Model CMF-SD is currently available, Features although not recommended for new Two resistance-matched PTCs in a designs. Model CMF-SDP is ceramic housing preferred. Narrow resistance tolerance RoHS compliant* CMF-SD Series - Telecom CPTC Resettable Fuses Electrical Characteristics Time to Rated Induction Resistance Trip Resistance Voltage Rated Matching in Hold Trip Imax Imax / 230 Model Withstand Voltage (RN) 25 C Housing Current Current 230 VAC VAC VAC Volts Ohms Tolerance Ohms Amps 25 C Amps 25 C Amps Seconds CMF-SD10 600 220 10 20 % 1.0 0.150 0.360 1 <4.5 CMF-SD25 600 230 25 20 % 0.5 0.130 0.260 2.8 < 0.3 CMF-SD25-10 600 220 25 10 % 0.5 0.130 0.260 2.5 < 0.3 CMF-SD35 600 230 35 20 % 0.5 0.100 0.200 3 < 0.2 CMF-SD35-10 600 230 35 10 % 0.5 0.100 0.200 3 < 0.2 CMF-SD35A 600 230 35 20 % 0.5 0.100 0.200 2.5 < 0.2 CMF-SD35A-10 600 230 35 10 % 0.5 0.100 0.200 2.5 < 0.2 CMF-SD50 600 230 50 20 % 0.5 0.090 0.190 3 < 0.1 CMF-SD50-10 600 230 50 10 % 0.5 0.090 0.190 3 < 0.1 CMF-SD50A 600 230 50 20 % 0.5 0.090 0.190 3 < 0.1 CMF-SD50A-10 600 230 50 10 % 0.5 0.090 0.190 3 < 0.1 Test Procedures And Requirements For Model CMF-SD Series Primary Test Protection Test Condition Requirements Mains Power Contact - ITU-T K.20, K.21 .... None .............. 230 V rms, 10 ohms, 15 Min....................................................(Ri-Rf) / Ri < 10 % Power Induction - ITU-T K.20, K.21 ............ None .............. 600V rms, 600 ohms, 0.2 seconds, 10 cycles, every 1 Min....(Ri-Rf) / Ri < 10 % Power Induction - ITU-T K.20, K.21 ............ GDT................ 600 V rms, 600 ohms, 1 second, 10 cycles, every 1 Min.......(Ri-Rf) / Ri < 10 % Power Induction - ITU-T K.20, K.21 ............ GDT................ 600 V rms, 200 ohms, 1 second, 10 cycles, every 1 Min.......(Ri-Rf) / Ri < 10 % Lightning Surge - ITU-T K.20, K.21 ..................................... 10/700 s, 25 ohms, 1.0 kV, 10 Tests, every 1 Min................(Ri-Rf) / Ri < 10 % Lightning Surge ................................................................... 10/1000 s, 40 ohms, 1.0 kV, 30 Tests, every 3 Min...............(Ri-Rf) / Ri < 10 % Ri = R initial Rf = R nal Typical Part Marking How to Order Represents total content. Layout may vary. CMF - SD 35 A -10 - 2 PART MANUFACTURER S Product Designator TRADEMARK IDENTIFICATION: Style 10 = CMF-SD10 SD = Surface Mount Dual Pkg. 25 = CMF-SD25 BI-WEEKLY 35 = CMF-SD35 356G Rated Resistance (RN) DATE CODE: 50 = CMF-SD50 10, 25, 35, 50 (25, 35, 50 Ohms) WEEK 13-14 = G 35A = CMF-SD35A Reduced Footprint and Height 50A = CMF-SD50A YEAR CODE: 25K = CMF-SD25-10 Option* 6 = 2006 35K = CMF-SD35-10 Resistance Tolerance Option 50K = CMF-SD50-10 Blank = Standard (20 %) 35AK = CMF-SD35A-10 -10 = 10 % 50AK = CMF-SD50A-10 50AL = CMF-SD50A-15 Packaging Options - 2 = Tape & Reel *Reduced footprint and height option currently unavailable for Model CMF-SD25. *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Speci cations are subject to change without notice. Customers should verify actual device performance in their speci c applications. *RoHS COMPLIANTApplications Used as a secondary overcurrent protection device in: Customer Premise Equipment (CPE) Central Of ce (CO) Access equipment CMF-SD Series - Telecom CPTC Resettable Fuses Product Dimensions Recommended Pad Layout B A CMF-SD10 CMF-SD25 CMF-SD35 CMF-SD35A 1 Dim. CMF-SD50 CMF-SD50A 2 9.00 7.15 B A MAX. MAX. (.354) (.281) A 3 G H F 10.80 8.50 B MAX. MAX. (.425) (.355) 4 10.20 8.10 G F D E C MAX. MAX. C (.402) (.319) E H 4.88 - 5.28 3.25 - 3.65 MM D DIMENSIONS: (.192 - .208) (.128 - .144) D (INCHES) 2.41 - 2.61 2.41 - 2.61 0.15 C 1 2 E COPLANARITY: (.095 - .103) (.095 - .103) (.006) (Reduced value available on request.) 0.5 0.5 F MAX. MAX. (.020) (.020) 3 4 Packaging Options - Tape and Reel: 2.5 2.5 G (.098) (.098) CMF-SD10, CMF-SD25, CMF-SD35 & CMF-SD50 = 400 pcs. per reel 1.0 1.0 CMF-SD35A & CMF-SD50A = 500 pcs. per reel H CMF-SD10 (.039) (.039) CMF-SD25 CMF-SD35 CMF-SD35A Dim. CMF-SD50 CMF-SD50A Solder Re ow Recommendations 10.0 8.00 A (.394) (.315) Preheating Soldering Cooling 300 8.80 7.05 B (.346) (.278) 250 3.20 2.75 C (.126) (.108) 200 2.00 2.00 D (.079) (.079) 150 2.60 2.51 E (.102) (.099) 100 5.00 3.45 F 50 (.197) (.136) 7.60 5.95 0 G (.299) (.234) 160220 1020 120 10.0 8.15 H (.394) (.321) Time (seconds) MM DIMENSIONS: Solder re ow (INCHES) Recommended re ow methods: IR, vapor phase oven, hot air oven. Devices are not designed to be wave soldered to the bottom side of the board. Gluing the devices is not recommended. Recommended maximum paste thickness is 0.25 mm (.010 inch). Devices can be cleaned using standard industry methods and solvents. Note: If re ow temperatures exceed the recommended pro le, devices may not meet the performance requirements. Rework A device should not be reworked. CMF-SD SERIES, REV. O, 05/10 Speci cations are subject to change without notice. Customers should verify actual device performance in their speci c applications. Temperature (C)