5.28 3.25 - 3.65 D (INCHES) D (.192 - .208) (.128 - .144) 0.15 C 1 2 COPLANARITY: 2.41 - 2.61 2.41 - 2.61 (.006) E (.095 - .103) (.095 - .103) (Reduced value available on request.) 1 2 0.5 0.5 F MAX. MAX. 3 (.020) (.020) 4 Packaging Options - Tape and Reel: CMF-SD10, CMF-SD25, CMF-SD35 & CMF-SD50 = 2.5 2.5 E G 3 4 400 pcs. per reel (.098) (.098) CMF-SD35A & CMF-SD50A = 500 pcs. per rB eel CMF-SD10 D 1.0 1.0 CMF-SD25 H (.039) (.039) CMF-SD35 CMF-SD35A C 1 Dim. CMF-SD50 CMF-SD50A Solder Reflow Recommendations 2 10.0 8.00 A (.394) (.315) A Preheating Soldering Cooling 3 G 300 8.80 7.05 F B (.346) (.278) 4 250 3.20 2.75 C D 200B E (.126) (.108) C 2.00 2.00 H D 150 (.079) (.079) 1 2.60 2.51 100 E 2 (.102) (.099) A 50 3 5.00 3.45 G F F (.197) (.136) 1 2 0 4 7.60 5.95 G 160220 1020 120 (.299) (.234) D E C 10.0 8.15 H 3 Time (seconds) 4 (.394) (.321) H Solder reflow MM DIMENSIONS: Recommended reflow methods: IR, vapor phase oven, hot air oven. (INCHES) Devices are not designed to be wave soldered to the bottom side of the board. 1 2 Gluing the devices is not recommended. Recommended maximum paste thickness is 0.25 mm (.010 inch). Devices can be cleaned using standard industry methods and solvents. 3 4 Note: If reflow temperatur es exceed the recommended profile, devices may not meet the performance requirements. Rework A device should not be reworked. CMF-SD SERIES, REV. P, 03/17 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Temperature (C)