CR0402-FX-2703GPF Bourns

102 Features Applications n Ultra-low lead (Pb) content* n General purpose n Green technology n Consumer n High reliability and stability n Industrial n Thick film paste on high grade ceramic n Telecommunications substrate n Computer technology n RoHS compliant** without exemptions n Halogen free*** CR-PF Series Ultra-Low Lead Content Thick Film Resistor Electrical Characteristics Model Characteristic CR0402-PF CR0603-PF CR0805-PF CR1206-PF Power Rating 70 C 0.0625 W 0.10 W 0.125 W 0.25 W Operating Temperature Range -55 C to +155 C Derated to Zero Load at +155 C Maximum Working Voltage 50 V 75 V 150 V 200 V Maximum Overload Voltage 100 V 150 V 300 V 400 V 1 W R 9.76 W 1 W R 9.76 W -200 to +500 PPM/C 400 PPM/C 10 W R < 100 W 10 W R 1 MW Resistance Range 200 PPM/C 100 PPM/C (1 %, E24 + E96 Series) 100 W R 1 MW -- -- -- 100 PPM/C 1 MW < R 10 MW 200 PPM/C 1 W R 9.1 W 1 W R 9.1 W Resistance Range -200 to +500 PPM/C 400 PPM/C (5 %, E24 Series) 10 W R 10 MW 200 PPM/C Zero Ohm Jumper 0.05 W 1 A / 2.5 A 2 A / 5 A Rated/Maximum Current For Standard Values Used in Capacitors, Inductors and Resistors, click here. Product Dimensions L Model L W C d t RESISTOR 1.00 0.10 0.50 0.05 0.20 0.10 0.25 0.10 0.32 0.05 CR0402-PF c (0.039 0.004) (0.020 0.002) (0.008 0.004) (0.010 0.004) (0.013 0.002) 1.60 0.10 0.80 0.05 0.30 0.20 0.30 0.20 0.45 0.10 W CR0603-PF (0.063 0.004) (0.031 0.002) (0.012 0.008) (0.012 0.008) (0.018 0.04) a 2.00 0.10 1.25 0.10 0.40 0.20 0.40 0.20 0.50 0.10 CR0805-PF b (0.079 0.004) (0.049 0.004) (0.016 0.008) (0.016 0.008) (0.020 0.004) CC t 3.10 0.10 1.55 0.10 0.50 0.30 0.40 0.20 0.55 0.10 CR1206-PF (0.122 0.004) (0.061 0.004) (0.020 0.012) (0.016 0.008) (0.022 0.004) MM DIMENSIONS: (INCHES) dd Recommended Solder Pad Layout L Model a b c RESISTOR c 0.5 ~ 0.6 1.4 ~ 1.6 0.4 ~ 0.6 CR0402-PF (0.020 ~ 0.024) (0.055 ~ 0.063) (0.016 ~ 0.024) W 0.7 ~ 0.9 2.0 ~ 2.2 0.8 ~ 1.0 CR0603-PF a (0.028 ~ 0.035) (0.079 ~ 0.087) (0.031 ~ 0.039) b 1.0 ~ 1.4 3.2 ~ 3.8 0.9 ~ 1.4 CR0805-PF (0.039 ~ 0.055) (0.126 ~ 0.150) (0.035 ~ 0.055) CC t MM DIMENSIONS: 2.0 ~ 2.4 4.4 ~ 5.0 1.2 ~ 1.8 (INCHES) CR1206-PF (0.079 ~ 0.094) (0.173 ~ 0.197) (0.047 ~ 0.071) dd *** Bourns considers a product to be halogen free if (a) the Bromine (Br) content is 900 ppm or less (b) the Chlorine (Cl) content is 900 ppm or less (c) the total Bromine (Br) & Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. WARNING Cancer and Reproductive Harm Users should verify actual device performance in their specific applications. www.P65Warnings.ca.gov The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of * Such products may contain trace amounts of lead of less than 100 ppm. this document, and at www.bourns.com/docs/legal/disclaimer.pdf. ** RoHS Directive 2015/863, Mar 31, 2015 and Annex. RoHS COMPLIANT** & HALOGEN FREE*** *RoHS COMPLIANT LEAD FREE LEAD FREE VERSIONS ARE RoHS COMPLIANT*CR-PF Series Ultra-Low Lead Content Thick Film Resistor Environmental Characteristics Construction OVERCOAT Moisture Sensitivity Level .................................................. 1 (BLACK) CONDUCTOR Storage Conditions Sn PLATING Temperature ...........................................+5 C ~ +35 C Humidity .................................................... 