CW100505-22NJ3 Bourns

Features Applications 0402 miniature size RF modules Ceramic core provides stable electrical Cellular phones characteristics GPS receivers High Q Wireless PDAs, LANs High self-resonant frequency CATV lters, tuners Flat top surface for automated assembly Cable modems, set-top boxes RoHS compliant* and halogen free** CW100505 Series High Q Ceramic Chip Inductors Electrical Speci cations General Speci cations Operating Temperature Test Freq. SRF DCR Irms ................................-55 C to +125 C Inductance Q (MHz) (MHz) (Ohms) (mA) Bourns Part No. (Temperature rise included) Storage Temperature L (nH) Tol. Min. L / Q Min. Max...............................-55 C to +125 C CW100505-1N0D 1.0 0.3 nH 13 250 6000 0.045 1360 Resistance to Soldering Heat CW100505-2N2D 2.2 0.3 nH 18 250 6000 0.070 960 .......................... +260 C, 5 sec. max. CW100505-2N7D 2.7 0.3 nH 16 250 6000 0.120 640 Temperature Rise .....15 C at rated Irms CW100505-3N3J 3.3 5 % 20 250 6000 0.066 840 Materials CW100505-3N9J 3.9 5 % 20 250 5800 0.066 840 CW100505-4N7J 4.7 5 % 15 250 4775 0.130 640 Core ...........................................Ceramic CW100505-5N6J 5.6 5 % 23 250 5800 0.083 760 Wire ............Enameled copper (Class H) Terminal ........................... Mo/Mn+Ni+Au CW100505-6N8J 6.8 5 % 20 250 4800 0.083 680 Packaging .... 10,000 pcs. per 7-inch reel CW100505-8N2J 8.2 5 % 25 250 4400 0.104 680 CW100505-10NJ 10.0 5 % 23 250 3900 0.195 480 Product Dimensions CW100505-12NJ 12.0 5 % 26 250 3600 0.120 640 CW100505-15NJ 15.0 5 % 26 250 3280 0.172 560 0.50 0.1 0.30 (.020 .004) (.012) CW100505-18NJ 18.0 5 % 25 250 3100 0.230 420 CW100505-22NJ 22.0 5 % 25 250 2800 0.300 400 CW100505-27NJ 27.0 5 % 26 250 2480 0.298 400 CW100505-33NJ 33.0 5 % 24 250 2350 0.350 400 CW100505-39NJ 39.0 5 % 25 250 2100 0.550 320 CW100505-47NJ 47.0 5 % 26 200 2100 0.830 210 CW100505-56NJ 56.0 5 % 22 200 1760 0.970 200 1.00 0.1 (.039 .004) CW100505-68NJ 68.0 5 % 22 200 1620 1.120 180 CW100505-82NJ 82.0 5 % 20 150 1500 1.250 150 CW100505-R10J 100.0 5 % 20 150 1300 2.520 120 0.55 0.1 (.022 .004) CW100505-R12J 120.0 5 % 20 150 1100 2.660 110 Soldering Pro le 0.20 0.20 (.008) (.008) Temperature Rising Preheat Reflow Forced Cooling 0.50 Area Area Area Area - - - (.020) 20~ 4 C/ 40 C/ 150~200 C / 60~120 Sec. -1~5 C/Sec. Max. Sec. Sec. Recommended Layout Max. Max. PEAK TEMP. 0.50 0.50 260 C 250 (.020) (.020) 230 C - 50 SECONDS MAX. 200 150 0.40 70 SECONDS MAX.- 0.40 (.016) (.016) 100 MM DIMENSIONS: (INCHES) 50 Schematic 0 50 100 150 200 250 Time (Seconds) *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. ** Bourns follows the prevailing de nition of halogen free in the industry. Bourns considers a product to be halogen free if (a) the Bromine (Br) content is 900 ppm or less (b) the Chlorine (Cl) content is 900 ppm or less and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Speci cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their speci c applications. *RoHS COMPLIANT Temperature (C) CW100505 Series High Q Ceramic Chip Inductors L vs. Frequency Q vs. Frequency 100 120 100 80 80 60 -5N6J -27NJ 60 -12NJ 40 -27NJ -1N0D 40 20 -12NJ 20 -5N6J -1N0D 0 1 10 100 1000 10000 0 1 10 100 1000 10000 Frequency (MHz) Frequency (MHz) Packaging Speci cations 178 2.0 0.5 DIA. 12.5 (7.008) (.079 .020) (.492) 13.0 21.0 0.8 (.512) (.827 .031) DIA. 50.0 -0 (1.969 -0) 13.0 DIA. (.512) 10.0 +0 (.394 +0) 2 4 (.079) (.157) END START NO COMPONENT NO COMPONENT 200 400 COMPONENTS (7.874) (15.748) MIN. MIN. MM USER DIRECTION OF FEED DIMENSIONS: (INCHES) 10,000 PCS. PER REEL Asia-Paci c: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com REV. 08/13 Speci cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their speci c applications. L (nH) Q (nH)