40 % ~ 75 % Shelf Life .......................... 2 years from manufacturing date Solder Recommendations ..............................Reflow profile RESISTIVE Ni PLATING (Solder: Sn96.5 / Ag3 / Cu05) ELEMENT CERAMIC SUBSTRATE Derating Curve 70 Rated Voltage 100 The rated voltage is calculated by the following formula: 80 V= P X R V: Rated Voltage (V) 60 P: Rated Power (W) R: Resistance Value (W) 40 155 20 0 -55 20 40 60 80 100 120 140 160 Ambient Temperature (C) Solder Reflow Recommendations t p Solder Profile Lead Free Assembly T P CRITICAL ZONE RAMP-UP Average ramp-up rate TTO T L P 3 C / second max. (T to T ) T smax p L t L Preheat: T MAX. S - Temperature Min. (T ) 150 C smin RAMP-DOWN - Temperature Max. (T ) 200 C smax - Time (T to T ) (t ) 60~150 seconds T MIN. smin smax s S t s PREHEAT Time maintained above: - Temperature (T ) 25 C L 217 C - Time (T ) L 8 MINUTES MAX. t 25 *C TO PEAK 60~120 seconds Peak Temperature (T ) 260 C Time p Time within +0/-5 C of actual 10 seconds 2 Peak Temperature (T ) p Ramp-down rate 6 C / second max. Time 25 C to Peak 8 minutes max. Temperature Inspect solder joint to determine if solder joint is PPrroocceessss TTiimmee MMaatteerriiaallss TTeemmppeerraattuurree acceptable (i.e. exhibits wetting of joints surface). DDeessccrriippttiioonn IInntteerrvvaall Use the following criteria (ref. acceptability of printed 1. Apply solder paste to Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature board assemblies, IPC-A-610): test board (8 - 10 mil thick) Alloy water soluble or no A) Acceptable (see Figure 1) clean solder paste (see note 1) (1) The solder connection wetting angle (solder to single sided epoxy glass component and solder to PCB termination) (G10) (UL approved) Specifications are subject to change without notice. does not exceed 90 . PC board approx. 4x4x.06 in. Users should verify actual device performance in their specific applications. (2) Solder balls that do not violate minimum The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. 2. Place test units onto board 6 units/board electrical clearances and are attached (soldered) to a metal surface. 3. Ramp up Convection oven (see note 2) 2.5 C 0.5 /sec. B) Unacceptable (see Figure 2) 4. Preheat (T ) 150 C to 190 C 90 30 sec. S (1) Solder connection wetting angle exceeding 5. Time above liquidus (T ) 220 C 60-90 sec. L 90 . 6. Peak temperature (T ) 250 C +0 /-5 P (2) Incomplete reflow of solder paste. 10-20 sec. within 5 C of peak (3) Dewetting. 7. Ramp down Room temperature 3 C 0.5 C/sec. If unacceptable, determine cause and correct prior to (see note 2) next run. 8. Cleaning water clean profile High pressure deionized 72 F to 160 F As required NOTES: water 65 PSI max. (22 C to 71 C) 1. Water soluble solder paste only above 100K. 2. Refer to ref. temperature profile. Temperature at lead/pad junction with K type thermocouple. Temperature of Lead/Pad Junction 3. Units that are board mounted for environmental testing must see a peak temperature in the reflow (Derived using 6-zone Convection Oven) zone, as specified. This is to ensure that all test units will see worst case conditions. 4. Ramp down rate to be measured from 245 C to 150 C. 5. Process Description 8 does not apply to open frame trimmers. Temperature Power Ratio (%)